Abstract:
A transistor device that includes at least two transistors, each transistor including a source region, a drain region, and a shallow trench isolation formed between and contiguous with the source and drain regions, wherein the shallow trench isolation electrically isolates the source and drain regions to minimize the short-channel effects, a conductor layer disposed over the source region, shallow trench isolation, and drain region, wherein the conductor layer electrically connects the source and drain regions to serve as a channel region, a gate oxide disposed over the conductor layer, and a gate structure formed over the gate oxide.
Abstract:
A method for operating a P-channel SONOS memory device that has a charge trapping layer located on a substrate, a gate electrode located on the trapping layer, two doped regions located in the substrate at each side of the charge trapping layer. The two doped regions are set to be a drain region and a source region. When a programming action is intended, the gate electrode and the drain region are applied with a first negative high-level bias, and the source region and the substrate are applied with a grounded voltage. When an erasing action is intended, the gate electrode is a second negative bias which is smaller than the first negative voltage in absolute value. In the mean time, the drain region is applied with the third negative bias and the substrate is applied with a grounded voltage. The third negative voltage is larger than the second negative bias in absolute value.
Abstract:
A mask ROM device is described. The mask ROM device includes a substrate, a gate, a double diffused source/drain region that comprises a first doped region and a second doped region, a channel region, a coding region, a dielectric layer and a word line. The gate is disposed on the substrate. The double diffused source/drain region is positioned beside the sides of the gate in the substrate, wherein the second doped region is located at the periphery of the first doped region in the substrate. The channel region is located between the double diffused source/drain region in the substrate. The coding region is disposed in the substrate at the intersection between the sides of the channel region and the double diffused source/drain region. The dielectric layer is disposed above the double diffused source/drain region, while the word line is disposed above the dielectric layer and the gate.
Abstract:
A metal oxide semiconductor field effect transistor structure is disclosed. A p-shape gate, disposed over a semiconductor substrate. A gate dielectric layer is disposed in between the p-shape gate and the semiconductor substrate. A drain region is disposed within the semiconductor substrate, wherein the drain region is surrounded by the p-shape gate. A source region is disposed within the semiconductor substrate, wherein the source region surrounds the p-shape gate. A silicide structure is disposed on the source/drain regions and the p-shape gate.
Abstract:
A substrate pump circuit and method for I/O ESD protection including NMOS fingers connected to the interconnection between an I/O pad and an internal circuit comprises a MOS device connected to the interconnection between the I/O pad and the internal circuit and the substrate under the control of a switch to turn it on to conduct a pumping current through the substrate resistor when the I/O pad is under ESD stress, so as to pull up the potential of the substrate adjacent to the NMOS fingers, resulting in the reduction of the triggering voltage of the NMOS fingers.
Abstract:
A reference current generation circuit for the multiple bit flash memory provided by the present invention applies the same boosted word-line voltage to a voltage dividing circuit of the different reference current generation unit, so as to generate a gate voltage for the different reference current generation unit's reference cell to obtain the reference currents with different levels that are needed. Therefore, it effectively solves the problem of the reference currents having different drifts along with the variance of the temperature and the power voltage Vcc.
Abstract:
A 2-bit mask ROM device and a fabrication method thereof are described. The 2-bit mask ROM device includes a substrate; a gate structure, disposed on a part of the substrate; a 2-bit code region, configured in the substrate beside both sides of the gate structure; at least one spacer, disposed on both sides of the gate structure; a buried drain region, configured in the substrate beside both sides of the spacer; a doped region, configured in the substrate between the buried drain region and the 2-bit code region, wherein the dopant type of the doped region is different from that for the 2-bit code region and the dopant concentration in the doped region is higher than that in the 2-bit code region; an insulation layer, disposed above the buried drain region; and a word line disposed on the gate structures along a same row.
Abstract:
An embedded SCR in conjunction with a Gated-NMOS is created for protecting a chip input or output pad from ESD, by inserting a p+ diffusion and the n-well in the drain side and a part of the drain to forms a low-trigger, high efficiency SCR. The device layout is such that the drain connection is tightly tied together at the p+ diffusion and the n+ drain making that connection very short and, thereby, preventing latch-up. The parasitic SCR is contained entirely within the n+ diffusion (the source of the grounded gate NMOS transistor) at either side of the structure and, therefore, called an embedded SCR. For a 12 volt I/O device each of two n+ drains is placed in its own n-type doped drain (ndd) area straddling halfway the n-well. The structure is repeated as required and a p+ diffusion is implanted at both perimeters and connected to the nearest n+ source and a reference voltage.
Abstract:
A transistor device that includes at least two transistors, each transistor including a source region, a drain region, and a shallow trench isolation formed between and contiguous with the source and drain regions, wherein the shallow trench isolation electrically isolates the source and drain regions to minimize the short-channel effects, a conductor layer disposed over the source region, shallow trench isolation, and drain region, wherein the conductor layer electrically connects the source and drain regions to serve as a channel region, a gate oxide disposed over the conductor layer, and a gate structure formed over the gate oxide.
Abstract:
A circuit structure for measuring a capacitive load. The capacitive load is coupled between a first and a second nodes, and drains of a first PMOS and a first NMOS transistors are coupled to the first node, and drains of a second PMOS and a second NMOS transistors are coupled to the second node, and a pad is coupled to the second node. First, sources of the first and the second PMOS transistors and sources of the first and the second NMOS transistors are biased at a power source and a ground respectively. A non-synchronized voltage is applied to gates of the first and the second PMOS transistors and to gates of the first and the second NMOS transistors simultaneously. By grounding and floating the pad, a current flowing through the capacitive load is obtained to calculate the capacitance.