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    CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME
    41.
    发明申请
    CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME 有权

    公开(公告)号：US20210112669A1

    公开(公告)日：2021-04-15

    申请号：US16597201

    申请日：2019-10-09

    Applicant: National Taiwan University of Science and Technology

    Inventor： CHIH-WEI CHIU ,  CHEN-YANG HUANG

    IPC: H05K3/42 ,  C25D5/02 ,  C25D5/34 ,  C25D7/00

    Abstract: A conductive slurry for plating comprises a carbon material, a dispersant, a binder, and a solvent. The carbon material, the dispersant and the binder are uniformly mixed in the solvent. The weight percentage of the carbon material is between 0.1% and 1%. The carbon material comprises a carbon nanotube, graphene, or a combination thereof. A plating method for a circuit board, which utilizes the conductive slurry, is also disclosed. The circuit board comprises at least a through hole. The plating method comprises a coating step, a first cleaning step, a first drying step, a first micro-etching step, a second cleaning step, an anti-oxidation step, a third cleaning step, a plating step, and a second drying step.

    STANDING TRAINING MOBILE DEVICE
    43.
    发明申请
    STANDING TRAINING MOBILE DEVICE 有权

    公开(公告)号：US20210038463A1

    公开(公告)日：2021-02-11

    申请号：US16720391

    申请日：2019-12-19

    Applicant: Chang Gung University ,  National Taiwan University of Science and Technology

    Inventor： WEN-YU LIU ,  HEN-YU LIEN ,  CHUNG-HSIEN KUO ,  YANG-HUA LIN

    IPC: A61H3/00

    Abstract: A standing training mobile device for carrying a patient to perform active-assisted upright locomotion is provided. The standing training mobile device includes a base, a mobile module, a lifting module, a control module, and a support module. The mobile module and the lifting module are disposed on the base. The control module is disposed on the lifting module and is coupled to the mobile module. The control module includes a manipulation platform and two control assemblies disposed on the manipulation platform for use of the patient. The support module includes a support frame, a first support assembly, a second support assembly, and a third support assembly. The first support assembly, the second support assembly, and the third support assembly are slidably disposed on the support frame respectively. The second support assembly is disposed between the first support assembly and the third support assembly.

    CEMENT-BASED CEMENTITIOUS MATERIAL AND ITS FORMATION METHOD
    44.
    发明申请
    CEMENT-BASED CEMENTITIOUS MATERIAL AND ITS FORMATION METHOD 审中-公开

    公开(公告)号：US20200377423A1

    公开(公告)日：2020-12-03

    申请号：US16580710

    申请日：2019-09-24

    Applicant: NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY

    Inventor： Chun-Tao Chen ,  Yue-Sheng Wang

    IPC: C04B40/00 ,  C04B14/14 ,  C04B28/24 ,  C04B22/06

    Abstract: A method for forming cement-based cementitious material includes: pouring a cement paste into a mold; applying an electrical current to the cement paste to perform an electro-osmotic reaction; and transferring the reacted cement paste into a water tank for curing, thereby obtaining a functionally graded cement-based cementitious material. A pair of electrodes is placed in the mold and connected to an external power source. The compressive strength of the functionally graded cement-based cementitious material in the middle is lower than that at either of both ends.

    ADJUSTABLE LEAKAGE INDUCTANCE TRANSFORMER
    45.
    发明申请
    ADJUSTABLE LEAKAGE INDUCTANCE TRANSFORMER 审中-公开

    公开(公告)号：US20200211755A1

    公开(公告)日：2020-07-02

    申请号：US16576333

    申请日：2019-09-19

    Applicant: National Taiwan University of Science and Technology

    Inventor： Yu-Chen Liu ,  Chen Chen ,  Kai-De Chen ,  YONG-LONG SYU ,  ANH DUNG NGUYEN ,  HUANG-JEN CHIU

    IPC: H01F21/02 ,  H02M3/335 ,  H01F27/28 ,  H01F27/24

    Abstract: An adjustable leakage inductance transformer includes a magnetic core, a primary side coil and a secondary side coil. The magnetic core includes a magnetic core column structure, which has a central column, a first outer column and a second outer column. The primary side coil is wound on the first outer column and the second outer column by a first primary side coil loop number and a second primary side coil loop number, respectively. The secondary side coil is wound on the first outer column and the second outer column by a first secondary side coil loop number and a second secondary side coil loop number, respectively, the first primary side coil loop number is not equal to the first secondary side coil loop number, and the second primary side coil loop number is not equal to the second secondary side coil loop number.

    METHOD AND SYSTEM FOR SORTING AND IDENTIFYING MEDICATION VIA ITS LABEL AND/OR PACKAGE
    49.
    发明申请
    METHOD AND SYSTEM FOR SORTING AND IDENTIFYING MEDICATION VIA ITS LABEL AND/OR PACKAGE 审中-公开

    公开(公告)号：US20200034658A1

    公开(公告)日：2020-01-30

    申请号：US16048446

    申请日：2018-07-30

    Applicant: MacKay Memorial Hospital ,  National Taiwan University of Science and Technology

    Inventor： Sheng-Luen CHUNG ,  Chih-Fang CHEN ,  Jing-Syuan WANG

    IPC: G06K9/62 ,  G06K9/32

    Abstract: Disclosed herein is an improved pharmaceutical management system and methods implemented by the system for sorting and identifying a medicine via its label and/or package. The method comprises steps of: (1) receiving a plurality of raw images of a package of a medication; (b) juxtaposing two of the plurality of raw images to produce a combined image, in which the two raw images are different from each other; (c) processing the combined image to produce a reference image; and (d) establishing the medication library with the aid of the reference image. The system comprises an image capturing device, an image processor, and a machine learning processor. The image processor is programmed with instructions to execute the method for producing a combined image.

    LIGHT EMITTING DIODE ARRAY PACKAGE STRUCTURE WITH HIGH THERMAL CONDUCTIVITY
    50.
    发明申请
    LIGHT EMITTING DIODE ARRAY PACKAGE STRUCTURE WITH HIGH THERMAL CONDUCTIVITY 审中-公开

    公开(公告)号：US20200028047A1

    公开(公告)日：2020-01-23

    申请号：US16508537

    申请日：2019-07-11

    Applicant: NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY

    Inventor： JUNG-CHIEH SU

    IPC: H01L33/64 ,  H01L25/075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

    Abstract: A light emitting diode (LED) array package structure includes a package substrate, a LED array, a high thermal conductive color conversion layer and a transparent ceramic substrate. The high thermal conductive color conversion layer includes a mixture of transparent optical resin, phosphor powder and transparent ceramic filler, and is directly dispensed on the LED array. The transparent ceramic substrate contacts directly the high thermal conductive color conversion layer. A portion of the transparent ceramic filler contacts the package substrate while another portion contacts the transparent ceramic substrate. The conduction and radiation heat generated by the high thermal conductive color conversion layer, and the conductive heating caused by the LED chips, both can be removed through either the package substrate or the transparent ceramic substrate, thereby improving the white light output power and being suitable for implementing with polymeric optical components to reduce glare and enhance luminous efficiency.

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