公开(公告)号：US20250087873A1

公开(公告)日：2025-03-13

申请号：US18626251

申请日：2024-04-03

Applicant: Apple Inc.

Inventor： Killian J. Poore ,  Jas Mukesh Gajaria ,  Jiangfeng Wu ,  Mei-Li Chi ,  Jason C. Sauers ,  Siwen Yong ,  Yi Jiang ,  Shirley S. Lu

IPC: H01Q1/27 ,  H01Q1/38 ,  H01Q1/48

Abstract: An electronic device such as a head-mounted display device may include an antenna that radiates through a cover. The antenna may have an antenna resonating element layered onto the cover and having a three-dimensional curvature. The antenna resonating element may have an antenna ground. A pressure-activated connector may electrically couple the antenna resonating element to the antenna ground. If desired, the pressure-activated connector may lock the antenna resonating element to the antenna ground. The pressure-activated connector may include a metal finger, a metal spring, a metal ball, a curling metal receptacle, a dimple, a metal screw, a screw receptacle, metal burs, and/or rotational locking structures. The pressure-activated connector may form a robust mechanical connection between the first and second conductors despite the curvature of the antenna resonating element, which minimizes electrical discontinuities that can otherwise deteriorate antenna performance.

公开(公告)号：US12206163B2

公开(公告)日：2025-01-21

申请号：US17865241

申请日：2022-07-14

Applicant: Apple Inc.

Inventor： Yi Jiang ,  Jiangfeng Wu ,  Lijun Zhang ,  Siwen Yong ,  Mattia Pascolini ,  Samuel A. Resnick ,  Anthony S. Montevirgen

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H01Q1/22

Abstract: An electronic device may have a cover layer and an antenna. A dielectric adapter may have a first surface coupled to the antenna and a second surface pressed against the cover layer. The cover layer may have a three-dimensional curvature. The second surface may have a curvature that matches the curvature of the cover layer. Biasing structures may exert a biasing force that presses the antenna against the dielectric adapter and that presses the dielectric adapter against the cover layer. The biasing force may be oriented in a direction normal to the cover layer at each point across dielectric adapter. This may serve to ensure that a uniform and reliable impedance transition is provided between the antenna and free space through the cover layer over time, thereby maximizing the efficiency of the antenna.

公开(公告)号：US11894600B2

公开(公告)日：2024-02-06

申请号：US17527906

申请日：2021-11-16

Applicant: Apple Inc.

Inventor： Miroslav Samardzija ,  Yiren Wang ,  Yuehui Ouyang ,  Joseph Hakim ,  Qingxiang Li ,  Robert W. Schlub ,  Ruben Caballero ,  Siwen Yong ,  Erik G. de Jong

IPC: H01Q1/22 ,  G04R60/10 ,  G04G21/04 ,  H01Q1/27 ,  H01Q7/00 ,  H04B5/00 ,  H01Q1/52 ,  H01Q9/42 ,  H01Q21/28 ,  H10K59/40 ,  G06F1/16 ,  H04B5/02 ,  H05K1/02 ,  H05K5/00 ,  H05K5/03 ,  H01Q9/04

CPC classification number: H01Q1/22 ,  G04G21/04 ,  G04R60/10 ,  G06F1/163 ,  H01Q1/273 ,  H01Q1/52 ,  H01Q1/526 ,  H01Q7/00 ,  H01Q9/0421 ,  H01Q9/42 ,  H01Q21/28 ,  H04B5/0025 ,  H04B5/0081 ,  H04B5/02 ,  H05K1/0278 ,  H05K5/0017 ,  H05K5/03 ,  H10K59/40 ,  H04B5/0031

Abstract: An electronic device may have a display. A display cover layer and a transparent inner display member may overlap a display pixel layer. The display pixel layer may have an array of display pixels for displaying images for a user. A touch sensor layer may be interposed between the display pixel layer and the transparent display member. A ferromagnetic shielding layer may be mounted below the display pixel layer. A flexible printed circuit containing coils of metal signal lines that form a near-field communications loop antenna may be interposed between the ferromagnetic shielding layer and the display pixel layer. A non-near-field antenna such as an inverted-F antenna may have a resonating element mounted on an inner surface of the display cover layer. The resonating element may be interposed between the transparent display member and the display cover layer.

公开(公告)号：US20230314592A1

公开(公告)日：2023-10-05

申请号：US18172895

申请日：2023-02-22

Applicant: Apple Inc.

Inventor： Lijun Zhang ,  Jiangfeng Wu ,  Mattia Pascolini ,  Siwen Yong ,  Yi Jiang

IPC: G01S13/86 ,  G01S7/03 ,  G06F1/16

CPC classification number: G01S13/86 ,  G01S7/03 ,  G01S13/867 ,  G06F1/163 ,  G01S2013/0263

Abstract: A head-mounted device may have a head-mounted housing. A radar sensor may be mounted in the housing. The head-mounted housing may have rear-facing displays that display images for a user. The images are viewable from eye boxes while the head-mounted device is being worn by the user. A forward-facing camera may capture real-world image content. The rear-facing displays may be used to display captured real-world image content merged with computer-generated image content. The forward-facing camera and the radar sensor may be mounted under inactive display borders of a forward-facing display. The radar sensor may have a horizontal array of patch antenna elements configured to form a phased antenna array. Communications circuitry in the head-mounted device may use the phased antenna array to transmit and receive wireless communications signals.

公开(公告)号：US11682828B2

公开(公告)日：2023-06-20

申请号：US17728817

申请日：2022-04-25

Applicant: Apple Inc.

Inventor： Jennifer M. Edwards ,  Siwen Yong ,  Jiangfeng Wu ,  Harish Rajagopalan ,  Bilgehan Avser ,  Simone Paulotto ,  Mattia Pascolini

IPC: H01Q1/22 ,  H01Q5/335 ,  H01Q5/392 ,  H01Q1/24 ,  H01Q23/00

CPC classification number: H01Q1/2283 ,  H01Q1/243 ,  H01Q5/335 ,  H01Q5/392 ,  H01Q23/00

Abstract: An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

公开(公告)号：US20220393351A1

公开(公告)日：2022-12-08

申请号：US17338463

申请日：2021-06-03

Applicant: Apple Inc.

Inventor： Jiangfeng Wu ,  Siwen Yong ,  Simon G. Begashaw ,  Yi Jiang ,  Lijun Zhang

IPC: H01Q5/35 ,  H01Q3/34

Abstract: An electronic device may be provided with a phased antenna array on an antenna module. The array may include low band antennas and high band antennas that radiate at frequencies greater than 10 GHz. The module may include antenna layers, transmission line layers, and ground traces that separate the antenna layers from the transmission line layers. The low band antennas and the high band antennas may have radiators patterned onto the antenna layers. The radiators may be fed by transmission lines on the transmission line layers. The antenna layers may have a dielectric permittivity that is greater than the dielectric permittivity of the transmission line layers. This may serve to reduce the lateral footprint of the low band and high band antennas, which allows the antennas to be interleaved along a common linear axis in the phased antenna array, thereby minimizing the lateral footprint of the antenna module.

公开(公告)号：US20220285834A1

公开(公告)日：2022-09-08

申请号：US17751495

申请日：2022-05-23

Applicant: Apple Inc.

Inventor： Jiangfeng Wu ,  Lijun Zhang ,  Mattia Pascolini ,  Siwen Yong ,  Yi Jiang

IPC: H01Q1/52 ,  H01Q3/34 ,  H01Q19/00 ,  H01Q9/04

Abstract: An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.

公开(公告)号：US20220094061A1

公开(公告)日：2022-03-24

申请号：US17031627

申请日：2020-09-24

Applicant: Apple Inc.

Inventor： Siwen Yong ,  Jiangfeng Wu ,  Yi Jiang ,  Simon G. Begashaw ,  Mattia Pascolini

IPC: H01Q5/385 ,  H01Q9/04 ,  H01Q1/24

Abstract: An electronic device may include a phased antenna array. The array may include co-located first and second antennas formed on a dielectric substrate. The first antenna may include a first patch element and multi-layer parasitic structures. The multi-layer parasitic structures may include a first set of co-planar parasitic elements. The first set of parasitic elements may overlap the first patch element and may be separated by a gap. The multi-layer parasitic structures may include an additional parasitic element that overlaps the gap. The second antenna may include a second patch element that is co-planar with the additional parasitic patch. The second patch element may at least partially overlap one of the parasitic elements in the first set. The first and second patch antennas may collectively cover first and second frequency bands while occupying a minimal amount of space on the dielectric substrate.

公开(公告)号：US11177566B2

公开(公告)日：2021-11-16

申请号：US15898164

申请日：2018-02-15

Applicant: Apple Inc.

Inventor： Jiangfeng Wu ,  Lijun Zhang ,  Siwen Yong ,  Yi Jiang ,  Mattia Pascolini

IPC: H01Q1/52 ,  H04M1/02 ,  H01Q21/22 ,  H01Q1/24

Abstract: An electronic device may be provided with a dielectric cover and a phased antenna array for conveying millimeter wave signals. A conductive pocket may be mounted to the cover. The pocket may include a conductive rear wall and conductive sidewalls that extend from a periphery of the rear wall to the cover. The array may be mounted to the rear wall and may convey signals through the cover. The sidewalls may extend from the cover at non-zero angles with respect to the normal axis of the cover. The shape of the pocket and the cover may be selected so that the pocket is non-resonant at frequencies handled by the array, to mitigate destructive interference within the pocket, to block surface waves from propagating along the cover, and to tweak the radiation pattern of the array to exhibit a desired shape and directionality.

公开(公告)号：US11038284B2

公开(公告)日：2021-06-15

申请号：US15950677

申请日：2018-04-11

Applicant: Apple Inc.

Inventor： Jennifer M. Edwards ,  Harish Rajagopalan ,  Simone Paulotto ,  Bilgehan Avser ,  Hao Xu ,  Rodney A. Gomez Angulo ,  Siwen Yong ,  Matthew A. Mow ,  Mattia Pascolini

IPC: H01Q21/22 ,  H01Q3/26 ,  H01Q1/38 ,  H01Q21/06 ,  H01Q1/24

Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.