公开(公告)号：US11863224B2

公开(公告)日：2024-01-02

申请号：US17223888

申请日：2021-04-06

Applicant: Apple Inc.

Inventor： Bilgehan Avser ,  Harish Rajagopalan ,  Jennifer M. Edwards ,  Simone Paulotto ,  Siwen Yong

IPC: H04B1/40 ,  H04M1/02 ,  H01Q9/04 ,  H01Q5/335 ,  H01Q1/24

CPC classification number: H04B1/40 ,  H01Q5/335 ,  H01Q9/0485 ,  H04M1/026 ,  H01Q1/243

Abstract: An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.

公开(公告)号：US20230305302A1

公开(公告)日：2023-09-28

申请号：US18171067

申请日：2023-02-17

Applicant: Apple Inc.

Inventor： Lijun Zhang ,  Jiangfeng Wu ,  Lu Zhang ,  Mattia Pascolini ,  Siwen Yong ,  Yi Jiang

IPC: G02B27/01 ,  G02C11/00 ,  G02C5/14 ,  G02C1/06 ,  G02C5/00

CPC classification number: G02B27/017 ,  G02C11/10 ,  G02C5/14 ,  G02C1/06 ,  G02C5/008 ,  G02B2027/0178

Abstract: A head-mounted device such as a pair of glasses may have display systems. The display systems may present images to eye boxes for viewing by a user. The glasses may have clear lenses through which real-world objects may be viewed from the eye boxes. The glasses may have a metal frame that surrounds the lenses and may have temples that are coupled to the frame using hinges. Radio-frequency transceiver circuitry such as cellular telephone transceiver circuitry may be coupled to one or more antennas in the head-mounted device. The antennas may have antenna resonating elements formed by placing dielectric-filled gaps in the metal frame to divide the frame into segments. Antenna resonating elements formed from segments of the metal frame may be coupled to the radio-frequency transceiver circuitry using transmission lines.

公开(公告)号：US20220384941A1

公开(公告)日：2022-12-01

申请号：US17865241

申请日：2022-07-14

Applicant: Apple Inc.

Inventor： Yi Jiang ,  Jiangfeng Wu ,  Lijun Zhang ,  Siwen Yong ,  Mattia Pascolini ,  Samuel A. Resnick ,  Anthony S. Montevirgen

IPC: H01Q1/42 ,  H01Q1/38 ,  H01Q1/24

Abstract: An electronic device may have a cover layer and an antenna. A dielectric adapter may have a first surface coupled to the antenna and a second surface pressed against the cover layer. The cover layer may have a three-dimensional curvature. The second surface may have a curvature that matches the curvature of the cover layer. Biasing structures may exert a biasing force that presses the antenna against the dielectric adapter and that presses the dielectric adapter against the cover layer. The biasing force may be oriented in a direction normal to the cover layer at each point across dielectric adapter. This may serve to ensure that a uniform and reliable impedance transition is provided between the antenna and free space through the cover layer over time, thereby maximizing the efficiency of the antenna.

公开(公告)号：US11417951B2

公开(公告)日：2022-08-16

申请号：US17008862

申请日：2020-09-01

Applicant: Apple Inc.

Inventor： Yi Jiang ,  Jiangfeng Wu ,  Lijun Zhang ,  Siwen Yong ,  Mattia Pascolini ,  Samuel A. Resnick ,  Anthony S. Montevirgen

IPC: H01Q1/42 ,  H01Q1/38 ,  H01Q1/22

Abstract: An electronic device may have a cover layer and an antenna. A dielectric adapter may have a first surface coupled to the antenna and a second surface pressed against the cover layer. The cover layer may have a three-dimensional curvature. The second surface may have a curvature that matches the curvature of the cover layer. Biasing structures may exert a biasing force that presses the antenna against the dielectric adapter and that presses the dielectric adapter against the cover layer. The biasing force may be oriented in a direction normal to the cover layer at each point across dielectric adapter. This may serve to ensure that a uniform and reliable impedance transition is provided between the antenna and free space through the cover layer over time, thereby maximizing the efficiency of the antenna.

公开(公告)号：US11349204B2

公开(公告)日：2022-05-31

申请号：US17028864

申请日：2020-09-22

Applicant: Apple Inc.

Inventor： Jiangfeng Wu ,  Lijun Zhang ,  Mattia Pascolini ,  Siwen Yong ,  Yi Jiang

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q3/34 ,  H01Q19/00

Abstract: An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.

公开(公告)号：US11335992B2

公开(公告)日：2022-05-17

申请号：US16990879

申请日：2020-08-11

Applicant: Apple Inc.

Inventor： Jennifer M. Edwards ,  Siwen Yong ,  Jiangfeng Wu ,  Harish Rajagopalan ,  Bilgehan Avser ,  Simone Paulotto ,  Mattia Pascolini

IPC: H01Q1/22 ,  H01Q5/335 ,  H01Q5/392 ,  H01Q23/00 ,  H01Q1/24

Abstract: An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

公开(公告)号：US11205832B2

公开(公告)日：2021-12-21

申请号：US16596593

申请日：2019-10-08

Applicant: Apple Inc.

Inventor： Miroslav Samardzija ,  Yiren Wang ,  Yuehui Ouyang ,  Joseph Hakim ,  Qingxiang Li ,  Robert W. Schlub ,  Ruben Caballero ,  Siwen Yong ,  Erik G. de Jong

IPC: H01Q1/22 ,  G04R60/10 ,  G04G21/04 ,  H01Q1/27 ,  H01Q7/00 ,  H04B5/00 ,  H01Q1/52 ,  H01Q9/42 ,  H01Q21/28 ,  G06F1/16 ,  H01L27/32 ,  H04B5/02 ,  H05K1/02 ,  H05K5/00 ,  H05K5/03 ,  H01Q9/04

Abstract: An electronic device may have a display. A display cover layer and a transparent inner display member may overlap a display pixel layer. The display pixel layer may have an array of display pixels for displaying images for a user. A touch sensor layer may be interposed between the display pixel layer and the transparent display member. A ferromagnetic shielding layer may be mounted below the display pixel layer. A flexible printed circuit containing coils of metal signal lines that form a near-field communications loop antenna may be interposed between the ferromagnetic shielding layer and the display pixel layer. A non-near-field antenna such as an inverted-F antenna may have a resonating element mounted on an inner surface of the display cover layer. The resonating element may be interposed between the transparent display member and the display cover layer.

公开(公告)号：US20210376443A1

公开(公告)日：2021-12-02

申请号：US17400710

申请日：2021-08-12

Applicant: Apple Inc.

Inventor： Jiangfeng Wu ,  Siwen Yong ,  Yi Jiang ,  Lijun Zhang ,  Mattia Pascolini

IPC: H01Q1/12 ,  H05K9/00 ,  H05K5/03 ,  H01Q3/34 ,  H01Q1/42 ,  H01Q19/06

Abstract: An electronic device may be provided with wireless communications circuitry and control circuitry. The wireless communications circuitry may include centimeter and millimeter wave transceiver circuitry and a phased antenna array. A dielectric cover may be formed over the phased antenna array. The phased antenna array may transmit and receive wireless radio-frequency signals through the dielectric cover. The dielectric cover may have first and second opposing surfaces. The second surface may face the phased antenna array and may have a curvature. The curvature of the second surface may include one or more recessed regions of the dielectric cover. The one or more recessed regions of the second surface may serve to maximize and broaden the coverage area for the phased antenna array. The first surface may be conformal to other structures in the electronic device.

公开(公告)号：US20210328346A1

公开(公告)日：2021-10-21

申请号：US16851812

申请日：2020-04-17

Applicant: Apple Inc.

Inventor： Lijun Zhang ,  Jiangfeng Wu ,  Mattia Pascolini ,  Siwen Yong ,  Yi Jiang

IPC: H01Q5/10 ,  H01Q5/328 ,  H01Q7/00

Abstract: An electronic device may include a curved cover layer and an antenna. The antenna may include a ground and a resonating element on a curved surface of a substrate. The curved surface may have a curvature that matches that of the cover layer. The resonating element may include first, second, and third arms fed by a feed. The first arm and a portion of the ground may form a loop antenna resonating element. The second arm and the first arm may form an inverted-F antenna resonating element, where a portion of the first arm forms a return path to the antenna ground for the inverted-F antenna resonating element. A gap between the first and second arms may form a distributed capacitance. The third arm may form an L-shaped antenna resonating element. The antenna may have a wide bandwidth from below 2.4 GHz to greater than 9.0 GHz.

公开(公告)号：US10978797B2

公开(公告)日：2021-04-13

申请号：US15950072

申请日：2018-04-10

Applicant: Apple Inc.

Inventor： Jennifer M. Edwards ,  Harish Rajagopalan ,  Simone Paulotto ,  Bilgehan Avser ,  Hao Xu ,  Rodney A. Gomez Angulo ,  Siwen Yong ,  Matthew A. Mow ,  Mattia Pascolini

IPC: H01Q1/24 ,  H01Q1/52 ,  H01Q21/26 ,  H01Q9/04 ,  H04M1/02 ,  H01Q1/48

Abstract: An electronic device may be provided with a dielectric cover layer and a conductive layer on the dielectric cover layer. The conductive layer may define an opening. A dielectric spacer may be mounted to the cover layer within the opening. A substrate may be mounted to the spacer. Vertical conductive structures may extend from the conductive layer to the substrate and may laterally surround the spacer. A phased antenna array may be formed on the substrate and aligned with the opening. The cover layer may have a dielectric constant and thickness that are selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The spacer and the conductive structures may exhibit a cavity resonance at the wavelength. The array and the conductive structures may radiate radio-frequency signals at millimeter wave frequencies through the dielectric cover layer.