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公开(公告)号:US20240106134A1
公开(公告)日:2024-03-28
申请号:US17951877
申请日:2022-09-23
Applicant: Apple Inc.
Inventor: Subramanian Ramalingam , David Garrido Lopez , Forhad Hasnat , Harish Rajagopalan , Panagiotis Theofanopoulos
CPC classification number: H01Q21/065 , H01Q9/0414
Abstract: An electronic device may be provided with a phased antenna array having a dielectric resonator antenna. The antenna may include a first dielectric block on a printed circuit, a second dielectric block on the first dielectric block, and a third dielectric block on the second dielectric block. At least the second and third dielectric blocks may have different dielectric constants. The antenna may be fed by one or more feed probes. Each feed probe may include respective conductive via and a conductive patch coupled to the conductive via. The conductive via may extend through the first dielectric block. The conductive patch may be sandwiched between the first and second dielectric blocks. The conductive patch may have a width that configures the conductive patch to form a smooth impedance transition between the conductive via and each of the dielectric blocks despite the different materials used to form the antenna.
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公开(公告)号:US20240106128A1
公开(公告)日:2024-03-28
申请号:US17951938
申请日:2022-09-23
Applicant: Apple Inc.
Inventor: Subramanian Ramalingam , David Garrido Lopez , Forhad Hasnat , Harish Rajagopalan , Panagiotis Theofanopoulos
CPC classification number: H01Q9/0485 , H01Q5/385 , H01Q9/0414 , H01Q15/0026
Abstract: An electronic device may be provided with a phased antenna array having a dielectric resonator antenna. The antenna may include a first dielectric block on a printed circuit, a second dielectric block on the first dielectric block, and a third dielectric block on the second dielectric block. At least the second and third dielectric blocks may have different dielectric constants. A parasitic element may be disposed between the second and third dielectric resonating elements and/or a parasitic element may be disposed on a radiative face of the third dielectric resonating element. The parasitic elements may act as electromagnetic mirrors that form images of electric fields in the dielectric resonating elements. The images may make the dielectric resonating elements exhibit a greater electromagnetic height than physical height. This may allow for a reduction in the overall physical height of the dielectric resonator antenna without sacrificing wireless performance.
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公开(公告)号:US20240072417A1
公开(公告)日:2024-02-29
申请号:US18502979
申请日:2023-11-06
Applicant: Apple Inc.
Inventor: Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q9/0414 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号:US11811133B2
公开(公告)日:2023-11-07
申请号:US17314740
申请日:2021-05-07
Applicant: Apple Inc.
Inventor: Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号:US11791908B2
公开(公告)日:2023-10-17
申请号:US17335607
申请日:2021-06-01
Applicant: Apple Inc.
Inventor: Sze Yang Dennis Ng , Jr-Yi Shen , Harish Rajagopalan
IPC: H04B17/10 , H04B7/0408 , H01Q15/14
CPC classification number: H04B17/101 , H01Q15/14 , H04B7/0408
Abstract: A testing system may include a test electronic device having a test antenna disposed in a first signal path of a first antenna array of an electronic device. The test antenna may receive a first signal from the first antenna array. The testing system may also include a reflector disposed in a second signal path of a second antenna array of the electronic device. The reflector may reflect a second signal from the second antenna array to the test antenna. The reflector may include a flat, parabolic, or elliptical curvature that reflects a radio frequency signal emitted by the second antenna array to the test antenna.
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公开(公告)号:US20230327339A1
公开(公告)日:2023-10-12
申请号:US18335905
申请日:2023-06-15
Applicant: Apple Inc.
Inventor: Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Mattia Pascolini
CPC classification number: H01Q9/0407 , H01Q5/40 , H01Q1/241 , H01Q3/2658 , H01Q3/267
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a probe-fed dielectric resonator antenna. The antenna may include a dielectric resonating element mounted to a flexible printed circuit. A feed probe may be formed from a patch of conductive traces on a sidewall of the resonating element. The feed probe may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the display cover layer. An additional feed probe may be mounted to an orthogonal sidewall of the resonating element for covering additional polarizations. Probe-fed dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the phased antenna array.
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公开(公告)号:US11728569B2
公开(公告)日:2023-08-15
申请号:US17111131
申请日:2020-12-03
Applicant: Apple Inc.
Inventor: Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Hao Xu , Rodney A. Gomez Angulo , Matthew D. Hill , Mattia Pascolini
CPC classification number: H01Q9/0485 , H01Q1/243 , H01Q21/0075
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.
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公开(公告)号:US11700035B2
公开(公告)日:2023-07-11
申请号:US16920297
申请日:2020-07-02
Applicant: Apple Inc.
Inventor: Harish Rajagopalan , Bilgehan Avser , David Garrido Lopez , Forhad Hasnat , Mattia Pascolini , Mikal Askarian Amiri , Rodney A. Gomez Angulo , Thomas W. Yang , Jiechen Wu , Eric N. Nyland , Simone Paulotto , Jennifer M. Edwards , Matthew D. Hill , Ihtesham H. Chowdhury , David A. Hurrell , Siwen Yong , Jiangfeng Wu , Daniel C. Wagman , Soroush Akbarzadeh , Robert Scritzky , Subramanian Ramalingam
CPC classification number: H04B3/52 , G01R31/2822 , H01Q1/2283 , H01Q13/24 , H04B3/54
Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.
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公开(公告)号:US20220385378A1
公开(公告)日:2022-12-01
申请号:US17335607
申请日:2021-06-01
Applicant: Apple Inc.
Inventor: Sze Yang Dennis Ng , Jr-Yi Shen , Harish Rajagopalan
IPC: H04B17/10 , H01Q15/14 , H04B7/0408
Abstract: A testing system may include a test electronic device having a test antenna disposed in a first signal path of a first antenna array of an electronic device. The test antenna may receive a first signal from the first antenna array. The testing system may also include a reflector disposed in a second signal path of a second antenna array of the electronic device. The reflector may reflect a second signal from the second antenna array to the test antenna. The reflector may include a flat, parabolic, or elliptical curvature that reflects a radio frequency signal emitted by the second antenna array to the test antenna.
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公开(公告)号:US20220109464A1
公开(公告)日:2022-04-07
申请号:US17223888
申请日:2021-04-06
Applicant: Apple Inc.
Inventor: Bilgehan Avser , Harish Rajagopalan , Jennifer M. Edwards , Simone Paulotto , Siwen Yong
Abstract: An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.
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