Feed Patches for Multi-Layer Dielectric Resonator Antennas

    公开(公告)号:US20240106134A1

    公开(公告)日:2024-03-28

    申请号:US17951877

    申请日:2022-09-23

    Applicant: Apple Inc.

    CPC classification number: H01Q21/065 H01Q9/0414

    Abstract: An electronic device may be provided with a phased antenna array having a dielectric resonator antenna. The antenna may include a first dielectric block on a printed circuit, a second dielectric block on the first dielectric block, and a third dielectric block on the second dielectric block. At least the second and third dielectric blocks may have different dielectric constants. The antenna may be fed by one or more feed probes. Each feed probe may include respective conductive via and a conductive patch coupled to the conductive via. The conductive via may extend through the first dielectric block. The conductive patch may be sandwiched between the first and second dielectric blocks. The conductive patch may have a width that configures the conductive patch to form a smooth impedance transition between the conductive via and each of the dielectric blocks despite the different materials used to form the antenna.

    Multi-Layer Dielectric Resonator Antennas with Parasitic Elements

    公开(公告)号:US20240106128A1

    公开(公告)日:2024-03-28

    申请号:US17951938

    申请日:2022-09-23

    Applicant: Apple Inc.

    CPC classification number: H01Q9/0485 H01Q5/385 H01Q9/0414 H01Q15/0026

    Abstract: An electronic device may be provided with a phased antenna array having a dielectric resonator antenna. The antenna may include a first dielectric block on a printed circuit, a second dielectric block on the first dielectric block, and a third dielectric block on the second dielectric block. At least the second and third dielectric blocks may have different dielectric constants. A parasitic element may be disposed between the second and third dielectric resonating elements and/or a parasitic element may be disposed on a radiative face of the third dielectric resonating element. The parasitic elements may act as electromagnetic mirrors that form images of electric fields in the dielectric resonating elements. The images may make the dielectric resonating elements exhibit a greater electromagnetic height than physical height. This may allow for a reduction in the overall physical height of the dielectric resonator antenna without sacrificing wireless performance.

    Systems and methods for testing multiple mmWave antennas

    公开(公告)号:US11791908B2

    公开(公告)日:2023-10-17

    申请号:US17335607

    申请日:2021-06-01

    Applicant: Apple Inc.

    CPC classification number: H04B17/101 H01Q15/14 H04B7/0408

    Abstract: A testing system may include a test electronic device having a test antenna disposed in a first signal path of a first antenna array of an electronic device. The test antenna may receive a first signal from the first antenna array. The testing system may also include a reflector disposed in a second signal path of a second antenna array of the electronic device. The reflector may reflect a second signal from the second antenna array to the test antenna. The reflector may include a flat, parabolic, or elliptical curvature that reflects a radio frequency signal emitted by the second antenna array to the test antenna.

    Electronic devices with dielectric resonator antennas

    公开(公告)号:US11728569B2

    公开(公告)日:2023-08-15

    申请号:US17111131

    申请日:2020-12-03

    Applicant: Apple Inc.

    CPC classification number: H01Q9/0485 H01Q1/243 H01Q21/0075

    Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.

    SYSTEMS AND METHODS FOR TESTING MULTIPLE MMWAVE ANTENNAS

    公开(公告)号:US20220385378A1

    公开(公告)日:2022-12-01

    申请号:US17335607

    申请日:2021-06-01

    Applicant: Apple Inc.

    Abstract: A testing system may include a test electronic device having a test antenna disposed in a first signal path of a first antenna array of an electronic device. The test antenna may receive a first signal from the first antenna array. The testing system may also include a reflector disposed in a second signal path of a second antenna array of the electronic device. The reflector may reflect a second signal from the second antenna array to the test antenna. The reflector may include a flat, parabolic, or elliptical curvature that reflects a radio frequency signal emitted by the second antenna array to the test antenna.

    Multi-Layer Matching Structures for High Frequency Signal Transmission

    公开(公告)号:US20220109464A1

    公开(公告)日:2022-04-07

    申请号:US17223888

    申请日:2021-04-06

    Applicant: Apple Inc.

    Abstract: An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.

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