Implantable Neural Interface Device with a Connector having a Slitted Deformable Section
    41.
    发明申请
    Implantable Neural Interface Device with a Connector having a Slitted Deformable Section 有权
    具有可切割变形部分的连接器的可植入神经接口装置

    公开(公告)号:US20130184795A1

    公开(公告)日:2013-07-18

    申请号:US13741864

    申请日:2013-01-15

    Abstract: An improved deformable carrier or connector for an implantable neural interface device is described. The neural interface device comprises a carrier supporting at least one electrode array. The carrier comprises a tubular sidewall extending from a proximal carrier portion to a distal carrier portion. At least one deformable segment is provided in the carrier sidewall. The deformable segment is more pliable than the remainder of the carrier sidewall to preferably move in response to forces imparted on the carrier and the electrode array by the shifting forces in body tissue. The deformable segment takes the form of a thinned sidewall segment or a slitted wall segment.

    Abstract translation: 描述了用于可植入神经接口装置的改进的可变形载体或连接器。 神经接口装置包括支撑至少一个电极阵列的载体。 载体包括从近端载体部分延伸到远端载体部分的管状侧壁。 至少一个可变形段设置在承载器侧壁中。 可变形部分比载体侧壁的其余部分更柔韧,优选地响应于通过身体组织中的移动力施加在载体和电极阵列上的力而移动。 可变形段采取变薄的侧壁段或切开的壁段的形式。

    Methods for forming an electrode device with reduced impedance

    公开(公告)号:US11096614B2

    公开(公告)日:2021-08-24

    申请号:US15999381

    申请日:2018-08-20

    Inventor: John P. Seymour

    Abstract: A method for providing a neural interface system. At least one primary metallization layer is deposited on a substrate. The primary metallization layer has a thickness. A monolayer of nanospheres is deposited in a substantially uniform distribution. The nanospheres contact an upper surface of the primary metallization layer. The upper surface of the primary metallization layer not contacted by the nanospheres is treated to form a plurality of undulating structures having a substantially uniform arrangement. The treating comprises etching recesses part-way through the thickness of exposed portions of the primary metallization layer from the upper surface thereof.

    Implantable electrode and method of making the same

    公开(公告)号:US10688298B2

    公开(公告)日:2020-06-23

    申请号:US15600877

    申请日:2017-05-22

    Abstract: An implantable electrode system of is disclosed that includes a conductive electrode layer, an interconnect coupled to the electrode layer, an insulator that insulates the interconnect, and an anchor that more securely fixes the electrode layer in place. This structure is particularly useful with the electrode layer being a neural interface that is configured to provide either a recording or stimulating function. A method for forming such an implantable electrode system includes forming an interconnect over a base layer, forming an anchoring structure over the base layer, depositing an insulating material layer over the interconnect structure and over the anchoring structure, exposing a portion of the interconnect structure, forming an electrode layer over the insulating layer, the electrode layer contacting the exposed portion of the interconnect structure.

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