公开(公告)号：US10647892B2

公开(公告)日：2020-05-12

申请号：US15548655

申请日：2016-02-09

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD. ,  AKITA UNIVERSITY ,  TSUCHIYA CO., LTD.

Inventor： Toshiyuki Takayanagi ,  Naomoto Ishikawa ,  Hideki Horizono ,  Nobuyuki Kamihara ,  Mikio Muraoka ,  Hiroaki Hayashi ,  Osamu Yoshida ,  Kotaro Tsuji

IPC: C09J11/04 ,  B29C65/00 ,  C09J201/00 ,  C08K3/08 ,  B32B27/28 ,  C09J7/10 ,  B32B5/26 ,  B29C65/50 ,  B32B27/08 ,  B29C65/14 ,  B29C65/34 ,  B29C65/48 ,  B32B7/12 ,  B29C65/36 ,  C09J5/06 ,  C08K3/10 ,  B29K105/16 ,  C08K7/06

Abstract: Provided is an adhesive that can provide quick bonding between thermoplastic resins and excellent bond strength, a structure having adhesion provided by the adhesive, and an adhesion method using the adhesive. The adhesive bonds a first member (11) containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member (12) containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin. The adhesive includes a thermoplastic resin as a main component containing a metal nano material that absorbs electromagnetic waves and generates heat.

公开(公告)号：US10457811B2

公开(公告)日：2019-10-29

申请号：US15437889

申请日：2017-02-21

Applicant: Kalkfabrik Netstal AG

Inventor： Wendelin Jan Stark

IPC: C09C1/00 ,  C09C1/02 ,  A01N25/26 ,  A61K8/02 ,  A61K9/14 ,  C08K9/00 ,  C09J11/04 ,  D21H17/67 ,  C09D7/62 ,  C04B22/06 ,  C01F11/02 ,  A23L33/10 ,  A61K8/36 ,  A61Q11/00 ,  A61Q19/00 ,  A61K8/85 ,  A61K8/19 ,  C09D7/40 ,  A01N59/00 ,  A61K47/02 ,  C08K3/22 ,  C08K9/04 ,  C09D201/00 ,  C09J201/00 ,  D21H19/38 ,  C09C3/00 ,  C09C3/04 ,  C09C3/08

Abstract: The present invention relates to methods for producing surface-modified calcium oxide particles having the production steps according to claim 1, novel calcium oxide particles obtained according to these methods, and uses thereof.

公开(公告)号：US10426044B2

公开(公告)日：2019-09-24

申请号：US15778369

申请日：2016-12-06

Applicant: DIC Corporation

Inventor： Koji Hayashi ,  Sumio Shimooka ,  Shota Tanii ,  Akinori Morino

IPC: H01K1/02 ,  H01K1/18 ,  H01K3/00 ,  H01K3/24 ,  H01K3/32 ,  H01L21/02 ,  H01L23/48 ,  H05K3/38 ,  C09J201/00 ,  C09J7/35 ,  C09J7/25 ,  C09J7/28 ,  C09J7/21 ,  C09J7/20 ,  C09J5/06 ,  C09J11/04 ,  H05K1/02 ,  H05K3/46 ,  C09J9/02 ,  H05K3/00

Abstract: An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 μm or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 μm or less thickness.

公开(公告)号：US10407593B2

公开(公告)日：2019-09-10

申请号：US15713644

申请日：2017-09-23

Applicant: Kraton Chemical, LLC

Inventor： Jos H. M. Lange ,  Mark C Schaapman

IPC: C09F1/04 ,  C09D5/33 ,  C09D193/04 ,  C09D201/00 ,  C09J193/04 ,  C09J201/00 ,  C08L93/04

Abstract: An Oligoester composition obtained from a reactant mixture comprising one or more rosin; one or more polyhydric alcohol selected from the group of polyhydric alcohols having from 2 to 30 carbon atoms, and from 0.5 wt. % to 15 wt. %, based on the weight of all reactants, of one or more polyfunctional carboxylic acids selected from cycloaliphatic dicarboxylic polyfunctional carboxylic acids, and wherein the one or more polyhydric alcohol is present in the mixture for preparation of the Oligoester an amount of from 5 wt. % to 35 wt. %, based on the weight of all reactants. Oligoester composition has a hydroxyl value of from 7 mg KOH/g to 40 mg KOH/g and suitable for use in road marking, adhesives or tire tread.

公开(公告)号：US10369768B2

公开(公告)日：2019-08-06

申请号：US15552706

申请日：2016-07-11

Applicant: NITTO DENKO CORPORATION

Inventor： Hirofumi Katami ,  Atsushi Yasui

IPC: B32B7/12 ,  B32B7/02 ,  C08K3/22 ,  G06F3/041 ,  B32B27/00 ,  C03C27/10 ,  C09J201/00 ,  C09J7/10

Abstract: The present invention provides a cover element having a pressure-sensitive adhesive sheet preliminarily laminated thereto, wherein the pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer in which a refractive index adjustment zone having a refractive index greater than that of a base pressure-sensitive adhesive material thereof is formed over a given range from a surface of the pressure-sensitive adhesive layer in a thickness direction thereof, whereby: in a lamination process of a customer which is a supply destination of the cover element, it becomes possible to eliminate a need to distinguish between obverse and reverse sides of the pressure-sensitive adhesive sheet itself; and, when the cover element is bonded to an optical element through the pressure-sensitive adhesive layer, it becomes possible to suppress internal reflection in a laminate formed of these optical elements.

公开(公告)号：US10316156B2

公开(公告)日：2019-06-11

申请号：US15101555

申请日：2015-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Kohei Doi ,  Kazumichi Kato ,  Hideyuki Tokuyama ,  Tadao Takahashi

IPC: B32B5/18 ,  C08J5/18 ,  C08J9/00 ,  C08J9/12 ,  C08J9/30 ,  C08J9/36 ,  C09J7/26 ,  B32B27/06 ,  B32B27/28 ,  C09J201/00

Abstract: There is provided a foamed sheet which takes only a short time to recover the thickness thereof after being compressed, and even if being subjected to repeated impacts, hardly decreases in the impact absorption. The foamed sheet according to the present invention comprises a foamed body formed of a resin composition comprising: a thermoplastic resin a and a silicone-based compound b having not more than 2,000 siloxane bonds; and/or a thermoplastic resin a′ having a silicone chain having not more than 2,000 siloxane bonds. The thermoplastic resin a is preferably at least one selected from the group consisting of acrylic polymers, rubbers, urethanic polymers and ethylene-vinyl acetate copolymers. The silicone-based compound b is preferably at least one selected from the group consisting of silicone oils, modified silicone oils and silicone resins.

公开(公告)号：US10307866B2

公开(公告)日：2019-06-04

申请号：US15868866

申请日：2018-01-11

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Hirotoki Yokoi ,  Tomoaki Uchiyama ,  Yoshifumi Oka

IPC: B23K26/351 ,  B23K26/352 ,  C09J201/00 ,  C09J7/20 ,  H01L21/304 ,  B23K26/362 ,  H01L21/78 ,  H01L21/683 ,  H01L21/308

Abstract: A method of producing a semiconductor chip, including the following steps (a) to (d): (a) a step of, in the state of having laminated a mask-integrated surface protective tape on the side of a patterned surface of a semiconductor wafer, grinding the backing-face of the semiconductor wafer; laminating a wafer fixing tape on the backing-face side of the ground semiconductor wafer; and supporting and fixing the wafer to a ring flame; (b) a step of, after peeling the surface protective tape thereby to expose the mask material layer on top, forming an opening of a street of the semiconductor wafer; (c) a plasma dicing step of segmentalizing the semiconductor wafer by a plasma irradiation to singulate it into semiconductor chips; and (d) an ashing step of removing the mask material layer by the plasma irradiation.

公开(公告)号：US20190160726A1

公开(公告)日：2019-05-30

申请号：US16320690

申请日：2017-07-27

Applicant: KURARAY CO., LTD.

Inventor： Yoshimi YAMADA ,  Ryota HASHIMOTO ,  Kirihiro NAKANO ,  Yoshirou KONDOU ,  Yoshiki MUKOO

IPC: B29C51/10 ,  B32B27/02 ,  C09J201/00 ,  B29C51/14 ,  B32B27/08

Abstract: Provided are a film which can be decorated even against a three-dimensional shape, is excellent in moldability during decoration (adhesion) on an adherend, is able to reduce concaves and convexes with a variety of sizes which the adherend surface has, and makes an appearance quality favorable; and a decorative molded product having the film. The film is a film including a layer containing a thermoplastic resin, wherein when a highest temperature of glass transition temperatures of the film is designated as Tg [+ C], a temperature T [° C.] at which an elongation at break is 50% or more exists in a range of Tg to (Tg+50 [° C.]), and when, with respect to concaves and convexes of an abrasive grain surface of a polyester film sheet having, as an abrasive grain, aluminum oxide having a grain size of 12 μm coated thereon, an amplitude relative to a spatial frequency f is designated as A1(f); with respect to concaves and convexes of a film surface when adhering the film to the abrasive grain surface at any temperature of the range of Tg to (Tg+50 [° C.]) and a pressure of 0.3 MPa, an amplitude relative to the spatial frequency f is designated as A2(f); and a ratio of A2(f) to A1(f) is designated as ϕ(f)=A2(f)/A1(f), a minimum value fc of spatial frequencies where ϕ(f) is 0.1 is 2.0 mm−1 or less.

公开(公告)号：US10299382B2

公开(公告)日：2019-05-21

申请号：US15112872

申请日：2015-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi Saruyama ,  Yasushi Akutsu

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/18 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01R4/04 ,  C09J5/00 ,  H05K3/32

Abstract: Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body has an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent; the anisotropic conductive adhesive agent contains a binder resin layer in which conductive particles are regularly arranged; an inter-particle distance among the conductive particles in a space between connection electrodes formed on the electronic component being greater than the inter-particle distance among the conductive particles trapped between the connection electrodes and substrate electrodes formed on the circuit substrate.

公开(公告)号：US20190144051A1

公开(公告)日：2019-05-16

申请号：US16250081

申请日：2019-01-17

Applicant: Zephyros, Inc.

Inventor： Henry E. Richardson ,  Alexander G. Mangiapane

IPC: B62D29/04 ,  B62D21/15 ,  C09J201/00 ,  B62D25/00 ,  B62D29/00 ,  B29C69/02

CPC classification number: B62D29/041 ,  B29C69/02 ,  B29K2063/00 ,  B29K2105/0097 ,  B29K2105/04 ,  B29L2031/30 ,  B62D21/15 ,  B62D25/00 ,  B62D29/002 ,  C09J201/00

Abstract: A structural reinforcement comprising a base reinforcing structure including a plurality of ribs and having a first surface and a second surface, an expandable adhesive material located onto a first portion of the first surface, and a sealant material located around an edge of the second surface, the second surface being substantially free of any of the plurality of ribs.