公开(公告)号：US20170309503A1

公开(公告)日：2017-10-26

申请号：US15624717

申请日：2017-06-16

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA

IPC: H01L21/67 ,  H02K41/02 ,  H01L23/00

CPC classification number: H01L21/67144 ,  H01L21/67259 ,  H01L24/78 ,  H01L2224/78824 ,  H01L2224/78901 ,  H01L2224/78981 ,  H02K11/21 ,  H02K41/02 ,  H02K41/031 ,  H02K2201/18 ,  H05K13/0406

Abstract: The disclosure shows a mounting apparatus including a primary pedestal with a mounting stage installed thereon, a gantry frame supported on the primary pedestal, mounting heads supported on the gantry frame in a manner movable in the Y direction, a secondary pedestal arranged apart from the primary pedestal, and a Y-direction load receiver installed on the secondary pedestal in a manner movable in the X direction and immovable in the Y direction, in which an X-direction stator is attached to the secondary pedestal, and in which one end of a Y-direction stator attached to the gantry frame and the Y-direction load receiver are connected using a connection member, thereby suppressing vibration of the primary pedestal caused when the plurality of mounting heads are moved in the X and Y directions.

公开(公告)号：US20170291251A1

公开(公告)日：2017-10-12

申请号：US15632570

申请日：2017-06-26

Applicant: Shinkawa Ltd.

Inventor： Shigeru HAYATA ,  Hiroya YUZAWA ,  Yusuke MATSUKI

IPC: B23K20/00 ,  H01L23/00 ,  H01L23/544

CPC classification number: B23K20/002 ,  B23K20/005 ,  B23K37/04 ,  H01L23/544 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/78 ,  H01L2224/78251 ,  H01L2224/78744

Abstract: Provided is a bonding apparatus including a bonding stage 83 for heating a substrate (lead frame) 61 placed on the upper surface thereof or a semiconductor die 63 mounted on the substrate (lead frame) 61, an imaging device 20 arranged above the bonding stage 83 to image the substrate 61 placed on the bonding stage 83 or the semiconductor die 63 mounted on the substrate 61, and a standing wave generating device 35 for generating an ultrasonic standing wave in the space between the upper surface of the bonding stage 83 and the imaging device 20. This improves the accuracy of image position detection by the imaging device with a simple structure.

公开(公告)号：US20170154864A1

公开(公告)日：2017-06-01

申请号：US15373982

申请日：2016-12-09

Applicant: SHINKAWA LTD.

Inventor： Shigeru HAYATA ,  Hiroya YUZAWA ,  Hiromi TOMIYAMA

IPC: H01L23/00 ,  B23K3/08 ,  B23K1/00

Abstract: A bonding apparatus 10 having a diagonal optical system 30, the bonding apparatus moves a capillary 24 down to a first heightwise position to calculate a position A11 of a tip end portion of the capillary 24 and a position A12 of a tip end portion of the capillary in an image on an imaging plane of the diagonal optical system 30, and similarly moves the capillary 24 down to a further lower second heightwise position to calculate a position A21 of the tip end portion of the capillary 24 and a position A22 of the tip end portion of the capillary in the image on the imaging plane. The bonding apparatus then estimates the position of the landing point of the capillary 24 on a bonding target 8 based on positional data for the four calculated positions A11, A12, A21, and A22, the first heightwise position, and the second heightwise position. With this, it is possible to use the diagonal optical system in the bonding apparatus to further improve positional accuracy in the bonding process.

公开(公告)号：US20160365331A1

公开(公告)日：2016-12-15

申请号：US15245193

申请日：2016-08-24

Applicant: SHINKAWA LTD.

Inventor： Yoshitaka TAKAGI

IPC: H01L23/00 ,  B23K20/00

CPC classification number: H01L24/78 ,  B23K20/004 ,  H01L2224/78301 ,  H01L2224/78611 ,  H01L2224/78631 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A wire tensioner has a wire passage through which a wire is inserted. The wire passage include: an inlet through which a compressed gas enters; a first outlet through which the compressed gas is discharged and is provided on an upper side of the inlet; a first flow contraction portion provided on the upper side of the inlet, and for contracting an area of the wire passage; a second flow contraction portion provided on a lower side of the inlet, and for contracting the area of the wire passage; a third flow contraction portion provided on a side of a bonding tool of the second flow contraction portion, and for making the flow of the compressed gas to the side of the bonding tool contracted; and a second outlet through which the compressed gas is discharged and is provided on the lower side of the second flow contraction portion.

Abstract translation: 线张紧器具有电线通道，电线通过该通道插入。 导线通道包括：压缩气体通过其入口的入口; 压缩气体排出的第一出口，设置在入口的上侧; 第一流动收缩部，其设置在所述入口的上侧，并且用于收缩所述线路通路的区域; 第二流动收缩部，设置在所述入口的下侧，并且用于收缩所述线通道的区域; 第三流动收缩部，设置在第二流动收缩部的接合工具的一侧，并使压缩气体流到粘合工具的一侧收缩; 以及第二出口，压缩气体通过该出口被排出并设置在第二流动收缩部分的下侧。

公开(公告)号：US20160365330A1

公开(公告)日：2016-12-15

申请号：US15239848

申请日：2016-08-18

Applicant: SHINKAWA LTD.

Inventor： Yoshihito HAGIWARA ,  Nobuo TAKAHASHI

IPC: H01L23/00

CPC classification number: H01L24/78 ,  B23K20/005 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/78301 ,  H01L2224/78353 ,  H01L2224/7855 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A method of manufacturing a semiconductor device is provided. A bonding tool with a wire tail extending out of the tip thereof is lowered to bring the tip of the wire tail into contact with a bonding surface of the semiconductor device. Next, the bonding tool in a direction intersecting with the axial direction of the bonding tool (Z direction) is moved to bend the wire tail with the tip of the wire tail in contact with the bonding surface. Then the bonding tool is lowered to form the wire tail into a predetermined shape such that the tip of the wire tail points upward. And then, a wire looping step, a second bonding step and a wire cutting step are performed. This allows the wire tail to be formed easily and efficiently into a predetermined shape.

Abstract translation: 提供一种制造半导体器件的方法。 具有延伸出其尖端的线尾的接合工具被降低以使线尾的末端与半导体器件的接合表面接触。 接下来，沿着与焊接工具的轴向（Z方向）相交的方向移动接合工具，使线尾弯曲，线尾部与接合面接触。 然后，接合工具被降低以将线尾形成预定的形状，使得线尾的尖端向上指向。 然后，执行线循环步骤，第二结合步骤和线切割步骤。 这样可以容易且有效地将线尾形成为预定的形状。

公开(公告)号：US20160358883A1

公开(公告)日：2016-12-08

申请号：US15241086

申请日：2016-08-19

Applicant: SHINKAWA LTD.

Inventor： HIROAKI YOSHINO ,  TOSHIHIKO TOYAMA

IPC: H01L23/00 ,  B23K20/00 ,  B23K20/26 ,  H01L25/10

CPC classification number: H01L24/81 ,  B23K20/004 ,  B23K20/26 ,  H01L21/486 ,  H01L21/4896 ,  H01L23/49827 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/742 ,  H01L24/75 ,  H01L24/78 ,  H01L24/85 ,  H01L25/10 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/742 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15333 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A bump forming method includes: a bonding step of bonding the leading end of a wire extending out of the tip of a bonding tool to a first point (X1); a wire pay-out step of moving the bonding tool in a direction away from the first point; a thin portion forming step of pressing a portion of the wire at a second point (X2) on a reference plane using the bonding tool to form a thin portion (64) in the wire; a wire shaping step of shaping the wire bonded to the first point in a manner rising from the reference plane; and a bump forming step of cutting the wire at the thin portion to form a bump (60) having a shape rising from the reference plane at the first point. It is therefore possible to form a bump having a desired height more easily and efficiently.

Abstract translation: 凸块形成方法包括：将从焊接工具的尖端延伸出的线的前端接合到第一点（X1）的接合步骤; 电线支出步骤，使焊接工具沿远离第一点的方向移动; 薄部形成步骤，使用所述接合工具在所述基准平面上的第二点（X2）处挤压所述线的一部分，以在所述线中形成薄部分（64）; 线形成步骤，以从所述参考平面起升的方式使与所述第一点结合的所述线成形; 以及凸起形成步骤，在所述薄部处切割所述线，以形成具有在所述第一点处从所述基准面上升的形状的凸块（60）。 因此，可以更容易且有效地形成具有期望高度的凸块。

公开(公告)号：US20160351535A1

公开(公告)日：2016-12-01

申请号：US15232828

申请日：2016-08-10

Applicant: SHINKAWA LTD.

Inventor： Naoki SEKINE ,  Motoki NAKAZAWA

IPC: H01L23/00 ,  B23K20/00

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/49427 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2224/7892 ,  H01L2224/851 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of manufacturing a semiconductor device includes: a wire tail forming step of forming a wire loop 130 between a first bonding point and a second bonding point with a bonding tool 40, and then cutting a portion of a wire 42 extending from a tip of the bonding tool 40 to thereby form a wire tail 43 at the tip of the bonding tool 40; and a wire tail bending step of bending the wire tail 43 so as to direct a tip 43a of the wire tail 43 upward by descending the bonding tool 40 toward the second bonding point with the wire loop 130 formed thereat and pressing the wire tail 43 against a portion of the wire loop 130 located above the second bonding point. Thus, the wire tail can be bent easily and efficiently.

Abstract translation: 一种制造半导体器件的方法包括：线尾形成步骤，用接合工具40在第一接合点和第二接合点之间形成线环130，然后切割从顶端延伸的线42的一部分 接合工具40，从而在接合工具40的尖端处形成线尾43; 以及线尾弯曲步骤，其弯曲线尾43，以便通过使接合工具40朝向第二接合点下降而引导线尾43的尖端43a，其中线环130形成在其上，并且将线尾43按压 导线回路130的位于第二接合点上方的部分。 因此，可以容易且有效地弯曲线尾。

公开(公告)号：US09362251B2

公开(公告)日：2016-06-07

申请号：US14678094

申请日：2015-04-03

Applicant: Shinkawa Ltd.

Inventor： Mitsuaki Sakakura ,  Toru Maeda

IPC: B23K37/00 ,  H01L23/00 ,  B23K20/00 ,  B23K3/08

CPC classification number: H01L24/742 ,  B23K3/082 ,  B23K20/007 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/781 ,  H01L2224/78253 ,  H01L2224/78268 ,  H01L2224/78269 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85054 ,  H01L2224/852 ,  H01L2224/85205 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/365 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00

Abstract: An antioxidant gas blow-off unit includes: a base portion configured as a hollow plate having an antioxidant gas flow passage formed therein; a hole that is provided in the base portion to allow a capillary to be inserted therein or removed therefrom and that communicates with the antioxidant gas flow passage; and a heater mounted on an outer surface of the base portion. The antioxidant gas flow passage includes a first flow passage provided in the vicinity of the outer surface of the base portion on which the heater is mounted. This antioxidant gas blow-off unit to be installed in a wire bonding apparatus heats free air balls effectively with a compact structure.

Abstract translation: 抗氧化剂气体吹出单元包括：基部，其构成为具有形成在其中的抗氧化剂气体流路的中空板; 设置在所述基部中的孔，以允许毛细管插入其中或从其中移除，并与所述抗氧化剂气体流动通道连通; 以及安装在基部的外表面上的加热器。 抗氧化剂气体流动通道包括设置在其上安装有加热器的基部的外表面附近的第一流动通道。 安装在引线接合装置中的该抗氧化气体吹出单元以紧凑的结构有效地加热空气球。

公开(公告)号：US09337166B2

公开(公告)日：2016-05-10

申请号：US14081104

申请日：2013-11-15

Applicant: Shinkawa Ltd.

Inventor： Yoshihito Hagiwara ,  Naoki Sekine ,  Koichi Takahashi ,  Yasuo Nagashima ,  Motoki Nakazawa

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/78802 ,  H01L2224/78804 ,  H01L2224/85047 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/95 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.

Abstract translation: 提供一种能够进行高速楔形丝接合的引线接合装置，该装置包括：具有通孔和用于按压线的按压表面的接合工具; 夹持电线的夹持器; 和控制单元。 所述控制单元包括：线尾延伸单元，其在将所述线材楔形接合到第一引线之后向上并沿着连接第二焊盘和第二引线的第二直线移动所述接合工具，并且使所述线材从所述第二引线延伸 沿着从第二衬垫到第二引线的第二直线的方向的通孔; 以及尾部切割单元，其在使所述线尾延伸之后，在所述夹持器关闭的同时沿着连接所述第二焊盘和所述第二引线的所述第二直线的方向移动所述焊接工具来切割所述线尾。

公开(公告)号：US20150243627A1

公开(公告)日：2015-08-27

申请号：US14709761

申请日：2015-05-12

Applicant: Shinkawa Ltd.

Inventor： Shinichi AKIYAMA ,  Naoki SEKINE ,  Motoki NAKAZAWA

IPC: H01L23/00 ,  H01L21/66

CPC classification number: H01L24/78 ,  H01L22/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/789 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85345 ,  H01L2224/85801 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2224/4554

Abstract: Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) is inserted; a nonsticking determination circuit (36) configured to apply a predetermined electrical signal between a bonding target and the wire (30) in a clamped state and to determine whether or not the wire (30) and the bonding target is sticking as well as whether or not the wire (30) is disconnected based on a response of the application of the predetermined electrical signal; an annular projecting length detection ring (40) disposed coaxially with the capillary (28); and a projecting length determination circuit (38) configured to determine whether or not a projecting length of a wire tail projecting from the tip of the capillary (28) is appropriate based on detection on whether or not power is conductive when a predetermined inspection voltage is applied between the wire (30) and the projecting length detection ring (40) as well as a presence of a discharge spark when a predetermined inspection high voltage is applied between the wire (30) and the projecting length detection ring (40).

Abstract translation: 提供一种引线接合装置（10），包括：毛细管（28），线（30）穿过该毛细管插入; 非贴片确定电路（36），被配置为在夹持状态下在接合目标和线（30）之间施加预定的电信号，并且确定线（30）和接合目标是否粘附以及是否或 不是根据预定电信号的应用的响应断开线（30）; 与毛细管（28）同轴设置的环形突出长度检测环（40）; 以及突出长度确定电路（38），其被配置为基于当预定检查电压是否为电力是否导通时检测从所述毛细管（28）的尖端突出的线尾的伸出长度是否适当 当在线（30）和突出长度检测环（40）之间施加预定的检查高电压时，施加在线（30）和突出长度检测环（40）之间以及存在放电火花。