Abstract:
This invention relates to an ESD protection configuration and method for light emitting diodes (LED), including an LED an LED, having a p-n junction and connected to a circuit substrate, the circuit substrate having two p-type substrates and one n-type substrate therein; a first ESD protection configuration, built-in the circuit substrate and including a first resistor, a first capacitor and a first diode that are connected in series and then engage a parallel connection with the LED, wherein the first diode has a p-node connected to an n-node of the LED; and a second ESD protection configuration, built-in the circuit substrate and including a second resistor, a second capacitor and a second diode that are connected in series and then engage a parallel connection with the LED and the first ESD protection configuration, wherein the second diode has a p-node connected to the p-node of the LED, whereby such a configuration absorbs and removes ESD induced upon human contact and prevents the LED from burning to effectively extend the lifespan of the LED.
Abstract:
A light emitting diode includes a light emitting structure, a heterojunction, a first electrode, and a second electrode. The light emitting structure has a top surface where the first electrode and the second electrode are positioned thereon. The heterojunction is in the light emitting structure and includes a first semiconductor layer and a second semiconductor layer of differently doped types. The first semiconductor layer has a boundary and is electrically connected to the first electrode. The first electrode includes at least two wire-bonding pads. A smallest horizontal distance (d) between a center of the first electrode and the boundary is in a range of about 89 μm to 203 μm. The second electrode is electrically connected to the second semiconductor layer and includes an outer arm, which peripherally encompasses the top surface.
Abstract:
A support bar for an aid for walking includes a tubular part having a toothed inner wall. Multiple grooves are axially defined in the inner wall. Whereby, the overall weight of the aid for walking can be effectively decreased to enable a disabled or elderly person to use the crutch or the walking frame.
Abstract:
A semiconductor structure with two light emitting diodes in series connection is disclosed. The semiconductor structure comprises two light emitting diodes (LEDs) having the same stack layers and abutting each other but spaced by an isolation trench. The stack layers from a bottom thereof include a thermal conductive substrate, an nonconductive protective layer, a metal adhering layer, a mirror protective layer, a p-type ohmic contact epi-layer, a upper cladding layer, an active layer, and a lower cladding layer. Two p-type ohmic contact metal electrodes for two LEDs are formed on an interface between the mirror protective layer and the ohmic contact epi-layer and buried in the mirror protective layer. The stack layers have first trenches formed therein which exposes the upper cladding layer and electrical connecting channels to connect p-type electrodes. The isolation trench is formed by patterning the exposed upper cladding layer until further exposing the nonconductive protective layer. Two n-type electrodes are formed on the lower cladding layer of two LEDs. A dielectric layer is deposited to fill the isolation trench and covered a sidewall of the first trench so that it can electrically isolate layers of the stack layers of the second LED while a metal connection trace formed thereon to connect the p-type ohmic contact electrode of the first LED and n-type of ohmic electrode of second LED.
Abstract:
A fastening mechanism includes a mounting seat mounted on a frame body, disposed at a mounting hole in a frame body, and configured with an accommodating space therein. The mounting seat has a mounting wall formed with an opening for access into the accommodating space, and an outer surrounding wall connected to a periphery of the mounting wall. An engaging member extends movably in the accommodating space in the mounting seat, and is operable so as to move from a releasing position, where the engaging member disengages a fastening hole in a peripheral device, to an anchoring position, where the engaging member engages the fastening hole in the peripheral device such that the peripheral device is fastened to the frame body. The engaging member can be retained releasably in a selected one of the anchoring and releasing positions.
Abstract:
A high reflective and conductive metal substrate instead of a GaAs substrate which is a light absorption substrate is utilized for the light emitting diode. The processes include forming a mirror protection film on the light emitting epi-layers. The mounting between the reflective and conductive metal substrate on the protection film is though a metal adhesive layer. Afterward, the temporal GaAs substrate is removed. Thereafter, a trench is formed to remove a portion of light emitting epi-layers to expose a p-type ohmic contact epi-layer and the first ohmic contact metal electrode of the light emitting epi-layers. Then the second ohmic contact metal electrode and a wire bonding layer formation are followed. The LED can enhance capability of the light reflect instead of light absorption.
Abstract:
A light emitting device is disclosed. The light emitting device comprises a contact layer and an oxide transparent layer located directly on the contact layer. The contact layer has a stacked structure formed by alternately stacking a plurality of nitride semiconductor layers having a wider bandgap and a plurality of nitride semiconductor layers having a narrower bandgap.
Abstract:
A heat dissipating structure is formed via the assembly of metallic fins. An upper side, an inner side, and a lower side of each fin respectively form a first, second, and third folded edge. At least each first folded edge includes a groove through one rim and a hooking projection on an opposite rim. The metallic fins thereby assemble with one another by engagement of the hooking projection of one fin with the groove of one neighboring fin. Below the first folded edge, each fin further forms an inclined edge. The second folded edges of the fins are further in contact with a highly thermal conductive body. With the metallic fins being assembled with one another, a plurality of gaps are constituted between their inclined edges. Via a fan, the air circulation through the gaps is thereby promoted to rapidly dissipate the heat and prevent the hothouse effect.
Abstract:
A current source apparatus with bias switches, applied in digital-to-analog converters, is disclosed. The current compliance and settling time performances can be promoted via improving the structure of the bias circuit and making the MOS transistors operate in the saturation region, without increasing the dimensions of the MOS transistors.
Abstract:
An optical receiver communication system converts optical signals modulated by analog or digital waveforms to RF signals. The optical receiver contains an automatic level control circuit to adjust the electronic gain of the system accordingly across a broad bandwidth spectrum. Two impedance matching circuit are designed using broad band matching technique to expand the bandwidth for increasing the maximum receivable frequency to 1 GHz. A RLC impedance matching circuit forms a resonant combination to maintain .+-.1 dB fluctuation between the low-and high-frequency limits of the bandwidth, and a 75 .OMEGA. impedance matching circuit creates a 180.degree. phase shift between the outgoing and the incoming signal for low return loss.