公开(公告)号：US20240007610A1

公开(公告)日：2024-01-04

申请号：US18210665

申请日：2023-06-16

Applicant: Takuya TAKAHASHI ,  Daisuke SAITOH

Inventor： Takuya TAKAHASHI ,  Daisuke SAITOH

IPC: H04N13/361 ,  H04N13/111 ,  H04N13/194

CPC classification number: H04N13/361 ,  H04N13/111 ,  H04N13/194

Abstract: A display terminal includes circuitry to receive an operation for displaying a playback of a wide-angle view image related to a moving image recorded at a time of streaming of the moving image. The wide-angle view image has a wide viewing angle. The circuitry displays, on a display, a display area representing a predetermined area of the wide-angle view image based on viewpoint information for specifying the predetermined area, in response to receiving the operation. The predetermined area is displayed by a communication terminal at the time of streaming of the moving image.

公开(公告)号：US08647129B2

公开(公告)日：2014-02-11

申请号：US13551832

申请日：2012-07-18

Applicant: Takuya Takahashi ,  Ryuzo Shimeno ,  Tetsuya Komoto ,  Osamu Hashiguchi

Inventor： Takuya Takahashi ,  Ryuzo Shimeno ,  Tetsuya Komoto ,  Osamu Hashiguchi

IPC: H01R12/00

CPC classification number: H01R12/718 ,  H01R12/73

Abstract: Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.

Abstract translation: 提供了一种无壳连接器，其中布置成梳形并且用作触点的多个悬臂几乎不被损坏。 插座连接器（无壳连接器）由单个金属板形成并用于安装在插座侧基板上。 插座连接器包括布置成梳形并且用作触点的多个悬臂和围绕悬臂的外框体。 外框体包括一对侧板，其在与插座侧基板的连接器安装面平行的方向上夹着悬臂，并且在插入侧基板的相对侧设置有悬臂，其间插入有顶板。

公开(公告)号：US08599352B2

公开(公告)日：2013-12-03

申请号：US13596205

申请日：2012-08-28

Applicant: Takaaki Suzuki ,  Takuya Takahashi

Inventor： Takaaki Suzuki ,  Takuya Takahashi

IPC: G02F1/1343

CPC classification number: H01L27/124 ,  G02F1/1368 ,  H01L29/458

Abstract: A liquid crystal display device and method includes a pair of substrates with liquid crystal sandwiched therebetween, a plurality of intersecting scanning signal lines and image signal lines, a thin film transistor formed corresponding to each intersection, a pixel electrode which is formed in a pixel region and connected to the thin film transistor, a gate insulating film, and a protective insulating film. At least one of the scanning signal lines and the image signal lines are each formed of a laminated film including a first layer and a second layer, wherein the first layer is formed of a copper film having a purity of at least 99.5%, and the second layer is formed of an alloy film containing copper as a main component. The first layer and the second layer are collectively subjected to wet etching with an etchant having a predetermined pH.

Abstract translation: 一种液晶显示装置和方法，包括一对夹在其间的液晶的基板，多个相交的扫描信号线和图像信号线，对应于每个交点形成的薄膜晶体管，形成在像素区域中的像素电极 并连接到薄膜晶体管，栅极绝缘膜和保护绝缘膜。 扫描信号线和图像信号线中的至少一个各自由包括第一层和第二层的层叠膜形成，其中第一层由纯度为至少99.5％的铜膜形成，并且 第二层由含有铜作为主要成分的合金膜形成。 第一层和第二层用具有预定pH的蚀刻剂共同进行湿蚀刻。

公开(公告)号：US20130072037A1

公开(公告)日：2013-03-21

申请号：US13551832

申请日：2012-07-18

Applicant: Takuya TAKAHASHI ,  Ryuzo SHIMENO ,  Tetsuya KOMOTO ,  Osamu HASHIGUCHI

Inventor： Takuya TAKAHASHI ,  Ryuzo SHIMENO ,  Tetsuya KOMOTO ,  Osamu HASHIGUCHI

IPC: H01R12/50

CPC classification number: H01R12/718 ,  H01R12/73

Abstract: Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.

Abstract translation: 提供了一种无壳连接器，其中布置成梳形并且用作接触件的多个悬臂几乎不被损坏。 插座连接器（无壳连接器）由单个金属板形成并用于安装在插座侧基板上。 插座连接器包括布置成梳形并且用作触点的多个悬臂和围绕悬臂的外框体。 外框体包括一对侧板，其在与插座侧基板的连接器安装面平行的方向上夹着悬臂，并且在插入侧基板的相对侧设置有悬臂，其间插入有顶板。

公开(公告)号：US07531757B2

公开(公告)日：2009-05-12

申请号：US12037713

申请日：2008-02-26

Applicant: Takuya Takahashi ,  Kazuhiro Yamamoto ,  Minoru Ohara

Inventor： Takuya Takahashi ,  Kazuhiro Yamamoto ,  Minoru Ohara

IPC: H01L23/28

CPC classification number: G06K19/07745 ,  G06K19/07743 ,  H01L23/49855 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.

Abstract translation: IC卡包括具有一个表面和与一个表面相对的另一个表面的半导体集成电路器件封装，在封装的一个表面上的卡片端子，以及包括附接到封装的另一个表面的凹入部分的基卡。 该封装包括布线板，布线板上的半导体集成电路芯片和涂覆在半导体集成电路芯片上的绝缘树脂。 包装是一个长方体包装。 绝缘树脂暴露于包装的另一个表面。 除了一个表面和另一个表面之外，绝缘树脂和布线板暴露于封装的四个表面。

公开(公告)号：US20090075510A1

公开(公告)日：2009-03-19

申请号：US12231645

申请日：2008-09-04

Applicant: Akira Kuwahara ,  Takuya Takahashi ,  Hiroshi Akimoto ,  Seiya Takahashi ,  Yoshiaki Ishiyama ,  Hiroshi Endo

Inventor： Akira Kuwahara ,  Takuya Takahashi ,  Hiroshi Akimoto ,  Seiya Takahashi ,  Yoshiaki Ishiyama ,  Hiroshi Endo

IPC: H01R13/62

CPC classification number: H01R12/7076 ,  H01R13/2414 ,  H01R13/6641 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10325

Abstract: The present invention provides a socket for an element with an element electrode. The socket comprises a base shell, a cover shell and a contact member. The cover shell is engaged with the base shell so that the base shell and the cover shell define a cavity. Each of the base shell and the cover shell is made of a high thermal-conductive material. The contact member comprises an elastic member and a contact electrode provided on the elastic member and are designed and arranged so that the element is mountable on the contact member within the cavity with the element electrode connected to the contact electrode.

Abstract translation: 本发明提供了一种用于具有元件电极的元件的插座。 插座包括基座壳，盖壳和接触构件。 盖壳与基部壳体接合，使得底部壳体和盖壳体限定空腔。 每个基壳和盖壳由高导热材料制成。 接触构件包括弹性构件和设置在弹性构件上的接触电极，并且被设计和布置成使得元件可安装在腔内的接触构件上，元件电极连接到接触电极。

公开(公告)号：US07351920B2

公开(公告)日：2008-04-01

申请号：US10442959

申请日：2003-05-22

Applicant: Takuya Takahashi ,  Kazuhiro Yamamoto ,  Minoru Ohara

Inventor： Takuya Takahashi ,  Kazuhiro Yamamoto ,  Minoru Ohara

IPC: H01L23/28

CPC classification number: G06K19/07745 ,  G06K19/07743 ,  H01L23/49855 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.

Abstract translation: IC卡包括具有一个表面和与一个表面相对的另一个表面的半导体集成电路器件封装，在封装的一个表面上的卡片端子，以及包括附接到封装的另一个表面的凹入部分的基卡。 该封装包括布线板，布线板上的半导体集成电路芯片和涂覆在半导体集成电路芯片上的绝缘树脂。 包装是一个长方体包装。 绝缘树脂暴露于包装的另一个表面。 除了一个表面和另一个表面之外，绝缘树脂和布线板暴露于封装的四个表面。

公开(公告)号：US20070216279A1

公开(公告)日：2007-09-20

申请号：US11657694

申请日：2007-01-25

Applicant: Naohiro Horiuchi ,  Takuya Takahashi ,  Takaaki Suzuki ,  Etsuko Nishimura ,  Toshiaki Kusunoki

Inventor： Naohiro Horiuchi ,  Takuya Takahashi ,  Takaaki Suzuki ,  Etsuko Nishimura ,  Toshiaki Kusunoki

IPC: H01J19/06 ,  H01J1/62

CPC classification number: H01J31/127 ,  H01J29/04

Abstract: It is an object of the present invention to provide an image display using a thin film electronic source having a structure for separating picture elements in a self-alignment manner. The structure of bus wiring (scanning line) for powering the electronic source is formed by a stacked structure including a lower layer 17 made of an alloy of CrMo, an intermediate layer 18 made of Al or an alloy of Al, and an upper layer 19 made of Cr, from a cathode substrate 10. The CrMo alloy in the lower layer 17 includes 30 wt % or more of Mo. Such a stacked structure can be used to process one side of the lower layer 17 to form an undercut relative to the intermediate layer 18. The undercut serves as a picture element separating structure in sputtering of an upper electrode 13 of the electronic source and achieves picture element separation in a self-alignment manner.

Abstract translation: 本发明的目的是提供一种使用具有以自对准方式分离图像元素的结构的薄膜电子源的图像显示。 用于为电子源供电的总线布线（扫描线）的结构通过堆叠结构形成，该堆叠结构包括由AlM或Al合金制成的中间层18和CrMo的合金制成的下层17和上层19 由阴极基板10制成。 下层17中的CrMo合金包括30重量％以上的Mo。这种堆叠结构可用于处理下层17的一侧以相对于中间层18形成底切。 底切用作电子源的上电极13的溅射中的像素分离结构，以自对准的方式实现像素分离。

公开(公告)号：US07272629B2

公开(公告)日：2007-09-18

申请号：US10190244

申请日：2002-07-03

Applicant: Atsushi Yamaura ,  Hiroaki Takahashi ,  Takuya Takahashi ,  Takaaki Shibata

Inventor： Atsushi Yamaura ,  Hiroaki Takahashi ,  Takuya Takahashi ,  Takaaki Shibata

IPC: G06F13/00

CPC classification number: G06F17/3089 ,  G06F17/30749 ,  G06F17/30761 ,  G06Q30/06 ,  H04L67/06 ,  H04L67/22 ,  H04L67/30 ,  H04L69/329 ,  H04M19/04 ,  H04N7/17318 ,  H04N21/4622 ,  H04N21/4782 ,  H04N21/6131 ,  H04N21/84

Abstract: Portal server connects with a plurality of content supply servers and is also connectable with a client terminal via a communication network. Each of the plurality of content supply servers has music content. The portal server is accessed by the client terminal, and the portal server transmits, to the client terminal, a list of music content suppliable by the content supply servers, in response to a request from the client terminal. Desired music content can be selected in the client terminal on the basis of the list transmitted by the portal server, and selection information specifying the selected music content can be transmitted from the client terminal to the communication network. Then, in response to the selection information, the selected music content can be supplied from the content supply server having the selected music content.

Abstract translation: 门户服务器与多个内容供应服务器连接，并且也可以经由通信网络与客户终端连接。 多个内容提供服务器中的每一个具有音乐内容。 门户服务器由客户终端访问，并且门户服务器响应于来自客户终端的请求，向客户终端发送内容供应服务器可供应的音乐内容的列表。 可以根据由门户服务器发送的列表在客户终端中选择所需的音乐内容，并且可以从客户终端向通信网络发送指定所选音乐内容的选择信息。 然后，响应于选择信息，可以从具有所选择的音乐内容的内容提供服务器提供所选择的音乐内容。

公开(公告)号：US07176570B2

公开(公告)日：2007-02-13

申请号：US11191976

申请日：2005-07-29

Applicant: Takuya Takahashi

Inventor： Takuya Takahashi

IPC: H01L23/48

CPC classification number: H01L24/85 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/14 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by deforming a portion of the wire continuous with the tip on the tip by using the tool. The wire is cut while leaving the bump on the electrode.

Abstract translation: 通过使用工具将形成为球形的线的末端接合到电极。 线的一部分从结合到电极的尖端拉出。 通过使用该工具使电极的与尖端连续的部分的电极变形，从而在电极上形成凸块。 在电极上留下凸块的同时切割电线。