公开(公告)号：US10800000B2

公开(公告)日：2020-10-13

申请号：US15546068

申请日：2016-01-29

Applicant: Applied Materials, Inc.

Inventor： Robert D. Tolles ,  Mahendra C. Orilall ,  Fred C. Redeker ,  Rajeev Bajaj

IPC: B24B37/22 ,  B24B37/24 ,  B24D11/00

Abstract: The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.

公开(公告)号：US10773509B2

公开(公告)日：2020-09-15

申请号：US15452053

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Rajeev Bajaj ,  Daniel Redfield ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Mario Cornejo

IPC: B33Y10/00 ,  G03F7/00 ,  G03F7/20 ,  B33Y30/00 ,  B33Y80/00 ,  B24B37/22 ,  B29K105/00

Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.

公开(公告)号：US10537974B2

公开(公告)日：2020-01-21

申请号：US15876436

申请日：2018-01-22

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Kasiraman Krishnan ,  Mahendra C. Orilall ,  Daniel Redfield ,  Fred C. Redeker ,  Nag B. Patibandla ,  Gregory E. Menk ,  Jason G. Fung ,  Russell Edward Perry ,  Robert E. Davenport

IPC: B24D18/00 ,  B24B37/26 ,  B24B37/24 ,  B33Y80/00 ,  B24B37/20 ,  B24B37/22 ,  B29C64/112

Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US09744724B2

公开(公告)日：2017-08-29

申请号：US15237140

申请日：2016-08-15

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Barry Lee Chin ,  Terrance Y. Lee

IPC: B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B24B37/26 ,  B24D18/00 ,  B33Y50/02 ,  B33Y80/00 ,  B29C35/08 ,  B29K75/00 ,  B29K509/02 ,  B29K105/00 ,  B29K105/16 ,  B29L31/00

CPC classification number: B29C64/209 ,  B24B37/26 ,  B24D18/00 ,  B24D18/009 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/20 ,  B29C2035/0827 ,  B29K2075/00 ,  B29K2105/0002 ,  B29K2105/16 ,  B29K2509/02 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

公开(公告)号：US20160013085A1

公开(公告)日：2016-01-14

申请号：US14328211

申请日：2014-07-10

Applicant: Applied Materials, Inc.

Inventor： Xiong Yeu Chew ,  Venaka Rama Subrahmanyam Kommisetti ,  Uday Mahajan ,  Boguslaw A. Swedek ,  Rajeev Bajaj ,  Jianshe Tang

IPC: H01L21/67 ,  H01L21/768 ,  B24B37/005

CPC classification number: H01L21/7684 ,  B24B37/0053 ,  H01L21/3212 ,  H01L21/76898 ,  H01L22/12 ,  H01L22/26

Abstract: A method of controlling chemical mechanical polishing includes polishing a substrate having a plurality of protrusions, monitoring the substrate during polishing with an in-situ monitoring system to generate a signal, the in-situ monitoring system including an acoustic sensor, a motor current sensor or a motor torque sensor, and detecting breakage of the protrusions based on the signal.

Abstract translation: 一种控制化学机械抛光的方法包括抛光具有多个突起的基底，在用原位监测系统进行抛光时监测基底以产生信号，原位监测系统包括声传感器，马达电流传感器或 电动机转矩传感器，并且基于该信号检测突起的断裂。

公开(公告)号：US20150273770A1

公开(公告)日：2015-10-01

申请号：US14737356

申请日：2015-06-11

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Barry Lee Chin ,  Terrance Y. Lee

IPC: B29C67/00 ,  B24D18/00

CPC classification number: B29C64/209 ,  B24B37/26 ,  B24D18/00 ,  B24D18/009 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/20 ,  B29C2035/0827 ,  B29K2075/00 ,  B29K2105/0002 ,  B29K2105/16 ,  B29K2509/02 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

Abstract translation: 制造抛光垫的抛光层的方法包括用3D打印机连续沉积多个层，通过从喷嘴喷射垫材料前体而沉积多个抛光层的每层，并固化焊盘材料前体以形成 固化垫材料。

公开(公告)号：US12023853B2

公开(公告)日：2024-07-02

申请号：US16700062

申请日：2019-12-02

Applicant: Applied Materials, Inc.

Inventor： Kasiraman Krishnan ,  Daniel Redfield ,  Russell Edward Perry ,  Gregory E. Menk ,  Rajeev Bajaj ,  Fred C. Redeker ,  Nag B. Patibandla ,  Mahendra C. Orilall ,  Jason G. Fung

IPC: B29C64/112 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/00 ,  B29K105/16 ,  B29L31/00

CPC classification number: B29C64/112 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/001 ,  B29K2105/16 ,  B29K2995/007 ,  B29L2031/736

Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

公开(公告)号：US11980992B2

公开(公告)日：2024-05-14

申请号：US17946547

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Ashavani Kumar ,  Ashwin Chockalingam ,  Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Boyi Fu ,  Daniel Redfield ,  Nag B. Patibandla ,  Mario Dagio Cornejo ,  Amritanshu Sinha ,  Yan Zhao ,  Ranga Rao Arnepalli ,  Fred C. Redeker

IPC: B24B37/24 ,  B24B37/16 ,  B24B37/20 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/306

CPC classification number: B24B37/245 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y80/00 ,  B24B37/16 ,  B24B37/20 ,  B24D2203/00 ,  B33Y30/00 ,  H01L21/30625

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US11826876B2

公开(公告)日：2023-11-28

申请号：US16375506

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Ankit Vora ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: B24B37/22 ,  B24B37/24 ,  B33Y70/00 ,  B29C64/112 ,  B33Y10/00 ,  B24B37/26 ,  B24B7/22 ,  B22F10/14 ,  B33Y80/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58

CPC classification number: B24B7/22 ,  B22F10/14 ,  B24B37/24 ,  B24B37/26 ,  B29C64/112 ,  B33Y70/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58 ,  B33Y10/00 ,  B33Y80/00 ,  B22F2999/00 ,  B22F1/10 ,  B22F10/10

Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

公开(公告)号：US11745302B2

公开(公告)日：2023-09-05

申请号：US17209137

申请日：2021-03-22

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24 ,  B33Y70/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00 ,  C09G1/16 ,  B33Y70/10 ,  B29K33/04 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  B24D11/00 ,  B24D11/04 ,  B29C35/08 ,  C09D4/00

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B29C35/0805 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16 ,  B24D2203/00 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y70/10

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.