BUSBAR ASSEMBLY
    42.
    发明申请
    BUSBAR ASSEMBLY 审中-公开

    公开(公告)号:US20200258833A1

    公开(公告)日:2020-08-13

    申请号:US16642789

    申请日:2018-08-24

    Inventor: Masaya NAKAGAWA

    Abstract: A busbar assembly according to the present invention includes a first busbar formed by a conductive metal flat plate; a second busbar formed by a conductive metal flat plate, the second busbar disposed in the same plane as the first busbar with a gap being provided between opposing side surfaces of the first and second busbars; and an insulating resin layer filled in the gap so as to mechanically connect the opposing side surfaces of the first and second busbars. Preferably, the opposing side surface of at least one of the first and second busbars is an inclined surface that is closer to the opposing side surface of the other of the first and second busbars from one side toward the other side in the thickness direction.

    Method for manufacturing substrate terminal board for mounting semiconductor element

    公开(公告)号:US10734562B2

    公开(公告)日:2020-08-04

    申请号:US16349450

    申请日:2017-11-13

    Abstract: Some embodiments provide a substrate terminal board in which the number of components is reduced by utilizing a conductor board per se constituting the substrate terminal board while ensuring heat dissipation, and which has a simple structure. Heat-dissipation fins can be cut and raised at a plurality of positions around element mounting portions of an upper-substrate conductor board, thus providing heat-dissipation fins and heat-dissipation openings. The upper-substrate conductor board can be coated with a paint film to form an upper substrate. A lower-substrate conductor board can be coated with the paint film to form a lower substrate. In a pressing/heating process, the lower substrate and the upper substrate can overlap each other and be vertically pressed while the lower substrate and the upper substrate are heated to completely cure the paint film, thereby causing the paint film on the lower substrate and the paint film on the upper substrate to adhere to each other.

    ACTUATOR UNIT FOR KNEE-ANKLE-FOOT ORTHOSIS
    44.
    发明申请

    公开(公告)号:US20200069505A1

    公开(公告)日:2020-03-05

    申请号:US16489542

    申请日:2017-04-28

    Abstract: An actuator unit of the present invention includes upper and lower frames respectively connectable to a thigh frame and a lower leg frame, an actuator-side rotational connecting part connecting both frames in a rotatable manner around a pivot axis, a driver producing driving force for rotating the lower frame around the pivot axis, upper and lower connecting bodies respectively connecting the upper frame to the thigh frame and the lower frame to the lower leg frame, and an intermediate connecting body connecting the vicinity of the actuator-side rotational connecting part to the vicinity of a brace-side rotational connecting part, the intermediate connecting body having a ball stud and an accommodation depression respectively provided on one and the other of the knee-ankle-foot orthosis and the actuator unit.

    METHOD FOR MANUFACTURING SUBSTRATE TERMINAL BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT

    公开(公告)号:US20190341538A1

    公开(公告)日:2019-11-07

    申请号:US16349450

    申请日:2017-11-13

    Abstract: Some embodiments provide a substrate terminal board in which the number of components is reduced by utilizing a conductor board per se constituting the substrate terminal board while ensuring heat dissipation, and which has a simple structure. Heat-dissipation fins can be cut and raised at a plurality of positions around element mounting portions of an upper-substrate conductor board, thus providing heat-dissipation fins and heat-dissipation openings. The upper-substrate conductor board can be coated with a paint film to form an upper substrate. A lower-substrate conductor board can be coated with the paint film to form a lower substrate. In a pressing/heating process, the lower substrate and the upper substrate can overlap each other and be vertically pressed while the lower substrate and the upper substrate are heated to completely cure the paint film, thereby causing the paint film on the lower substrate and the paint film on the upper substrate to adhere to each other.

    Bus ring unit
    46.
    发明授权

    公开(公告)号:US10396607B2

    公开(公告)日:2019-08-27

    申请号:US15121729

    申请日:2015-02-20

    Inventor: Yuusuke Adachi

    Abstract: In the present invention, single-phase bus rings have single-phase-side rounded regions that are disposed at intervals on a circle smaller than a neutral-point bus ring and are positioned so that its circumferential edges are displaced in the circumferential direction relative to neutral-point-side connecting regions of the neutral-point bus ring and are positioned in a second axial position that is farther from a stator than a first axial position on which the neutral-point bus ring is partially positioned, and a pair of single-phase-side projections that extend radially outward from the circumferential edges of adjacent single-phase-side rounded regions beyond portions of the neutral-point-side rounded regions positioned in the first axial position, and are connected to each other at distal ends.

    METHOD FOR MANUFACTURING SHUNT RESISTOR
    47.
    发明申请

    公开(公告)号:US20180286542A1

    公开(公告)日:2018-10-04

    申请号:US15765956

    申请日:2016-10-12

    Abstract: A manufacturing method of shunt resistor according to the present invention includes a step of calculating a difference between an initial resistance value and a desired resistance value as a resistance value to be adjusted, a step of providing a plurality of recess forming members capable of forming recesses each having a characteristic size in the surface of a resistive alloy plate, a recess determining step of determining the size and the number of the recesses necessary to be formed at the surface of the resistive alloy plate, and a recess forming step of forming the recesses according to the size and the number determined in the recess determining step by using the corresponding recess forming members.

    Magnetic Head Suspension
    50.
    发明申请
    Magnetic Head Suspension 有权
    磁头悬架

    公开(公告)号:US20130271875A1

    公开(公告)日:2013-10-17

    申请号:US13861122

    申请日:2013-04-11

    CPC classification number: G11B5/102 G11B5/4833

    Abstract: Assuming that a length in the suspension longitudinal direction between a distal edge of a supporting part and a dimple is represented by “L”, plural load beam part welding points at which spot welding are made for fixing a load beam part fixed region of a flexure base plate to a plate-like main body portion of a load beam part include paired right and left main welding points that are arranged symmetrically to each other with respect to a suspension longitudinal center line and that are disposed within a center region away from the distal edge of the supporting part by more than or equal to 0.4*L and less than or equal to 0.6*L.

    Abstract translation: 假设在支撑部件的远端边缘和凹坑之间的悬架纵向方向上的长度由“L”表示,则为了固定挠曲件的载荷梁部固定区域而形成点焊的多个负载梁部焊接点 负载梁部的板状主体部的基板包括相对于悬架纵向中心线彼此对称配置的成对的左右主焊接点,并且配置在远离远端的中心区域 支撑部分的边缘大于或等于0.4 * L且小于或等于0.6 * L。

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