公开(公告)号：US09699928B2

公开(公告)日：2017-07-04

申请号：US14370516

申请日：2013-01-04

Applicant: Access Business Group International LLC

Inventor： Joseph C. Van Den Brink ,  Sean T. Eurich ,  Neil W. Kuyvenhoven ,  Kaitlyn J. Turner ,  Benjamin C. Moes ,  Hai D. Nguyen

IPC: H05K1/00 ,  H05K7/02 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K13/00 ,  H01F27/28 ,  H05K3/36 ,  H01F38/14

CPC classification number: H05K7/02 ,  H01F27/2804 ,  H01F38/14 ,  H05K1/028 ,  H05K1/092 ,  H05K1/111 ,  H05K1/165 ,  H05K3/361 ,  H05K13/00 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/1028 ,  H05K2201/10386 ,  H05K2201/10401 ,  Y10T29/49117

Abstract: An item of print media (30) including an inductive secondary (50) for providing power to a load (32). The inductive secondary is responsive to an electromagnetic flux to generate a time-varying current or voltage therein. The current or voltage induced in the inductive secondary directly or indirectly powers the load to thereby enhance the functionality and/or the appeal of the item of print media without significantly adding to its cost. The load can provide a visual and/or auditory output, and can include an electroluminescent display, an e-ink display, a piezo speaker coil, an electrostatic speaker, an OLED, an LED or an LCD display. Embodiments of the invention can be utilized in connection with a wide variety of print media, including for example books, booklets, pamphlets, labels, magazines, manuals, brochures, maps, charts, posters, journals, newspapers or loose leaf pages.

公开(公告)号：US09625136B2

公开(公告)日：2017-04-18

申请号：US14436261

申请日：2013-09-03

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Kiyokazu Hino ,  Takahiro Kurihara

IPC: F21V23/00 ,  F21V19/00 ,  H01R43/02 ,  F21V23/06 ,  H05K3/34 ,  H01R12/58 ,  F21V29/70 ,  H05K3/30 ,  F21S8/10 ,  F21Y101/00 ,  F21Y105/00 ,  F21Y115/30 ,  F21Y115/15

CPC classification number: F21V23/002 ,  F21S43/195 ,  F21S43/37 ,  F21S45/50 ,  F21V19/0025 ,  F21V19/003 ,  F21V19/005 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01R12/58 ,  H01R43/0256 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/1031 ,  H05K2201/10401 ,  Y02P70/611

Abstract: A light emitting device according to the present embodiment includes a substrate on which a wiring portion is provided; a light emitting element which is provided on the substrate and is electrically connected to the wiring portion; a feeding portion to which an electric power is supplied from the outside; a first connection portion which is provided on the substrate and is electrically connected to the wiring portion; a second connection portion which is joined to the first connection portion through soldering and includes a first opening portion into which the feeding portion is inserted; and a soldering portion which is provided between the first opening portion and the feeding portion.

公开(公告)号：US09480141B1

公开(公告)日：2016-10-25

申请号：US14032908

申请日：2013-09-20

Applicant: Junis Hamadeh

Inventor： Junis Hamadeh

IPC: H05K1/02 ,  H01R12/00

CPC classification number: H01R12/00 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/113 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09463 ,  H05K2201/0959 ,  H05K2201/10106 ,  H05K2201/10401 ,  H05K2201/10416

Abstract: A heat sinking rapid assembly semiconductor package comprising an electrically segmented conductive assembly post. The post is fabricated comprising at least two independent electrically conductive segments separated by an electrically isolating element. An electrical component, such as a semiconductor device, is assembled to an upper portion of the conductive post, wherein each contact of the component is in electrical communication with a respective conductive segment. The post can be mechanically pressed, threaded, or mechanically coupled using any other reasonable mechanical interface into a segmented via or plated-through hole of a printed circuit board (PCB). The electrical segments would be in electrical communication with conductive portions of the segmented via to form a complete electrical circuit between the PCB and the electrical component. A thermally conductive element can be integrated into the post to conduct heat away from the semiconductor device to improve performance and reduce failures related to thermal stress.

Abstract translation: 一种散热快速组装半导体封装，包括电分段的导电组件柱。 该柱被制造成包括由电隔离元件隔开的至少两个独立的导电段。 诸如半导体器件的电气部件被组装到导电柱的上部，其中部件的每个触点与相应的导电部分电连通。 可以使用任何其他合理的机械接口将柱机械地压制，螺纹化或机械耦合到印刷电路板（PCB）的分段通孔或电镀通孔中。 电段将与分段通孔的导电部分电连通，以在PCB和电气部件之间形成完整的电路。 导热元件可以集成到柱中以将热量从半导体器件导出，以提高性能并减少与热应力相关的故障。

公开(公告)号：US09271670B2

公开(公告)日：2016-03-01

申请号：US14685304

申请日：2015-04-13

Applicant: Abbott Diabetes Care Inc.

Inventor： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

IPC: H05K5/00 ,  A61B5/1473 ,  A61B5/00 ,  A61B5/145 ,  A61B5/1468 ,  A61B5/1486 ,  H05K3/32 ,  H01L23/00 ,  H05K3/36

CPC classification number: A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

公开(公告)号：US09131632B2

公开(公告)日：2015-09-08

申请号：US13514347

申请日：2010-12-03

Applicant: Roland Moedinger

Inventor： Roland Moedinger

IPC: H01R12/00 ,  H05K3/30 ,  H01R12/58 ,  H01R12/72 ,  H01R13/6587 ,  H05K1/02

CPC classification number: H05K3/308 ,  H01R12/585 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/0245 ,  H05K1/0251 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2203/0242 ,  Y10T29/49126

Abstract: A multipole relief plug-in Connector includes contact elements, the contacting sections of which are arranged in height-offset contact area surfaces, and a multilayer circuit board includes several height-offset contact area surfaces accordingly. In combination, the multipole relief plug-in connector contacts the multilayer circuit board and the multilayer circuit board populates the multipole relief plug-in connector. The contact elements of the relief plug-in connector are designed in the contacting section as press-in contacts for pressing into press-in contact receiving portions of the multilayer circuit board. Contact element receiving portions of the multilayer circuit board are arranged in the contact area surfaces of the multilayer circuit board, the contact element receiving portions being designed as press-in contact receiving portions. A production method produces the multilayer circuit board.

Abstract translation: 多极释放插入式连接器包括接触元件，其接触部分布置在高度偏移的接触区域表面中，并且多层电路板相应地包括多个高度偏移的接触面积表面。 组合在一起，多极释放插入式连接器接触多层电路板，并且多层电路板填充多极释放插入式连接器。 泄压插入式连接器的接触元件设计在接触部分中，作为用于压入多层电路板的压入接触部分的压入触头。 多层电路板的接触元件接收部分布置在多层电路板的接触区域表面中，接触元件接收部分被设计成压入接触部分。 生产方法生产多层电路板。

公开(公告)号：US20150116958A1

公开(公告)日：2015-04-30

申请号：US14446458

申请日：2014-07-30

Applicant: Apple Inc.

Inventor： Anna-Katrina Shedletsky ,  Samuel Bruce Weiss

IPC: H05K1/18 ,  H05K9/00

CPC classification number: H05K3/284 ,  H05K5/065 ,  H05K9/0022 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2203/1316

Abstract: A modularized printed circuit board including mechanical features. The modularized printed circuit board may include a printed circuit board, at least one electronic component affixed to the printed circuit board, and an overmold material adjacent at least a portion of the printed circuit board and defining a region of overmold material. The modularized printed circuit board may also include a feature formed from the overmold material.

Abstract translation: 包括机械特征的模块化印刷电路板。 模块化印刷电路板可以包括印刷电路板，固定到印刷电路板的至少一个电子部件和与印刷电路板的至少一部分相邻并且限定包覆成型材料的区域的包覆成型材料。 模块化印刷电路板还可以包括由包覆成型材料形成的特征。

公开(公告)号：US20120244753A1

公开(公告)日：2012-09-27

申请号：US13514347

申请日：2010-12-03

Applicant: Roland Moedinger

Inventor： Roland Moedinger

IPC: H01R24/50 ,  H05K1/00 ,  H05K3/36

CPC classification number: H05K3/308 ,  H01R12/585 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/0245 ,  H05K1/0251 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2203/0242 ,  Y10T29/49126

Abstract: The invention relates to a multipole relief plug-in connector (10a, 10b) and to a multilayer circuit board (12a, 12b), the relief plug-in connector (10a, 10b) comprising a plurality of contact elements (14a, 14b), the contacting sections (16a, 16b) of which are arranged in height-offset contact area surfaces (18a, 18b), and the multilayer circuit board (12a, 12b) comprising several height-offset contact area surfaces (20, 20b) accordingly, and to a combination of a multipole relief plug-in connector (10a, 10b) for contacting with a multilayer circuit board (12a, 12b) and a multilayer circuit board (12a, 12b) for populating with the multipole relief plug-in connector (10a, 10b). The relief plug-in connector (10a, 10b) according to the invention is characterized in that the contact elements (14a, 14b) are designed in the contacting section (16a, 16b) as press-in contacts (22a, 22b, 26a, 26b, 28a, 28b) for pressing into press-in contact receiving portions (24a, 24b, 38a, 38b, 44a, 44b) of the multilayer circuit board (12a, 12b). The multilayer circuit board (12a, 12b) is characterized in that contact element receiving portions are arranged in the contact area surfaces (20a, 20b) of the multilayer circuit board (12a, 12b), the contact element receiving portions being designed as press-in contact receiving portions (24a, 24b, 38a, 38b, 44a, 44b). The invention further relates to a production method for the multilayer circuit board (12a, 12b).

Abstract translation: 本发明涉及多极释放插入式连接器（10a，10b）和多层电路板（12a，12b），所述释放插入式连接器（10a，10b）包括多个接触元件（14a，14b） ，其接触部分（16a，16b）布置在高度偏移的接触区域表面（18a，18b）中，并且所述多层电路板（12a，12b）相应地包括多个高度偏移接触面积表面（20,20b） 以及用于与多层电路板（12a，12b）接触的多极释放插入式连接器（10a，10b）和用于填充多极释放插入式连接器的多层电路板（12a，12b）的组合 （10a，10b）。 根据本发明的释放插入式连接器（10a，10b）的特征在于，接触元件（14a，14b）被设计在接触部分（16a，16b）中，作为压入触头（22a，22b，26a， 26b，28a，28b），用于压入多层电路板（12a，12b）的压入接触部（24a，24b，38a，38b，44a，44b）。 多层电路板（12a，12b）的特征在于，多层电路板（12a，12b）的接触区域表面（20a，20b）中布置有接触元件接收部分， 在接触接收部分（24a，24b，38a，38b，44a，44b）中。 本发明还涉及多层电路板（12a，12b）的制造方法。

公开(公告)号：US07604491B1

公开(公告)日：2009-10-20

申请号：US12107334

申请日：2008-04-22

Applicant: Mudasir Ahmad ,  David Popovich

Inventor： Mudasir Ahmad ,  David Popovich

IPC: H01R12/00

CPC classification number: H05K3/308 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: An apparatus includes a printed circuit board having a set of layers and a set of barrels embedded within the set of layers. The apparatus further includes an electrical component having a component body and a set of pins which extends from the component body. The apparatus further includes a set of sleeves. Each sleeve defines a substantially conical shape. The set of sleeves provides electrical and thermal conductivity between the set of pins of the electrical component and the set of barrels of the printed circuit board.

Abstract translation: 一种装置包括印刷电路板，该印刷电路板具有一组层和一组嵌入层内的一组桶。 该装置还包括具有组件主体和从组件主体延伸的一组销的电气部件。 该装置还包括一套套筒。 每个套筒限定了大致圆锥形的形状。 这套套筒在电气部件的一组销和印刷电路板的一组套筒之间提供电和导热性。

公开(公告)号：US07425139B2

公开(公告)日：2008-09-16

申请号：US11554805

申请日：2006-10-31

Applicant: Cheng-Chia Hsu ,  Teng-Kang Chang ,  Yu-Cheng Pan

Inventor： Cheng-Chia Hsu ,  Teng-Kang Chang ,  Yu-Cheng Pan

IPC: H01R12/00

CPC classification number: H01R33/09 ,  H05K3/308 ,  H05K2201/10113 ,  H05K2201/10401 ,  H05K2201/1059 ,  Y10S439/915

Abstract: In a fixation structure for fixing a lamp on a printed circuit board (PCB), a connection end of the lamp is received within a connection hole of the PCB and a sleeve having approximately cone shape is disposed between the lamp and the PCB. When the connection end of the lamp is continuously inserted into the connection hole of the PCB, a contact area between the connection end and the connection hole is increased, thereby effectively enhancing a contact-and-on performance of the lamp and the PCB. Sleeves may be located on lamps leads or alternatively placed in the connection hole of the PCB.

Abstract translation: 在用于将灯固定在印刷电路板（PCB）上的固定结构中，灯的连接端被接收在PCB的连接孔内，并且具有近似锥形的套筒设置在灯和PCB之间。 当灯的连接端连续插入到PCB的连接孔中时，连接端和连接孔之间的接触面积增加，从而有效地提高了灯和PCB的接触性能。 套管可以位于灯头上，或者可以放置在PCB的连接孔中。

公开(公告)号：US20080144301A1

公开(公告)日：2008-06-19

申请号：US11867280

申请日：2007-10-04

Applicant: Ikuo Konishi

Inventor： Ikuo Konishi

IPC: H05K1/11

CPC classification number: H05K3/308 ,  H01R12/515 ,  H01R12/58 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: A connecting terminal has an electrically-conductive ring surrounding a columnar space. Electrically-conductive elastic pieces extend from the electrically-conductive ring in the direction of the central axis of the columnar space. Electrically-conductive blades stand from the outer surfaces of the electrically-conductive elastic pieces. A lead terminal is received in the columnar space. The tip ends of the electrically-conductive elastic pieces are urged against the lead terminal. The lead terminal is prevented from withdrawing out of the through hole. Electric connection is established between the lead terminal and the elastic pieces. The blade or blades of the connecting terminal or terminals stick into the wall surface of the through hole. The connecting terminal is thus firmly held in the through hole. Electric connection is established between the blade or blades and the through hole. Electric connection is thus established between the lead terminal and the through hole.

Abstract translation: 连接端子具有围绕柱状空间的导电环。 导电弹性片从导电环沿柱状空间的中心轴线的方向延伸。 导电叶片从导电弹性片的外表面立起。 引线端子被接收在柱状空间中。 导电弹性片的前端被推靠在引线端子上。 引线端子被阻止从通孔中退出。 引线端子和弹性片之间建立电连接。 连接端子或端子的刀片或刀片粘入通孔的壁面。 因此，连接端子牢固地保持在通孔中。 在叶片或叶片与通孔之间建立电连接。 因此，在引线端子和通孔之间建立电连接。