公开(公告)号：US11189511B2

公开(公告)日：2021-11-30

申请号：US16656254

申请日：2019-10-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Paul B. Reuter ,  Dean C. Hruzek ,  Nir Merry ,  John C. Menk ,  Douglas B. Baumgarten

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687

Abstract: Electronic device processing systems including an equipment front end module with at least one side storage pod are described. The side storage pod has a side storage container and a container plenum. A fan draws purge gas from the equipment front end module chamber into the container plenum where the purge gas is directed into the side storage container to pass over substrates stored therein and is then exhausted back into the equipment front end module chamber. Methods and systems are also disclosed.

公开(公告)号：US10758045B2

公开(公告)日：2020-09-01

申请号：US16358280

申请日：2019-03-19

Applicant: Applied Materials, Inc.

Inventor： Eran Weiss ,  Travis Morey ,  Nir Merry ,  Paul B. Reuter ,  Izya Kremerman ,  Jeffrey C. Hudgens ,  Dean C. Hruzek

IPC: H01L21/67 ,  A47B96/00

Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

公开(公告)号：US20190208907A1

公开(公告)日：2019-07-11

申请号：US16358280

申请日：2019-03-19

Applicant: Applied Materials, Inc.

Inventor： Eran Weiss ,  Travis Morey ,  Nir Merry ,  Paul B. Reuter ,  Izya Kremerman ,  Jeffrey C. Hudgens ,  Dean C. Hruzek

IPC: A47B96/00 ,  H01L21/67

CPC classification number: A47B96/00 ,  H01L21/67126 ,  H01L21/67201

Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

公开(公告)号：US10196845B2

公开(公告)日：2019-02-05

申请号：US15130272

申请日：2016-04-15

Applicant: Applied Materials, Inc.

Inventor： John J. Mazzocco ,  Nir Merry

IPC: H01L21/67 ,  E05C19/16 ,  H01L21/673

Abstract: A substrate carrier door assembly including relatively high sealing force that can be modulated. Substrate carrier door assembly includes a carrier door configured to seal to a carrier body, a first attraction member on the carrier body, and a second attraction member on the carrier door. Attraction members are selected from a group of a magnetic material and a permanent magnet. Substrate carrier door assembly includes a magnetic field generator energizable to reduce attraction force between the attraction members making the carrier door relatively easier to remove, yet providing enhanced sealing when not energized. Substrate carriers including the substrate carrier door assembly and methods of processing substrates are provided. A substrate carrier including a port configured to allow gas to be injected into, or removed from, a carrier chamber, and a magnetic port seal is also disclosed, as are numerous other aspects.

公开(公告)号：US20180366355A1

公开(公告)日：2018-12-20

申请号：US16112197

申请日：2018-08-24

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas B. Baumgarten ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US09564349B2

公开(公告)日：2017-02-07

申请号：US13656158

申请日：2012-10-19

Applicant: Applied Materials, Inc.

Inventor： Khurshed Sorabji ,  Joseph M. Ranish ,  Wolfgang Aderhold ,  Aaron M. Hunter ,  Blake R. Koelmel ,  Alexander N. Lerner ,  Nir Merry

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/68 ,  H01L21/687 ,  C23C16/46 ,  H01L21/683

CPC classification number: H01L21/67259 ,  C23C16/46 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/68742

Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

Abstract translation: 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

公开(公告)号：US20160340947A1

公开(公告)日：2016-11-24

申请号：US15130272

申请日：2016-04-15

Applicant: Applied Materials, Inc.

Inventor： John J. Mazzocco ,  Nir Merry

IPC: E05C19/16 ,  H01L21/673

CPC classification number: E05C19/166 ,  H01L21/67373 ,  H01L21/67376 ,  H01L21/67393

Abstract: A substrate carrier door assembly including relatively high sealing force that can be modulated. Substrate carrier door assembly includes a carrier door configured to seal to a carrier body, a first attraction member on the carrier body, and a second attraction member on the carrier door. Attraction members are selected from a group of a magnetic material and a permanent magnet. Substrate carrier door assembly includes a magnetic field generator energizable to reduce attraction force between the attraction members making the carrier door relatively easier to remove, yet providing enhanced sealing when not energized. Substrate carriers including the substrate carrier door assembly and methods of processing substrates are provided. A substrate carrier including a port configured to allow gas to be injected into, or removed from, a carrier chamber, and a magnetic port seal is also disclosed, as are numerous other aspects.

Abstract translation: 包括可以被调制的相对高的密封力的基板载体门组件。 基板承载门组件包括：承载门，其构造成密封到承载体，载体主体上的第一吸引构件和载体门上的第二吸引构件。 吸引构件选自一组磁性材料和永磁体。 基板载体门组件包括能够激励的磁场发生器，以减少吸引构件之间的吸引力，使吸引构件相对更容易去除，同时在不通电时提供增强的密封。 提供了包括基板载体门组件的基板载体和处理基板的方法。 还公开了一种衬底载体，其包括被配置为允许气体被注入或移除载体室的端口和磁端口密封件。

公开(公告)号：US20150145413A1

公开(公告)日：2015-05-28

申请号：US14091111

申请日：2013-11-26

Applicant: Applied Materials, Inc.

Inventor： Nir Merry ,  Chandrakant M. Sapkale ,  Izya Kremerman ,  Jeffrey C. Hudgens

IPC: H01J37/32

CPC classification number: H01J37/32449 ,  F16K1/24 ,  F16K31/00 ,  F16K51/00 ,  F16K51/02 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: Process chamber gas flow control apparatus may include, or be included in, a process chamber configured to process a substrate therein. The gas flow control apparatus may include a valve configured to seal an exhaust port in the process chamber. The valve may be moveable in the X, Y, and Z directions relative to the exhaust port to adjust a gas flow pattern (including, e.g., flow rate and/or flow uniformity) within the process chamber. Methods of adjusting a flow of a process gas within a process chamber are also provided, as are other aspects.

Abstract translation: 处理室气体流量控制装置可以包括或被包括在被配置为在其中处理基板的处理室中。 气体流量控制装置可以包括构造成密封处理室中的排气口的阀。 阀可以相对于排气口在X，Y和Z方向上移动，以调节处理室内的气流模式（包括例如流速和/或流动均匀性）。 还提供了调节处理室内的处理气体的流动的方法，以及其它方面。

公开(公告)号：US20140367266A1

公开(公告)日：2014-12-18

申请号：US13998741

申请日：2013-10-29

Applicant: APPLIED MATERIALS, INC.

Inventor： Edward J. Budiarto ,  Dmitry A. Dzilno ,  Todd J. Egan ,  Jeffrey C. Hudgens ,  Nir Merry

IPC: G01B7/06 ,  C25D21/12

CPC classification number: C25D17/001 ,  C25D7/123 ,  C25D17/12 ,  C25D21/12 ,  G01B7/105 ,  G01N27/20 ,  G01R31/2653 ,  G01R31/2656 ,  H01L22/20

Abstract: A measurement tool includes a rotation stage supporting an workpiece support, a thickness sensor overlying a workpiece support surface; a translation actuator coupled to the thickness sensor for translation of the thickness sensor relative to the workpiece support surface; and a computer coupled to control the rotation actuator and the translation actuator, and coupled to receive an output of the thickness sensor.

Abstract translation: 测量工具包括支撑工件支撑件的旋转台，覆盖工件支撑表面的厚度传感器; 耦合到厚度传感器的平移致动器，用于相对于工件支撑表面平移厚度传感器; 以及耦合以控制旋转致动器和平移致动器并被耦合以接收厚度传感器的输出的计算机。

公开(公告)号：US20140262035A1

公开(公告)日：2014-09-18

申请号：US14180954

申请日：2014-02-14

Applicant: Applied Materials, Inc.

Inventor： Nir Merry ,  Michael Robert Rice ,  Sushant S. Koshti ,  Jeffrey C. Hudgens

IPC: H01L21/677

CPC classification number: H01L21/6719 ,  H01L21/67196

Abstract: A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided.

Abstract translation: 用于半导体器件制造的传送室包括（1）限定被配置为保持真空度并允许在处理室之间传送衬底的区域的多个侧面，所述多个侧面限定传送室的第一部分和第二部分 并且包括（a）耦合到两个孪生处理室的第一面; 和（b）耦合到单个处理室的第二侧; （2）位于传送室的第一部分中的第一衬底处理器; （3）位于所述传送室的第二部分中的第二衬底处理器; 和（4）切换位置，其配置为允许基板使用第一和第二基板处理器在传送室的第一部分和第二部分之间通过。 还提供了方法方面。