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    Solder-bearing contacts and method of manufacture thereof and use in connectors
    35.
    发明授权
    Solder-bearing contacts and method of manufacture thereof and use in connectors 有权
    焊接接点及其制造方法，用于连接器

    公开(公告)号：US07537498B2

    公开(公告)日：2009-05-26

    申请号：US11981927

    申请日：2007-10-31

    Applicant: Joseph Cachina ,  James Zanolli ,  Jack Seidler

    Inventor： Joseph Cachina ,  James Zanolli ,  Jack Seidler

    IPC: H01R4/02

    CPC classification number: H05K3/3426 ,  H05K2201/10916 ,  H05K2201/10984 ,  Y02P70/613

    Abstract: In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.

    Abstract translation: 在一个方面，提供表面安装触点用于附接到电路板等。 触点包括细长的导电销，其具有第一端和相对的第二端。 预成型的热可再流动材料附接到销的一端，并且导电定位器构件围绕销在其第一和第二端之间并且邻近导电定位构件的位置。 在一个实施例中，定位器构件为圆柱形环的形式，围绕销延伸。

    Solder-bearing contacts and method of manufacture thereof and use in connectors
    36.
    发明申请
    Solder-bearing contacts and method of manufacture thereof and use in connectors 有权
    焊接接点及其制造方法，用于连接器

    公开(公告)号：US20080070453A1

    公开(公告)日：2008-03-20

    申请号：US11981927

    申请日：2007-10-31

    Applicant: Joseph Cachina ,  James Zanolli ,  Jack Seidler

    Inventor： Joseph Cachina ,  James Zanolli ,  Jack Seidler

    IPC: H01R4/02 ,  H01L23/488

    CPC classification number: H05K3/3426 ,  H05K2201/10916 ,  H05K2201/10984 ,  Y02P70/613

    Abstract: In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.

    Abstract translation: 在一个方面，提供表面安装触点用于附接到电路板等。 触点包括细长的导电销，其具有第一端和相对的第二端。 预成型的热可再流动材料附接到销的一端，并且导电定位器构件围绕销在其第一和第二端之间并且邻近导电定位构件的位置。 在一个实施例中，定位器构件为圆柱形环的形式，围绕销延伸。

    Vehicular lamp
    37.
    发明授权
    Vehicular lamp 失效
    车灯

    公开(公告)号：US07290911B2

    公开(公告)日：2007-11-06

    申请号：US11112169

    申请日：2005-04-22

    Applicant: Hironori Tsukamoto ,  Kaoru Yamamoto

    Inventor： Hironori Tsukamoto ,  Kaoru Yamamoto

    IPC: F21S8/10

    CPC classification number: H05K3/326 ,  F21S43/14 ,  F21S43/195 ,  F21V21/002 ,  F21Y2115/10 ,  H05K1/189 ,  H05K3/0064 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10598 ,  H05K2201/10916 ,  H05K2203/1189

    Abstract: A vehicular lamp including a luminescent element module made of a flexible parallel wiring body, which is made of a plurality of flexible wiring conductors that are disposed parallel to each other and sheathed by soft plastic, and a plurality of light-emitting diodes, which are mounted on the flexible parallel wiring body, so that the luminescent element module has a conductive path formed by notching a part of the wiring conductors of the flexible parallel wiring body and/or by connecting a plurality of the wiring conductors together, and the luminescent element module is provided on the lamp body so that the light-emitting diode faces in the direction of radiation of the vehicular lamp.

    Abstract translation: 一种车灯，包括由柔性平行布线体构成的发光元件模块，该发光元件模块由彼此平行并且由软塑料包覆的多个柔性布线导体和多个发光二极管组成， 安装在柔性平行布线体上，使得发光元件模块具有通过使柔性平行布线体的布线导体的一部分切口形成的导电路径和/或通过将多个布线导体连接在一起而形成的发光元件 模块设置在灯体上，使得发光二极管面向车灯的辐射方向。

    Vehicular lamp
    39.
    发明申请
    Vehicular lamp 失效
    车灯

    公开(公告)号：US20050237760A1

    公开(公告)日：2005-10-27

    申请号：US11112169

    申请日：2005-04-22

    Applicant: Hironori Tsukamoto ,  Kaoru Yamamoto

    Inventor： Hironori Tsukamoto ,  Kaoru Yamamoto

    IPC: F21V19/00 ,  F21S8/10 ,  F21V21/002 ,  F21V23/00 ,  F21W101/00 ,  F21Y101/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

    CPC classification number: H05K3/326 ,  F21S43/14 ,  F21S43/195 ,  F21V21/002 ,  F21Y2115/10 ,  H05K1/189 ,  H05K3/0064 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10598 ,  H05K2201/10916 ,  H05K2203/1189

    Abstract: A vehicular lamp including a luminescent element module made of a flexible parallel wiring body, which is made of a plurality of flexible wiring conductors that are disposed parallel to each other and sheathed by soft plastic, and a plurality of light-emitting diodes, which are mounted on the flexible parallel wiring body, so that the luminescent element module has a conductive path formed by notching a part of the wiring conductors of the flexible parallel wiring body and/or by connecting a plurality of the wiring conductors together, and the luminescent element module is provided on the lamp body so that the light-emitting diode faces in the direction of radiation of the vehicular lamp.

    Abstract translation: 一种车灯，包括由柔性平行布线体构成的发光元件模块，该发光元件模块由彼此平行并且由软塑料包覆的多个柔性布线导体和多个发光二极管组成， 安装在柔性平行布线体上，使得发光元件模块具有通过使柔性平行布线体的布线导体的一部分切口形成的导电路径和/或通过将多个布线导体连接在一起而形成的发光元件 模块设置在灯体上，使得发光二极管面向车灯的辐射方向。

    Circuit board
    40.
    发明授权
    Circuit board 失效
    电路板

    公开(公告)号：US06617520B1

    公开(公告)日：2003-09-09

    申请号：US09650824

    申请日：2000-08-30

    Applicant: Robert H. Martter ,  Craig C. Sundberg ,  Richard N. Giardina ,  Brian S. Fetscher ,  G. James Deutschlander

    Inventor： Robert H. Martter ,  Craig C. Sundberg ,  Richard N. Giardina ,  Brian S. Fetscher ,  G. James Deutschlander

    IPC: H05K103

    CPC classification number: H05K3/3447 ,  H05K1/053 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/10916 ,  Y10T29/49165

    Abstract: A circuit device and a method for providing an interface between a circuit device comprised of a porcelain enameled metal substrate and an external electrical conductor such as a wire or a lead. An aperture is formed in the substrate at the location where the connection is desired. An eyelet is then placed in the aperture. Crimping or other means are used to form a mechanical connection to the substrate and causes the eyelet to be retained in the aperture. The wire or lead of an electronic component is then inserted into the eyelet. The wire or lead is then soldered to the eyelet providing a joint of high mechanical strength.

    Abstract translation: 一种电路器件和用于在由瓷漆包金属基底和外部电导体（例如导线或引线）组成的电路器件之间提供界面的方法。 在需要连接的位置处在基板中形成孔。 然后将孔眼放置在孔中。 使用压接或其它装置来形成与基板的机械连接，并使孔眼保持在孔中。 然后将电子元件的导线或引线插入孔眼中。 然后将导线或引线焊接到孔眼，提供高机械强度的接头。

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