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公开(公告)号：US20250041900A1
公开(公告)日：2025-02-06
申请号：US18713322
申请日：2021-11-25
Applicant: Suncall Corporation
Inventor： Satoru TAKASUGI
Abstract: An ultrasonic transducer having a rigid supporting plate having first and second surfaces on one side and the other side in a thickness direction; a plurality of cavity portions opened to the first surface; a plurality of waveguides having first end portions on one side that are opened to bottom surfaces of the cavity portions and second end portions on the other side that are opened to the second surface; a flexible resin film fixed to the first surface of the supporting plate to cover the cavity portions; the cavity portions fixed to the flexible film resin film overlapped by piezoelectric elements in their center regions and overlapped by the first surface of the supporting plate in a plan view in their peripheral regions; and an air passage capable of introducing outside air into a plurality of sound passages formed by the pluralities of cavity portions and waveguides.
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公开(公告)号：US20250007266A1
公开(公告)日：2025-01-02
申请号：US18884824
申请日：2024-09-13
Applicant: SUNCALL CORPORATION
Inventor： Shota TATSUMI
IPC: H02G5/00
Abstract: A busbar assembly of the present invention includes a plurality of busbars disposed in parallel in a common plane with a gap between adjacent busbars, and an insulative resin layer including a gap filling part and a first surface-side laminate part, the first surface-side laminate part having a plurality of first surface-side center openings that expose predetermined parts of first surfaces of the plurality of busbars respectively to form a plurality of exposure regions, the insulative resin layer being formed by an insulative resin material that is transparent in a half-cured state and nontransparent in a completely cured state.
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公开(公告)号：US20240355511A1
公开(公告)日：2024-10-24
申请号：US18756791
申请日：2024-06-27
Applicant: SUNCALL CORPORATION
Inventor： Yasuhiro MUKAI
Abstract: A bus bar which can be easily identified as having generated abnormal heat has an interior formed hollow and is made of heat-shrinkable resin. A bus bar main body is inserted into the hollow, and an identification member that can identify abnormal heat generation when the insulator is heat-shrunk due to the abnormal heat generation is provided in the hollow. Also, in fixing a part of the insulator to the bus bar main body, the insulator is fixed to the bus bar main body by heat-shrinking both end sides of the insulator so as not to come in contact with a left bolt hole and a right bolt hole.
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公开(公告)号：US12106869B2
公开(公告)日：2024-10-01
申请号：US17764086
申请日：2020-09-02
Applicant: Suncall Corporation
Inventor： Yuusuke Adachi
IPC: H01B5/02 , B23K26/0622 , B23K26/38 , H01B13/00
CPC classification number: H01B5/02 , B23K26/0622 , B23K26/38 , H01B13/0036
Abstract: A busbar assembly of the present invention includes first and second busbars disposed in parallel in a common plane with a gap therebetween, and an insulating resin layer including a gap filling part and an upper surface laminated part, the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, a part of the upper surface laminated part between the first and second busbar-side upper surface openings forming a partitioning wall.
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公开(公告)号：US12080453B2
公开(公告)日：2024-09-03
申请号：US18459188
申请日：2023-08-31
Applicant: Suncall Corporation
Inventor： Naoya Ashida , Kenji Murakami
IPC: H01C13/00
CPC classification number: H01C13/00
Abstract: A shunt resistor the resistive value of which can be lowered simply and easily has: a first resistive body, two base materials that sandwich the first resistive body therebetween and are joined by a welding to the first resistive body, and a second resistive body joined by a welding to the two base materials at different positions from the first resistive body. In addition, the second resistive body can come into contact with the first resistive body.
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Patent Agency Ranking
公开(公告)号：US12080452B2
公开(公告)日：2024-09-03
申请号：US17730543
申请日：2022-04-27
Applicant: SUNCALL CORPORATION
Inventor： Yuu Moriyama , Kenji Murakami , Akio Mugishima
CPC classification number: H01C1/148 , G01R1/203 , H01C1/1406 , H01C1/144
Abstract: A shunt resistor having improved temperature characteristics has a resistive body, a pair of base materials integrally formed on the resistive body across the resistive body, and measurement terminals fixed onto the base materials. The base materials have a plurality of cutout portions along a longitudinal direction of the base materials, wherein the plurality of cutout portions do not communicate with each other and are provided in a stepped manner.
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公开(公告)号：US20230378736A1
公开(公告)日：2023-11-23
申请号：US18031324
申请日：2021-09-24
Applicant: Suncall Corporation
Inventor： Shota TATSUMI , Yuusuke ADACHI
IPC: H02G5/00
Abstract: According to a manufacturing method of the present invention, it is possible to manufacture a busbar assembly in an efficient manner, the busbar assembly including busbars disposed in parallel in a common plane and an insulative resin layer including a gap filling portion filled into a gap between the adjacent busbars and a bottom-surface-side laminated portion extending integrally from the gap filling portion and arranged on bottom surfaces of the busbars, a top surface of the busbar being at least partially exposed to form a top-surface-side connection portion, the bottom surface of the busbar including a first bottom surface region which is located at the same position in a thickness direction as a lower end portion of the gap and on which the bottom-surface-side laminated portion is arranged and a second bottom surface region located farther away from the top surface than the first bottom surface region and exposed to the outside to form a bottom-surface-side connection portion.
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公开(公告)号：US11534359B2
公开(公告)日：2022-12-27
申请号：US16303957
申请日：2017-05-19
Applicant: SUNCALL CORPORATION , NATIONAL UNIVERSITY CORPORATION KYOTO INSTITUTE OF TECHNOLOGY , KYOTO UNIVERSITY
Inventor： Rei Takahashi , Yuichi Sawada , Yoshiyuki Higashi , Tadao Tsuboyama , Noriaki Ichihashi , Koji Ohata , Toshikazu Kawaguchi
Abstract: The present invention provides an actuator-equipped knee ankle foot orthosis in which a control device calculates a thigh phase angle based on an angle-related signal detected by a thigh orientation detecting means at one sampling point, applies the thigh phase angle at that sampling point to an assisting force control data, which is stored in the control device in advance and indicates the relationship between the thigh phase angle and a size of the assisting force to be imparted to a lower leg-side brace, to obtain the size of the assisting force to be imparted to the lower leg-side brace at that sampling point, and executes operational control for an actuator unit such that the assisting force having the size is output.
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公开(公告)号：US11488750B2
公开(公告)日：2022-11-01
申请号：US17084803
申请日：2020-10-30
Applicant: Suncall Corporation
Inventor： Hiroya Kobayakawa , Kenji Murakami
Abstract: A manufacturing method of shunt resistor according to the present invention includes a step of calculating a difference between an initial resistance value and a desired resistance value as a resistance value to be adjusted, a step of providing a plurality of recess forming members capable of forming recesses each having a characteristic size in the surface of a resistive alloy plate, a recess determining step of determining the size and the number of the recesses necessary to be formed at the surface of the resistive alloy plate, and a recess forming step of forming the recesses according to the size and the number determined in the recess determining step by using the corresponding recess forming members.
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公开(公告)号：US11127672B2
公开(公告)日：2021-09-21
申请号：US16642789
申请日：2018-08-24
Applicant: Suncall Corporation
Inventor： Masaya Nakagawa
Abstract: A busbar assembly according to the present invention includes a first busbar formed by a conductive metal flat plate; a second busbar formed by a conductive metal flat plate, the second busbar disposed in the same plane as the first busbar with a gap being provided between opposing side surfaces of the first and second busbars; and an insulating resin layer filled in the gap so as to mechanically connect the opposing side surfaces of the first and second busbars. Preferably, the opposing side surface of at least one of the first and second busbars is an inclined surface that is closer to the opposing side surface of the other of the first and second busbars from one side toward the other side in the thickness direction.
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