公开(公告)号：US20180091896A1

公开(公告)日：2018-03-29

申请号：US15613054

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Simon K. Porter ,  John H. Sheerin ,  Glenn K. Trainer ,  Jason C. Della Rosa ,  Ethan L. Huwe ,  Sean T. McIntosh ,  Erik L. Wang ,  Christopher J. Stringer ,  Molly J. Anderson

IPC: H04R1/40 ,  H04R1/02 ,  H04R3/12

CPC classification number: H04R1/2888 ,  F21V3/00 ,  F21V5/007 ,  F21V23/0485 ,  F21V33/0056 ,  G06F3/01 ,  G06F3/016 ,  G06F3/0202 ,  G06F3/03547 ,  G06F3/041 ,  G06F3/044 ,  G06F3/165 ,  H01H13/023 ,  H03K17/962 ,  H03K2217/960785 ,  H04R1/025 ,  H04R1/026 ,  H04R1/26 ,  H04R1/2811 ,  H04R1/2826 ,  H04R1/30 ,  H04R1/403 ,  H04R3/00 ,  H04R3/12 ,  H04R5/02 ,  H04R7/12 ,  H04R7/127 ,  H04R7/18 ,  H04R9/022 ,  H04R9/025 ,  H04R9/06 ,  H04R31/006 ,  H04R2201/028 ,  H04R2201/34 ,  H04R2201/401 ,  H04R2400/03 ,  H04R2400/13 ,  H04R2420/07 ,  H05K1/0274 ,  H05K1/141 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10378

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20180091879A1

公开(公告)日：2018-03-29

申请号：US15613066

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Ethan L. Huwe ,  Glenn K. Trainer ,  Javier Mendez ,  Sean T. McIntosh

IPC: H04R1/02 ,  G06F3/16

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20180091878A1

公开(公告)日：2018-03-29

申请号：US15613003

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： Jason C. Della Rosa ,  Ethan L. Huwe ,  Glenn K. Trainer ,  Simon K. Porter

IPC: H04R1/02 ,  H04R7/18 ,  H04R9/06 ,  H04R9/02 ,  H04R3/00 ,  H04R7/12

CPC classification number: H04R1/2888 ,  F21V3/00 ,  F21V5/007 ,  F21V23/0485 ,  F21V33/0056 ,  G06F3/01 ,  G06F3/016 ,  G06F3/0202 ,  G06F3/03547 ,  G06F3/041 ,  G06F3/044 ,  G06F3/165 ,  H01H13/023 ,  H03K17/962 ,  H03K2217/960785 ,  H04R1/025 ,  H04R1/026 ,  H04R1/26 ,  H04R1/2811 ,  H04R1/2826 ,  H04R1/30 ,  H04R1/403 ,  H04R3/00 ,  H04R3/12 ,  H04R5/02 ,  H04R7/12 ,  H04R7/127 ,  H04R7/18 ,  H04R9/022 ,  H04R9/025 ,  H04R9/06 ,  H04R31/006 ,  H04R2201/028 ,  H04R2201/34 ,  H04R2201/401 ,  H04R2400/03 ,  H04R2400/13 ,  H04R2420/07 ,  H05K1/0274 ,  H05K1/141 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10378

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20170094386A1

公开(公告)日：2017-03-30

申请号：US15169563

申请日：2016-05-31

Applicant: APPLE INC.

Inventor： Glenn K. Trainer ,  Scott C. Grinker ,  Ethan L. Huwe ,  Craig M. Stanley

IPC: H04R1/10 ,  G10K11/178 ,  G06F3/16 ,  H04R1/08

Abstract: A low-profile earbud is disclosed that sits securely within an ear of a user. The earbud includes a protruding portion that passes through a channel defined by the tragus and anti-tragus of the ear. In some embodiments, the protruding portion can take the form of a cable configured to supply power and transfer data to the earbud. In some embodiments, the protruding portion can provide additional space for electrical components and sensors supporting the earbud.

公开(公告)号：US11979703B2

公开(公告)日：2024-05-07

申请号：US17992332

申请日：2022-11-22

Applicant: APPLE INC.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  G01V3/08 ,  H01F7/02 ,  H04B1/38 ,  H04B1/3827 ,  H04R1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H04R1/1016 ,  A45C11/00 ,  A45C13/005 ,  E05F1/1261 ,  E05F3/20 ,  G01V3/081 ,  H01F7/02 ,  H04R1/023 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1091 ,  H05K5/0086 ,  H05K5/0217 ,  H05K5/0226 ,  H05K5/03 ,  A45C2011/001 ,  E05Y2201/224 ,  E05Y2900/602 ,  H04B1/38 ,  H04B2001/3866 ,  H04R1/1025 ,  H04R2400/11 ,  H04R2420/07 ,  H04R2460/11

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US11647319B2

公开(公告)日：2023-05-09

申请号：US17202283

申请日：2021-03-15

Applicant: Apple Inc.

Inventor： Ethan L. Huwe ,  Brad G. Boozer ,  Erik L. Wang ,  Phillip Qian

IPC: H04R1/00 ,  H04R1/10

CPC classification number: H04R1/1016 ,  H04R1/1058

Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

公开(公告)号：US20230088030A1

公开(公告)日：2023-03-23

申请号：US17992332

申请日：2022-11-22

Applicant: APPLE INC.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US20230078536A1

公开(公告)日：2023-03-16

申请号：US17832346

申请日：2022-06-03

Applicant: Apple Inc.

Inventor： Ali N. Ergun ,  Bilal Mohamed Ibrahim Kani ,  Chang Liu ,  Ethan L. Huwe ,  Jeffrey J. Terlizzi ,  Jerzy S. Guterman ,  Jue Wang ,  Kishore N. Renjan ,  Kyusang Kim ,  Lan H. Hoang ,  Mandar S. Painaik ,  Manoj Vadeentavida ,  Sarah B. Gysbers ,  Takayoshi Katahira ,  Zhiqi Wang

IPC: H05K1/02 ,  H05K1/11 ,  H01Q1/22 ,  H01Q1/36

Abstract: System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.

公开(公告)号：US20220141566A1

公开(公告)日：2022-05-05

申请号：US17648418

申请日：2022-01-19

Applicant: APPLE INC.

Inventor： Glenn K. Trainer ,  Scott C. Grinker ,  Ethan L. Huwe ,  Craig M. Stanley

IPC: H04R1/10 ,  G10K11/178

Abstract: A low-profile earbud is disclosed that sits securely within an ear of a user. The earbud includes a protruding portion that passes through a channel defined by the tragus and anti-tragus of the ear. In some embodiments, the protruding portion can take the form of a cable configured to supply power and transfer data to the earbud. In some embodiments, the protruding portion can provide additional space for electrical components and sensors supporting the earbud.

公开(公告)号：US11206472B2

公开(公告)日：2021-12-21

申请号：US16584920

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Benjamin A. Cousins ,  Esge Andersen ,  Mei Zhang ,  Brian R. Twehues ,  Ethan L. Huwe ,  Thanh P. Hua

IPC: H04R1/10 ,  H04R1/02 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04B1/38 ,  H04B1/3827

Abstract: Embodiments describe an acoustic shielding component including a stiffener formed of a rigid material providing structural integrity to the acoustic shielding component, a cosmetic mesh comprising a plurality of interlaced wires, and an acoustic mesh disposed between the stiffener and the cosmetic mesh. The stiffener includes first and second walls extending along a length of the stiffener and a plurality of ribs spaced apart from each other and extending between the first and second walls. The cosmetic mesh includes a mesh cover disposed over the stiffener and having an outer surface and an inner surface, and a mesh wall extending from an outer periphery of the inner surface of the mesh cover and defining a tab.