公开(公告)号：US07608805B2

公开(公告)日：2009-10-27

申请号：US11036417

申请日：2005-01-14

Applicant: Mitsuhiko Miyazaki ,  Toshinobu Ishihara ,  Hitoshi Takeuchi

Inventor： Mitsuhiko Miyazaki ,  Toshinobu Ishihara ,  Hitoshi Takeuchi

IPC: H05B1/02

CPC classification number: B23K3/0323 ,  B23K3/033 ,  G05D23/1917 ,  G05D23/2401

Abstract: A control system and method of controlling a battery powered heating device such as a soldering or desoldering tool that includes a control circuit to control the delivery of power to a cartridge heating tip and to cycle the power to the cartridge heating tip during times of no use so as to minimize the amount of power expended to maintain the device in a ready or usable state.

Abstract translation: 一种控制系统和控制电池供电加热装置的方法，例如焊接或脱焊工具，其包括控制电路，以控制向盒加热尖端传递电力，并且在不使用的时间期间将电力循环到盒加热尖端 以便最小化维持设备处于就绪或可用状态的功率消耗。

公开(公告)号：US07580329B2

公开(公告)日：2009-08-25

申请号：US11339759

申请日：2006-01-24

Applicant: Junsaku Nakajima ,  Hitoshi Takeuchi ,  Masaru Nomura ,  Kenji Ohta

Inventor： Junsaku Nakajima ,  Hitoshi Takeuchi ,  Masaru Nomura ,  Kenji Ohta

IPC: G11B7/00

CPC classification number: G11B20/00688 ,  G11B7/005 ,  G11B7/007 ,  G11B7/24085 ,  G11B20/00086

Abstract: An optical disk has a lead-in region provided at the inner circumference side and a user region provided at the outer circumference side. Pit string 3 of pits of different depths is formed in the lead in region. Light beam reflected from the pit string is detected by detector and TPP and RF signals are output by differential amplifier and addition amplifier. A ternary signal is restored from pits based on the TPP and RF signals. Information is recorded by pits of the same depth in the user region. Recording information in the depth direction in the lead-in region increases the recording capacity thereof. The information recorded in the depth direction in the lead-in region cannot be transferred to a user region of another optical disk.

Abstract translation: 光盘具有设置在内周侧的引入区域和设置在外周侧的用户区域。 在引导区域中形成具有不同深度的凹坑的凹坑串3。 通过检测器检测从凹坑串反射的光束，TPP和RF信号由差分放大器和相加放大器输出。 基于TPP和RF信号从凹坑恢复三态信号。 信息由用户区域中相同深度的凹坑记录。 在导入区域中沿深度方向记录信息增加其记录容量。 在导入区域中沿深度方向记录的信息不能传送到另一个光盘的用户区域。

公开(公告)号：US20070187189A1

公开(公告)日：2007-08-16

申请号：US10575614

申请日：2004-10-19

Applicant: Hitoshi Takeuchi

Inventor： Hitoshi Takeuchi

IPC: B62L5/00

CPC classification number: F16D65/12 ,  F16D2065/1348 ,  F16D2069/004

Abstract: A brake disc capable of sufficiently absorbing thermal stress associated with thermal expansion and deformation of the braking section. The brake disc includes a mounting section for attachment to a wheel, a braking section located at the outside circumference of the mounting section for brake pads to be brought into sliding contact therewith, and a connecting arm section for connecting each of the plurality of mounting portions of the mounting section and the braking section. Connecting arms in the connecting arm section each extend from their respective ones of the plurality of mounting portions in one side direction different from the radial direction of the braking section to reach the braking section, and adjacent mounting portions are connected to each other at least through a connecting arm.

Abstract translation: 一种能够充分吸收与制动部的热膨胀和变形相关的热应力的制动盘。 制动盘包括用于附接到车轮的安装部分，位于用于与其滑动接触的制动衬块的安装部分的外圆周处的制动部分，以及连接臂部分，用于将多个安装部分 的安装部和制动部。 连接臂部分中的连接臂各自在与制动部分的径向方向不同的一个侧面方向上从其各自的安装部分延伸到达制动部分，并且相邻的安装部分至少通过 连接臂。

公开(公告)号：US07128038B2

公开(公告)日：2006-10-31

申请号：US10681378

申请日：2003-10-09

Applicant: Shinji Kawai ,  Hisashi Kino ,  Tomiharu Isogai ,  Hitoshi Takeuchi

Inventor： Shinji Kawai ,  Hisashi Kino ,  Tomiharu Isogai ,  Hitoshi Takeuchi

IPC: F02D9/02

CPC classification number: F02M35/10144 ,  F02D9/1035 ,  F02D9/107 ,  F02D9/108 ,  F02M35/10085 ,  F02M35/10249 ,  F02M35/10255 ,  F02M35/10347 ,  F16K27/08 ,  F16K31/043

Abstract: An intake device for an internal combustion engine includes a throttle body (1) that forms an intake passage (1a). A throttle valve (2) is arranged within the intake passage. A pipe member (26) is connected to the throttle body, wherein the pipe member forms a communication passage (26a) communicating with the intake passage. An engagement device (53,63; 85,87; 92,63) is provided between the throttle body and the pipe member. The engagement device includes at least one engagement protrusion (53; 85; 92) and at least one engagement recess (63; 87M). When the engagement protrusion and the engagement recess are engaged with each other, detachment of the throttle body and the pipe member from each other is restricted. The assembly process is simplified by a lack of separate components such as clamps and bolts, relying instead upon a typical snap-fit connection.

Abstract translation: 用于内燃机的进气装置包括形成进气通道（1a）的节气门体（1）。 节流阀（2）布置在进气通道内。 管件（26）连接到节流阀体，其中管件形成与进气通道连通的连通通道（26a）。 在节气门体和管构件之间设置有接合装置（53,63; 85,87; 92,63）。 接合装置包括至少一个接合突起（53; 85; 92）和至少一个接合凹部（63; 87M）。 当接合突起和接合凹槽彼此接合时，节流阀体和管构件彼此分离被限制。 组装过程由于缺乏诸如夹具和螺栓的单独部件而简化，而是依赖于典型的卡扣配合连接。

公开(公告)号：US20060157466A1

公开(公告)日：2006-07-20

申请号：US11036417

申请日：2005-01-14

Applicant: Mitsuhiko Miyazaki ,  Toshinobu Ishihara ,  Hitoshi Takeuchi

Inventor： Mitsuhiko Miyazaki ,  Toshinobu Ishihara ,  Hitoshi Takeuchi

IPC: H05B3/02 ,  H05B1/00 ,  H05B11/00

CPC classification number: B23K3/0323 ,  B23K3/033 ,  G05D23/1917 ,  G05D23/2401

Abstract: A control system and method of controlling a battery powered heating device such as a soldering or desoldering tool that includes a control circuit to control the delivery of power to a cartridge heating tip and to cycle the power to the cartridge heating tip during times of no use so as to minimize the amount of power expended to maintain the device in a ready or usable state.

公开(公告)号：US20060152071A1

公开(公告)日：2006-07-13

申请号：US11316348

申请日：2005-12-21

Applicant: Hitoshi Takeuchi

Inventor： Hitoshi Takeuchi

IPC: B60T13/00

CPC classification number: B62L3/08 ,  B62L3/023 ,  B62L3/04

Abstract: An improved brake system is provided for a vehicle including at least front and rear wheels. The brake system comprises a braking force generating mechanism, a brake lever assembly and a foot-operated brake pedal. The brake force generating mechanism applies a braking force to at least a front wheel or a rear wheel of the vehicle. The brake lever assembly includes a hand-operated lever and a force actuator. The force actuator moves between at least first and second positions so as to selectively actuate the brake force generating mechanism to produce a braking force. The force actuator interacts with the hand-operated lever such that movement of the hand-operated lever moves the force actuator from the first position to at least the second position. The force actuator also interacts with the brake pedal, which are coupled together by a cable. Movement the brake pedal also moves the force actuator from the first position to the second position.

Abstract translation: 提供了一种用于至少包括前轮和后轮的车辆的改进的制动系统。 制动系统包括制动力产生机构，制动杆组件和脚踏操纵的制动踏板。 制动力产生机构对车辆的至少前轮或后轮施加制动力。 制动杆组件包括手动操纵杆和力促动器。 力致动器在至少第一和第二位置之间移动，以便选择性地致动制动力产生机构以产生制动力。 力致动器与手动操纵杆相互作用，使得手动操纵杆的移动将力致动器从第一位置移动到至少第二位置。 力致动器还与制动踏板相互作用，制动踏板通过电缆连接在一起。 移动制动踏板还将力致动器从第一位置移动到第二位置。

公开(公告)号：US07050383B2

公开(公告)日：2006-05-23

申请号：US09824554

申请日：2001-04-02

Applicant: Junsaku Nakajima ,  Hitoshi Takeuchi ,  Masaru Nomura ,  Kenji Ohta

Inventor： Junsaku Nakajima ,  Hitoshi Takeuchi ,  Masaru Nomura ,  Kenji Ohta

IPC: G11B7/00

CPC classification number: G11B20/00688 ,  G11B7/005 ,  G11B7/007 ,  G11B7/24085 ,  G11B20/00086

Abstract: An optical disk has a lead-in region provided at the inner circumference side and a user region provided at the outer circumference side. Pit string 3 of pits of different depths is formed in the lead-in region. Light beam reflected from the pit string is detected by detector and TPP and RF signals are output by differential amplifier and addition amplifier. A ternary signal is restored from pits based on the TPP and RF signals. Information is recorded by pits of the same depth in the user region. Recording information in the depth direction in the lead-in region increases the recording capacity thereof. The information recorded in the depth direction in the lead-in region cannot be transferred to a user region of another optical disk.

公开(公告)号：US06653024B1

公开(公告)日：2003-11-25

申请号：US09569849

申请日：2000-05-10

Applicant: Naomasa Shiraishi ,  Hitoshi Takeuchi ,  Soichi Owa

Inventor： Naomasa Shiraishi ,  Hitoshi Takeuchi ,  Soichi Owa

IPC: G03F900

CPC classification number: G03F7/707 ,  G03F1/48 ,  G03F1/50 ,  G03F7/70866

Abstract: A photomask including a substrate comprised of fluorite (calcium fluoride (CaF2)) and protective films comprised of chrome (Cr), chromium oxide (Cro), silicon oxide (SiO2 or SiO), etc. and formed at regions, other than the pattern region where the pattern to be transferred is formed, which contact other members when transporting the photomask or using it for exposure.

Abstract translation: 包括由萤石（氟化钙（CaF 2））构成的基板和由铬（Cr），氧化铬（Cro），氧化硅（SiO 2或SiO）等构成的保护膜的光掩模，并形成在图案以外的区域 形成要转印的图案的区域，其在运送光掩模时使用其它构件或将其用于曝光。

公开(公告)号：US5744379A

公开(公告)日：1998-04-28

申请号：US491581

申请日：1995-06-06

Applicant: Masaaki Mandai ,  Hitoshi Takeuchi ,  Yutaka Saito ,  Tomoyuki Yoshino

Inventor： Masaaki Mandai ,  Hitoshi Takeuchi ,  Yutaka Saito ,  Tomoyuki Yoshino

IPC: H01L21/98 ,  H01L23/538 ,  H01L25/18 ,  H01L21/18

CPC classification number: H01L25/50 ,  H01L23/5381 ,  H01L23/5385 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/01322 ,  H01L2924/10253

Abstract: The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image sensor chips 1 with each other, and the couple one semiconductor image sensor chip 1 to a driver substrate 3 which mounts thereon a semiconductor driving chip 2 for driving the semiconductor image sensor chips 1.

Abstract translation: 多芯片安装型的半导体图像传感器装置被构造成使得在芯片之间同时进行电气和机械连接。 耦合芯片4用于将多个半导体图像传感器芯片1彼此耦合，并且将一个半导体图像传感器芯片1耦合到驱动器基板3，驱动器基板3上安装用于驱动半导体图像传感器芯片1的半导体驱动芯片2。

公开(公告)号：US5639693A

公开(公告)日：1997-06-17

申请号：US347864

申请日：1994-12-01

Applicant: Osamu Koseki ,  Takichi Ishii ,  Masaaki Mandai ,  Tomoyuki Yoshino ,  Hitoshi Takeuchi

Inventor： Osamu Koseki ,  Takichi Ishii ,  Masaaki Mandai ,  Tomoyuki Yoshino ,  Hitoshi Takeuchi

IPC: H01L21/98 ,  H01L23/538 ,  H01L21/60

CPC classification number: H01L25/50 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73267 ,  H01L2224/92 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  Y10S438/94

Abstract: A process for fabricating a semiconductor device which permits the placement of plural semiconductor chip devices at a reduced pitch comprises the steps of bonding a plurality of semiconductor chip devices to a substrate, forming a conductive thin film on the substrate to cover at least connecting regions of the semiconductor chip devices, and patterning the conductive thin film using an excimer laser to form interconnections between the respective semiconductor chip devices. The conductive thin film is formed by a method selected from physical vapor deposition and chemical vapor deposition. The step of bonding the semiconductor chip devices to a substrate is preferably performed using an epoxy-based adhesive. Preferably, an insulating film is formed on the plural semiconductor chip devices in regions except for the connection regions. Patterning of the conductive thin film is performed using an excimer laser beam emitted in two pulses at an output energy of 300 mJ/cm.sup.2.

Abstract translation: 制造半导体器件的方法允许以减小的间距布置多个半导体芯片器件包括以下步骤：将多个半导体芯片器件接合到衬底上，在衬底上形成导电薄膜以至少覆盖至少连接区域 半导体芯片器件，并且使用准分子激光器对导电薄膜进行构图以在各个半导体芯片器件之间形成互连。 导电薄膜是通过选自物理气相沉积和化学气相沉积的方法形成的。 将半导体芯片器件接合到衬底的步骤优选使用环氧类粘合剂进行。 优选地，除了连接区域之外，在多个半导体芯片器件上形成绝缘膜。 使用在300mJ / cm 2的输出能量下以两个脉冲发射的准分子激光束进行导电薄膜的图案化。