公开(公告)号：US09583456B2

公开(公告)日：2017-02-28

申请号：US14841381

申请日：2015-08-31

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L25/065 ,  H01L25/16 ,  H01L25/00

CPC classification number: H01L25/0657 ,  B81B7/0074 ,  H01L21/4853 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/522 ,  H01L23/5383 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2224/0239 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/73201 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/81 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099

Abstract: Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

Abstract translation: 公开了一般涉及衬底的装置。 在这种装置中，第一线接合线（“第一线”）从衬底的表面延伸。 第二线接合线（“第二线”）从衬底的表面延伸。 第一线和第二线在衬底外部。 第一导线至少部分地设置在第二导线内。 第一根导线是第一个高度。 第二导线的第二高度大于第一高度，用于将至少一个电子部件耦合到至少部分地设置在第二导线内的第一导线。

公开(公告)号：US20160365295A1

公开(公告)日：2016-12-15

申请号：US15149207

申请日：2016-05-09

Applicant: Infineon Technologies AG

Inventor： Juergen HOEGERL ,  Edward FUERGUT

IPC: H01L23/31 ,  H01L23/04 ,  H01L23/10 ,  H01L21/56 ,  H01L23/492

CPC classification number: H01L23/31 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/04 ,  H01L23/10 ,  H01L23/142 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/492 ,  H01L23/4924 ,  H01L23/4928 ,  H01L23/49562 ,  H01L23/49877 ,  H01L23/5386 ,  H01L23/544 ,  H01L24/06 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/48 ,  H01L24/50 ,  H01L24/66 ,  H01L24/69 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/86 ,  H01L24/89 ,  H01L24/92 ,  H01L24/97 ,  H01L29/7393 ,  H01L29/868 ,  H01L2223/54486 ,  H01L2224/04026 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48137 ,  H01L2224/73201 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73219 ,  H01L2224/73251 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/92142 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2224/92148 ,  H01L2224/92242 ,  H01L2224/92244 ,  H01L2224/92248 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/1016 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15162 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2224/32 ,  H01L2224/69 ,  H01L2224/89 ,  H01L2224/82 ,  H01L2224/86 ,  H01L2224/45099

Abstract: A semiconductor arrangement is provided. The semiconductor arrangement may include an electrically conductive plate having a surface, a plurality of power semiconductor devices arranged on the surface of the electrically conductive plate, wherein a first controlled terminal of each power semiconductor device of the plurality of power semiconductor devices may be electrically coupled to the electrically conductive plate, a plurality of electrically conductive blocks, wherein each electrically conductive block may be electrically coupled with a respective second controlled terminal of each power semiconductor device of the plurality of power semiconductor devices; and encapsulation material encapsulating the plurality of power semiconductor devices, wherein at least one edge region of the surface of the electrically conductive plate may be free from the encapsulation material.

Abstract translation: 提供了半导体布置。 半导体布置可以包括具有表面的导电板，布置在导电板的表面上的多个功率半导体器件，其中多个功率半导体器件中的每个功率半导体器件的第一受控端可以电耦合 导电板，多个导电块，其中每个导电块可以与多个功率半导体器件中的每个功率半导体器件的相应的第二受控端电耦合; 以及封装所述多个功率半导体器件的封装材料，其中所述导电板的表面的至少一个边缘区域可以不含所述封装材料。

公开(公告)号：US09293430B2

公开(公告)日：2016-03-22

申请号：US14717606

申请日：2015-05-20

Applicant: Semiconductor Manufacturing International (Shanghai) Corporation

Inventor： Fucheng Chen

IPC: H01L23/52 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/06 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02175 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0381 ,  H01L2224/03831 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05558 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/05681 ,  H01L2224/05687 ,  H01L2224/06051 ,  H01L2224/061 ,  H01L2224/06505 ,  H01L2224/08058 ,  H01L2224/08111 ,  H01L2224/08145 ,  H01L2224/10145 ,  H01L2224/1148 ,  H01L2224/1181 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/27831 ,  H01L2224/29187 ,  H01L2224/32145 ,  H01L2224/73101 ,  H01L2224/73104 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80011 ,  H01L2224/80012 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81895 ,  H01L2224/81948 ,  H01L2224/83011 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83896 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06593 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/059 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/08 ,  H01L2224/16 ,  H01L2224/80 ,  H01L2924/00

Abstract: A chip includes a substrate and a dielectric layer disposed on the substrate. The dielectric layer includes a first dielectric region and a second dielectric region surrounding an outer periphery of the first dielectric region. A top surface of the first dielectric region is disposed below a top surface of the second dielectric region. The chip further includes a metal pad disposed in a through-hole in the first dielectric region and contacting a portion of the substrate.

Abstract translation: 芯片包括衬底和设置在衬底上的电介质层。 电介质层包括第一电介质区域和围绕第一电介质区域的外围的第二电介质区域。 第一电介质区域的顶表面设置在第二电介质区域的顶表面下方。 芯片还包括设置在第一电介质区域中的通孔中并与衬底的一部分接触的金属焊盘。

公开(公告)号：US09263394B2

公开(公告)日：2016-02-16

申请号：US14087252

申请日：2013-11-22

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/31111 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/89 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02317 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/08146 ,  H01L2224/0823 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4805 ,  H01L2224/48108 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/49426 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/81 ,  H01L2224/45616 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099

Abstract: An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

Abstract translation: 公开了一般涉及基板的装置。 在这种装置中，第一接合通孔阵列具有从衬底的表面延伸的第一线。 第二结合通孔阵列具有从衬底的表面延伸的第二线。 通过阵列的第一结合通过阵列至少部分地设置在第二结合内。 第一结合通孔阵列的第一条导线具有第一高度。 第二接合通孔阵列的第二线具有大于用于将至少一个管芯耦合至第一接合的第一高度的第二高度，该阵列至少部分地设置在第二接合通孔阵列内。

公开(公告)号：US20150360158A1

公开(公告)日：2015-12-17

申请号：US14000981

申请日：2013-02-14

Applicant: Todd MENKHAUS ,  Hao FONG ,  NANOPAREIL, LLC

Inventor： Todd MENKHAUS ,  Hao FONG

IPC: B01D39/16 ,  D01D5/00

CPC classification number: B01D39/1615 ,  B01D15/327 ,  B01D15/361 ,  B01D15/3804 ,  B01D15/3809 ,  B01D39/1623 ,  B01D39/1676 ,  B01D2239/025 ,  B01D2239/0414 ,  B01J20/24 ,  B01J20/28007 ,  B01J20/28038 ,  B01J20/3212 ,  B01J20/3217 ,  B01J20/3248 ,  B01J20/3293 ,  C07K1/22 ,  D01D5/0007 ,  D01D5/003 ,  D01F2/24 ,  D01F6/44 ,  D01F6/88 ,  H01L23/48 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73201 ,  H01L2224/81138 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/81 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention relates generally to compositions for use in biological and chemical separations, as well as other applications. More specifically, the present invention relates to hybrid felts fabricated from electrospun nanofibers with high permeance and high capacity. Such hybrid felts utilize derivatized cellulose, and at least one non-cellulose-based polymer that may be removed from the felt by subjecting it to moderately elevated temperatures and/or solvents capable of dissolving the non-cellulose-based polymer to leave behind a porous nanofiber felt having more uniform pore sizes and other enhanced properties when compared to single component nanofiber felts.

Abstract translation: 本发明一般涉及用于生物和化学分离以及其它应用的组合物。 更具体地说，本发明涉及由具有高渗透性和高容量的电纺丝纳米纤维制成的混合毡。 这样的混合毛毡使用衍生的纤维素和至少一种非纤维素基聚合物，其可以通过使其适度升高的温度和/或能够溶解非纤维素基聚合物的溶剂留在多孔 与单组分纳米纤维毡相比，纳米纤维毡具有更均匀的孔径和其它增强的性能。

公开(公告)号：US20120295058A1

公开(公告)日：2012-11-22

申请号：US13474532

申请日：2012-05-17

Applicant: Timothy J. Brosnihan ,  Mark B. Andersson ,  Eugene E. Fike, III ,  Joyce Wu ,  J. Lodewyk Steyn

Inventor： Timothy J. Brosnihan ,  Mark B. Andersson ,  Eugene E. Fike, III ,  Joyce Wu ,  J. Lodewyk Steyn

IPC: G02B26/02 ,  B32B3/22 ,  C23C16/56 ,  G02B5/22

CPC classification number: G02B26/02 ,  B81B7/0067 ,  B81B2201/038 ,  B81B2201/047 ,  B81C1/00 ,  B81C1/00039 ,  B81C1/00261 ,  B81C2203/054 ,  G09G3/3413 ,  G09G3/3433 ,  G09G3/3466 ,  G09G2320/041 ,  G09G2360/144 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/2612 ,  H01L2224/29011 ,  H01L2224/32238 ,  H01L2224/73201 ,  H01L2224/81121 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83007 ,  H01L2224/83121 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15788 ,  Y10T428/24157 ,  Y10T428/24744 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A display apparatus includes a first substrate, a plurality of microelectromechanical systems (MEMS) light modulators formed from a structural material coupled to the first substrate and a second substrate separated from the first substrate. A plurality of spacers extend from the first substrate to keep the second substrate a minimum distance away from the plurality of light modulators. The spacers include a first polymer layer having a surface in contact with the first substrate, a second polymer layer encapsulating the first polymer layer and a layer of the structural material encapsulating the second polymer layer. The spacers can be used as fluid barriers and configured to surround more than one but less than all of the MEMS light modulators in the display apparatus.

Abstract translation: 显示装置包括第一基板，由耦合到第一基板的结构材料形成的多个微机电系统（MEMS）光调制器和与第一基板分离的第二基板。 多个间隔件从第一基板延伸以使第二基板保持离开多个光调制器的最小距离。 间隔物包括具有与第一基底接触的表面的第一聚合物层，包封第一聚合物层的第二聚合物层和包封第二聚合物层的结构材料层。 间隔件可以用作流体屏障并且被配置为围绕显示装置中的多于一个但是不到所有的MEMS光调制器。

公开(公告)号：US20110186978A1

公开(公告)日：2011-08-04

申请号：US12794324

申请日：2010-06-04

Applicant: Si Han Kim ,  Myung Geun Park

Inventor： Si Han Kim ,  Myung Geun Park

IPC: H01L23/522

CPC classification number: H01L29/92 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/0805 ,  H01L28/40 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05548 ,  H01L2224/06188 ,  H01L2224/08147 ,  H01L2224/08148 ,  H01L2224/08195 ,  H01L2224/08265 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/171 ,  H01L2224/291 ,  H01L2224/32105 ,  H01L2224/32237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73201 ,  H01L2224/73207 ,  H01L2224/73251 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/10 ,  H01L2224/48

Abstract: A stack package includes a first semiconductor chip first pads and second pads disposed thereon and a second semiconductor chip having third pads and fourth pads electrically connected with the second pads disposed thereon. Capacitors are interposed between the first semiconductor chip and the second semiconductor chip, and include first electrodes electrically connected with the first pads to of the first semiconductor chip, second electrodes electrically connected with the third pads of the second semiconductor chip, and dielectrics interposed between the first electrodes and the second electrodes.

Abstract translation: 堆叠封装包括第一半导体芯片第一焊盘和设置在其上的第二焊盘，以及具有第三焊盘的第二半导体芯片和与其上设置的第二焊盘电连接的第四焊盘。 电容器介于第一半导体芯片和第二半导体芯片之间，并且包括与第一半导体芯片的第一焊盘电连接的第一电极，与第二半导体芯片的第三焊盘电连接的第二电极， 第一电极和第二电极。