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    Magnetic refrigerating device and magnetic refrigerating method
    41.
    发明授权
    Magnetic refrigerating device and magnetic refrigerating method 有权
    磁性制冷装置及磁性制冷方法

    公开(公告)号：US08099964B2

    公开(公告)日：2012-01-24

    申请号：US11860818

    申请日：2007-09-25

    Applicant: Akiko Saito ,  Tadahiko Kobayashi ,  Hideyuki Tsuji ,  Hideo Iwasaki ,  Katsumi Hisano ,  Akihiro Koga ,  Akihiro Kasahara ,  Takuya Takahashi

    Inventor： Akiko Saito ,  Tadahiko Kobayashi ,  Hideyuki Tsuji ,  Hideo Iwasaki ,  Katsumi Hisano ,  Akihiro Koga ,  Akihiro Kasahara ,  Takuya Takahashi

    IPC: F25B21/00 ,  H01F7/02

    CPC classification number: F25B21/00 ,  F25B2321/0021 ,  F25B2321/0023 ,  Y02B30/66

    Abstract: A magnetic refrigerating device includes: a magnetic refrigerating unit including a magnetic material “A” exhibiting a magneto-caloric effect that the temperature of the material “A” is increased by the application of a magnetic field and the temperature of the material “A” is decreased by the removal of a magnetic field, a magnetic material “B” exhibiting a magneto-caloric effect that the temperature of the material “B” is decreased by the application of a magnetic field and the temperature of the material “B” is increased by the removal of a magnetic field, a heat conductive material “a” exhibiting higher heat conductivity under the application of a magnetic field and lower heat conductivity under the removal of a magnetic field, and a heat conductive material “b” exhibiting lower heat conductivity under the application of a magnetic field and higher heat conductivity under the removal of a magnetic field, wherein the magnetic refrigerating unit is configured so as to include at least one layered structure denoted by “AaBb” or “AbBa”; and a magnetic field-applying means to apply a magnetic field to the magnetic refrigerating unit.

    Abstract translation: 磁性制冷装置包括：磁性制冷装置，其具有表现出通过施加磁场使材料“A”的温度升高的磁热量效应的磁性材料“A”，并且材料“A”的温度 通过去除磁场而减少磁性材料“B”，表现出通过施加磁场使材料“B”的温度降低的磁热量效应的磁性材料“B”，并且材料“B”的温度为 通过除去磁场而增加，在磁场施加下表现出更高导热性的导热材料“a”，以及在去除磁场时具有较低热导率的导热材料“a”，以及表现出较低热量的导热材料“b” 在磁场的施加下的导电性和较高的导热性，其中磁性制冷单元是可旋转的 被设计为包括由“AaBb”或“AbBa”表示的至少一个分层结构; 以及向磁性制冷装置施加磁场的磁场施加装置。

    Electrical connection member with outer insulating film member and inner inclined spring member
    43.
    发明授权
    Electrical connection member with outer insulating film member and inner inclined spring member 有权
    具有外绝缘膜构件和内倾斜弹簧构件的电连接构件

    公开(公告)号：US07874867B2

    公开(公告)日：2011-01-25

    申请号：US12592356

    申请日：2009-11-24

    Applicant: Takuya Takahashi ,  Ryuzo Shimeno

    Inventor： Takuya Takahashi ,  Ryuzo Shimeno

    IPC: H01R12/24

    CPC classification number: H01R12/79 ,  H01R12/7052 ,  H01R12/777 ,  H01R12/89 ,  H01R13/2435 ,  H01R13/2442

    Abstract: In an electrical connection member having elasticity and adapted to be interposed between connection objects for electrically connecting them together, an inner member has a plurality of spring pieces each extending from a base plate portion, an outer member including a flexible insulating film and a plurality of conductive paths formed at the flexible insulating film. Each conductive path has a first and a second contact portion for connection to the connection objects. Each spring piece includes a root portion formed adjacent to the base plate portion and faced to a portion, corresponding to the second contact portion, of an inner surface of an intermediate portion of the insulating film. Each spring piece further includes an inclined spring portion extending obliquely from the root portion and faced to a portion, corresponding to the first contact portion, of the inner surface of the intermediate portion.

    Abstract translation: 在具有弹性并适于插入在连接对象之间用于将它们电连接在一起的弹性的电连接构件中，内部构件具有多个弹簧片，每个弹簧片从底板部分延伸，外部构件包括柔性绝缘膜和多个 形成在柔性绝缘膜上的导电路径。 每个导电路径具有用于连接到连接对象的第一和第二接触部分。 每个弹簧片包括邻近基板部分形成并面对绝缘膜的中间部分的内表面的与第二接触部分相对应的部分的根部。 每个弹簧片还包括倾斜的弹簧部分，该倾斜的弹簧部分从根部倾斜地延伸并且面对与中间部分的内表面相对应的与第一接触部分相对应的部分。

    Method Of Manufacturing Semiconductor Device Including Wiring Layout And Semiconductor Device
    44.
    发明申请
    Method Of Manufacturing Semiconductor Device Including Wiring Layout And Semiconductor Device 失效
    包括布线和半导体器件的半导体器件的制造方法

    公开(公告)号：US20100295184A1

    公开(公告)日：2010-11-25

    申请号：US12771067

    申请日：2010-04-30

    Applicant: Takuya Takahashi ,  Fumihiro Fuchino ,  Yuuichi Kohno ,  Masanori Miyata

    Inventor： Takuya Takahashi ,  Fumihiro Fuchino ,  Yuuichi Kohno ,  Masanori Miyata

    IPC: H01L23/48 ,  H01L21/3205

    CPC classification number: H01L23/53295 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of manufacturing a semiconductor device having a first wiring layer, a first interlayer insulating film, a second interlayer insulating film, a third interlayer insulating film, and a second wiring layer, in which the method includes depositing the second wiring layer on the third interlayer insulating film and, where the widths of first wiring layer and the second wiring layer are 10.0 μm or greater, executing one of etching the second wiring layer to set a width of 1.0 μm or greater in a portion where the first wiring layer and the second wiring layer overlap and etching the second wiring layer to seta horizontal distance of 2.0 μm or greater between adjacent portions of the first wiring layer and the second wiring layer.

    Abstract translation: 一种制造具有第一布线层，第一层间绝缘膜，第二层间绝缘膜，第三层间绝缘膜和第二布线层的半导体器件的方法，其中所述方法包括在第三布线层上沉积第二布线层 层间绝缘膜，并且其中第一布线层和第二布线层的宽度为10.0μm以上，在第一布线层和第二布线层的部分中执行蚀刻第二布线层以设定1.0μm以上的宽度 第二布线层重叠并蚀刻第二布线层，以在第一布线层和第二布线层的相邻部分之间设定2.0μm以上的水平距离。

    Content distributing server, content distributing method, and content distributing program
    46.
    发明授权
    Content distributing server, content distributing method, and content distributing program 失效
    内容分发服务器，内容分发方式和内容分发程序

    公开(公告)号：US07663048B2

    公开(公告)日：2010-02-16

    申请号：US11433899

    申请日：2006-05-12

    Applicant: Toshiaki Kaburagi ,  Takuya Takahashi

    Inventor： Toshiaki Kaburagi ,  Takuya Takahashi

    IPC: G04B13/00 ,  G10H7/00

    CPC classification number: G10H1/0058 ,  G10H2210/151 ,  G10H2230/021 ,  G10H2240/125

    Abstract: A content distributing server capable of reproducing desired display contents in conformity with reproduction of a desired musical composition. In response to a request from a terminal device, one of musical composition contents stored in a musical composition database is identified, and one of template contents stored in a template database is identified. A reproduction time length of the identified template content is adjusted according to a reproduction time length of the identified musical composition content. The adjusted template content is added to the musical composition content to generate a synthesized content, which is distributed to the terminal device.

    Abstract translation: 一种内容分发服务器，其能够根据期望的音乐作品的再现再现期望的显示内容。 响应于来自终端设备的请求，识别存储在音乐作品数据库中的乐曲内容之一，并且识别存储在模板数据库中的模板内容之一。 所识别的模板内容的再现时间长度根据所识别的音乐作品内容的再现时间长度被调整。 调整的模板内容被添加到音乐作品内容以生成分发给终端装置的合成内容。

    Intermediate connector
    48.
    发明申请
    Intermediate connector 有权
    中间连接器

    公开(公告)号：US20080182450A1

    公开(公告)日：2008-07-31

    申请号：US12077995

    申请日：2008-03-24

    Applicant: Takuya Takahashi ,  Takeshi Takahashi

    Inventor： Takuya Takahashi ,  Takeshi Takahashi

    IPC: H01R12/24

    CPC classification number: H01R12/79 ,  H01R12/88 ,  H01R43/007

    Abstract: In an electrical connector adapted to be interposed between two connection objects to electrically connect the connection objects to each other, a flexible conductive film, mounted on a base member, includes a flexible insulating film having an outer surface and an inner surface. The flexible insulating film is folded near a rear edge of the base member into a generally U shape with the outer surface kept on the outside. The flexible conductive film has a film conductive pattern formed not only the outer surface of the flexible insulating film but also on the inner surface of the flexible insulating film.

    Abstract translation: 在适于插入在两个连接对象之间以将连接对象彼此电连接的电连接器中，安装在基底构件上的柔性导电膜包括具有外表面和内表面的柔性绝缘膜。 柔性绝缘膜在基部构件的后边缘附近折叠成大致U形，外表面保持在外部。 柔性导电膜具有不仅形成柔性绝缘膜的外表面而且也形成在柔性绝缘膜的内表面上的膜导电图案。

    IC CARD AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE PACKAGE
    49.
    发明申请
    IC CARD AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE PACKAGE 失效
    IC卡和半导体集成电路器件封装

    公开(公告)号：US20080158835A1

    公开(公告)日：2008-07-03

    申请号：US12037713

    申请日：2008-02-26

    Applicant: Takuya TAKAHASHI ,  Kazuhiro Yamamoto ,  Minoru Ohara

    Inventor： Takuya TAKAHASHI ,  Kazuhiro Yamamoto ,  Minoru Ohara

    IPC: H05K5/02

    CPC classification number: G06K19/07745 ,  G06K19/07743 ,  H01L23/49855 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.

    Abstract translation: IC卡包括具有一个表面和与一个表面相对的另一个表面的半导体集成电路器件封装，在封装的一个表面上的卡片端子，以及包括附接到封装的另一个表面的凹入部分的基卡。 该封装包括布线板，布线板上的半导体集成电路芯片和涂覆在半导体集成电路芯片上的绝缘树脂。 包装是一个长方体包装。 绝缘树脂暴露于包装的另一个表面。 除了一个表面和另一个表面之外，绝缘树脂和布线板暴露于封装的四个表面。

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