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公开(公告)号：US20240162073A1
公开(公告)日：2024-05-16
申请号：US18015714
申请日：2021-11-16
Applicant: SHINKAWA LTD.
Inventor： Kohei SEYAMA
CPC classification number: H01L21/681 , H01L21/67144 , H01L21/67248
Abstract: A mounting apparatus obtains calibration values for calibrating a difference between coordinate values based on top-view and bottom-view images, for each assumed placement height of a planned placement area of a mounting body. A calibration controller calculates calibration values based on the top-view and bottom-view images from a bottom-view imaging unit and top-view imaging units employing a Scheimpflug optical system by imaging a calibration index matching the placement height. A mounting controller adjusts a position of a mounting tool so that a planned contact surface of the mounting body is at the placement height to recognize a reference position based on the bottom-view image, and adjusts positions of the top-view imaging units so that the focal plane falls on the same plane as the placement height to recognize a target position based on the top-view images of the planned placement area and the calibration values corresponding to the placement height.
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公开(公告)号：US20230274951A1
公开(公告)日：2023-08-31
申请号：US18015073
申请日：2020-08-05
Applicant: SHINKAWA LTD.
Inventor： Yuichiro NOGUCHI , Alexander DZHANGIROV , Kohei SEYAMA
IPC: H01L21/603 , H01L21/52 , H01L23/00
CPC classification number: H01L21/603 , H01L21/52 , H01L24/08 , H01L24/24 , H01L24/73 , H01L2021/6015
Abstract: In this mounting device (10) for mounting a semiconductor chip (100) on a substrate (104), a controller (50) is provided with: a mounter for pressing the semiconductor chip (100) to the substrate (104) in a state where a cover film (110) is interposed between the semiconductor chip (100) and a thermocompression tool (16), and for heating and then cooling the thermocompression tool (16) to mount the semiconductor chip (100) on the substrate (104); and a separator for heating the thermocompression tool (16) after the semiconductor chip (100) has been mounted, and for raising a mounting head (17) to be separated from the cover film (110).
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公开(公告)号：US20230154775A1
公开(公告)日：2023-05-18
申请号：US17915094
申请日：2020-12-14
Applicant: SHINKAWA LTD.
Inventor： Yuji EGUCHI , Kohei SEYAMA
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67259 , H01L21/67132 , H01L21/68764
Abstract: A semiconductor device manufacturing device (10) includes a stage (12), an installing head (14) that has a chip holding surface (26) and disposes a chip (100) on a substrate (110), a measuring mechanism (16) that measures a tilt angle of the chip (100) loaded on an installing surface (112) of the substrate (110) by the installing head (14) with respect to the installing surface (112) as a detection tilt angle Sd, a holding surface adjusting mechanism (18) that changes a holding surface tilt angle Sb which is a tilt angle of the chip holding surface (26) with respect to a loading surface (21), and a controller (20) that calculates a correction amount C of the holding surface tilt angle Sb based on the detection tilt angle Sd and changes the holding surface tilt angle Sb by the holding surface adjusting mechanism (18) according to the calculated correction amount C.
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公开(公告)号：US20170309503A1
公开(公告)日：2017-10-26
申请号：US15624717
申请日：2017-06-16
Applicant: SHINKAWA LTD.
Inventor： Kohei SEYAMA
CPC classification number: H01L21/67144 , H01L21/67259 , H01L24/78 , H01L2224/78824 , H01L2224/78901 , H01L2224/78981 , H02K11/21 , H02K41/02 , H02K41/031 , H02K2201/18 , H05K13/0406
Abstract: The disclosure shows a mounting apparatus including a primary pedestal with a mounting stage installed thereon, a gantry frame supported on the primary pedestal, mounting heads supported on the gantry frame in a manner movable in the Y direction, a secondary pedestal arranged apart from the primary pedestal, and a Y-direction load receiver installed on the secondary pedestal in a manner movable in the X direction and immovable in the Y direction, in which an X-direction stator is attached to the secondary pedestal, and in which one end of a Y-direction stator attached to the gantry frame and the Y-direction load receiver are connected using a connection member, thereby suppressing vibration of the primary pedestal caused when the plurality of mounting heads are moved in the X and Y directions.
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公开(公告)号：US20150183040A1
公开(公告)日：2015-07-02
申请号：US14597635
申请日：2015-01-15
Applicant: SHINKAWA LTD.
Inventor： Kohei SEYAMA , Yasuhiro CHIDA , Osamu KAKUTANI
CPC classification number: B23K3/085 , B23K1/0016 , B23K3/047 , B23K2101/42 , H01L24/75 , H01L2224/75502 , H05B3/141 , H05B3/26
Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.
Abstract translation: 本发明提供一种接合装置（30）的板状加热器，其特征在于，包括：接合工具（40）附接到所述下表面（31b）的下表面 和安装有绝热体（20）的上表面（31a）。 上表面31a设置有大量的毛细管狭缝35，大量的毛细管狭缝35和与上表面31a连接的绝热体20的匹配面21 ）形成大量从空腔（36）延伸到侧表面（33）的毛细管冷却剂流动路径（37）。 这允许有效地冷却用于粘合装置的加热器。
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Patent Agency Ranking
公开(公告)号：US20220165591A1
公开(公告)日：2022-05-26
申请号：US17602279
申请日：2020-04-07
Applicant: SHINKAWA LTD.
Inventor： Shigeyuki SEKIGUCHI , Yuji EGUCHI , Kohei SEYAMA
Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.
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公开(公告)号：US20200339375A1
公开(公告)日：2020-10-29
申请号：US16622292
申请日：2018-02-01
Applicant: SHINKAWA LTD.
Inventor： Kohei SEYAMA , Tetsuya UTANO
Abstract: A wiring structure (10) includes: a fixed member (14); a movable member (12) which moves rectilinearly with respect to the fixed member (14); a wire material (16) which connects the movable member (12) and the fixed member (14); a movable guide (18) over which the wire material (16) is stretched and which can move rectilinearly with respect to the fixed member (14); and a movement mechanism (20) which causes the movable guide (18) to move, in conjunction with the rectilinear movement of the movable member (12), rectilinearly in a direction in which the loosening or tightening of the wire material (16) caused by the rectilinear movement of the movable member (12) is offset.
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8.发明申请公开(公告)号：US20200279762A1
公开(公告)日：2020-09-03
申请号：US16650871
申请日：2018-08-28
Applicant: SHINKAWA LTD.
Inventor： Kohei SEYAMA , Tetsuya UTANO , Yuichiro NOGUCHI
IPC: H01L21/677 , H01L21/52
Abstract: The present invention is provided with: first and second bases, which are guided by a guide rail to thereby linearly move; a linear scale provided with graduations at predetermined pitches in the moving direction; and first and second encoder heads attached to the first and second bases. In the present invention, while maintaining, at a predetermined interval a, a distance between the first and second encoder heads, and moving the first and second bases along the guide rail, first and second graduation numbers, at which the first and second encoder heads are positioned, are sequentially detected from the first and second encoder heads, and the amount of movement of the first and second bases is controlled on the basis of the ratio between the predetermined interval a and the distance on the scale between the first graduation numbers and the second graduation numbers.
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公开(公告)号：US20190304852A1
公开(公告)日：2019-10-03
申请号：US16337927
申请日：2017-09-26
Applicant: SHINKAWA LTD.
Inventor： Kohei SEYAMA
Abstract: A method for manufacturing a semiconductor device and a mounting apparatus are provided. The method for manufacturing a semiconductor device includes: a placing step for placing, on a bonding surface, a temporary substrate which is transmissive with respect to an alignment mark; an image acquisition step for acquiring an image of the alignment mark and an image of a semiconductor die; a correction step for correcting, on the basis of the image of the alignment mark and the image of the semiconductor die acquired in the image acquisition step, the position in the horizontal direction of a bonding head that pressure bonds the semiconductor die to the temporary substrate; and a pressure bonding step for pressure bonding the semiconductor die to the transmissive substrate on the basis of the corrected position in the horizontal direction.
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公开(公告)号：US20170156244A1
公开(公告)日：2017-06-01
申请号：US15430562
申请日：2017-02-13
Applicant: SHINKAWA LTD.
Inventor： Akira SATO , Kohei SEYAMA
CPC classification number: H05K13/08 , H05K13/0812 , H05K13/0813
Abstract: A mounting apparatus for mounting an electronic component onto a substrate includes: a mounting tool (14) configured to hold the electronic component by a holding surface (14a) as a tip end surface of the mounting tool; a movement mechanism configured to move the mounting tool (14) relatively with respect to the substrate; an angle detection mechanism configured to measure an inclination of a planar-plated measurement jig (64) held by the holding surface (14a); and a controller configured to control driving of the mounting apparatus, wherein during inspection of the holding surface (14a), the controller causes the mounting tool (14) to hold the measurement jig (64), and the angle detection mechanism to measure the inclination of the measurement jig (64). With this, a mounting apparatus capable of measuring a condition of the holding surface of the mounting tool more correctly is provided.
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