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公开(公告)号：US20240391827A1
公开(公告)日：2024-11-28
申请号：US18669842
申请日：2024-05-21
Applicant: CORNING INCORPORATED
Inventor： Jonathan Thomas Beall , Nikolaus Jon Deems , Yuhui Jin , Xinghua Li , Ying Liu , Lei Yuan , Liying Zhang
Abstract: A light-transmitting structure is disclosed. The light-transmitting structure includes a laminated glass substrate that has a core layer and a first clad layer fused to a first side of the core layer. The core layer comprises a core glass composition that is transparent and has a core refractive index nC. The first clad layer defines a first surface of the laminated glass substrate and comprises a first clad glass composition that is transparent and has a first clad refractive index nCL1 that is lower than the core refractive index nC. The light-transmitting structure further includes a plurality of interdiffusion regions that extend from the core layer and through the first clad layer to define a light-scattering surface interposed with the first surface. Each interdiffusion region comprises an interdiffusion composition that is transparent and has an interdiffusion refractive index nI that is higher than the first clad refractive index nCL1.
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公开(公告)号：US12098093B2
公开(公告)日：2024-09-24
申请号：US16961800
申请日：2019-01-16
Applicant: CORNING INCORPORATED , VIEW, INC.
Inventor： James Gregory Couillard , Ming-Huang Huang , Xinghua Li
CPC classification number: C03C17/3417 , B32B43/006 , B32B2310/0843 , C03C2217/948 , C03C2218/154 , C03C2218/328 , E06B9/24 , E06B2009/2464 , G02F1/155
Abstract: Embodiments of a composite structure are provided, the composite structure including: a substrate layer, a conductive layer and an overlayer. The conductive layer is disposed between the overlayer and the substrate layer. The substrate layer may comprise a material that is optically transparent over at least a part of the electromagnetic spectrum from 180 nm to 20 μm. The conductive layer includes a thickness of 10 nm or greater, a resistivity of 10 Ω-cm or less, and is an optically translucent or opaque over at least a part of the electromagnetic spectrum from 180 nm to 20 μm.
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公开(公告)号：US11999074B2
公开(公告)日：2024-06-04
申请号：US17634771
申请日：2020-08-07
Applicant: CORNING INCORPORATED
Inventor： Ravindra Kumar Akarapu , Priyank Paras Jain , Xinghua Li , John Forrest Wight, Jr.
CPC classification number: B28B11/243 , B28B3/269
Abstract: An extrusion system (100) according to certain aspects includes at least one infrared emitting device (102) arranged in a generally cylindrical shape with a hollow interior. The at least one infrared emitting device (102) is positioned downstream of an outlet of an extrusion die (110) to irradiate a perimeter of wet extrudate material in a uniform manner to form stiffened wet extrudate material (116) before such material is received by an extrudate support channel (118). The at least one infrared emitting device (102) generally uniformly stiffens the skin of the wet extrudate material (116) to resist mechanical deformation of the extrudate material during subsequent handling steps. Such skin stiffening allows for increased tolerance of handling forces and permits extrusion of softer wet extrudate material without compromising the shape of a fired ceramic product.
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公开(公告)号：US11629088B2
公开(公告)日：2023-04-18
申请号：US16443020
申请日：2019-06-17
Applicant: Corning Incorporated
Inventor： Duc Anh Bui , Xinghua Li , Ralf Joachim Terbrueggen
IPC: C03B33/02 , B23K26/00 , B23K26/359 , B23K26/03 , B23K26/06 , B23K26/08 , B23K103/00
Abstract: A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.
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公开(公告)号：US20210292216A1
公开(公告)日：2021-09-23
申请号：US17336905
申请日：2021-06-02
Applicant: CORNING INCORPORATED
Abstract: An additive manufacturing process includes forming an object material stack using sheet materials without use of binder material between the sheet materials and forming features of the cross-sectional layers of a 3D object in the corresponding sheet materials. Another process involves forming features of the cross-sectional layers of a 3D object in soot layers of a laminated soot sheet. A manufactured article includes three or more glass layers laminated together without any binder material between the glass layers. At least one of the glass layers is composed of silica or doped silica, and at least one feature is formed in at least one of the glass layers.
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Patent Agency Ranking
公开(公告)号：US20210108077A1
公开(公告)日：2021-04-15
申请号：US17068272
申请日：2020-10-12
Applicant: Corning Incorporated
Inventor： Tara Marie Berleue , Charles Brandenburg , Justin Bernard Bult , Matthew John Dejneka , Sushmit Sunil Kumar Goyal , Timothy Michael Gross , Yungfeng Gu , Yuhui Jin , Jenny Kim , Xinghua Li , Jian Luo , Kevin Robert McCarthy , Weijun Niu , Terri Lee Sines-Melock , Michael Lesley Sorensen , Jonathan Earl Walter , Arline Lee Weikel , Lei Yuan
Abstract: Polymer-based portions comprise an index of refraction ranging from about 1.49 to about 1.55. In some embodiments, the polymer-based portion comprises the product of curing 45-75 wt % of a difunctional urethane-acrylate oligomer with 25-55 wt % of a difunctional cross-linking agent and optionally a reactive diluent. In some embodiments, the polymer-based portion comprises the product of curing 75-100 wt % of a reactive diluent and optionally one or more a difunctional urethane-acrylate oligomer and/or a difunctional cross-linking agent. Adhesives comprise an index of refraction ranging from about 1.49 to about 1.55. In some embodiments, the adhesive comprises the product of heating 10-35 wt % of a silane-hydride-terminated siloxane and 65-90 wt % of a vinyl-terminated siloxane. In some embodiments, the adhesive comprises the product of irradiating a thiol-containing siloxane and a photo-initiator with at least one wavelength of light that the photo-initiator is sensitive to. Foldable apparatus can comprise the polymer-based portion and/or adhesive.
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公开(公告)号：US10854918B2
公开(公告)日：2020-12-01
申请号：US16363509
申请日：2019-03-25
Applicant: CORNING INCORPORATED
Inventor： Michael Edward Badding , Indrajit Dutta , Lanrik Wayne Kester , Xinghua Li
IPC: H01M10/0562 , H01M2/14
Abstract: The disclosure relates to ceramic lithium ion electrolyte membranes and processes for forming them. The ceramic lithium electrolyte membrane may comprise at least one ablative edge. Exemplary processes for forming the ceramic lithium ion electrolyte membranes comprise fabricating a lithium ion electrolyte sheet and cutting at least one edge of the fabricated electrolyte sheet with an ablative laser.
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公开(公告)号：US20180100698A1
公开(公告)日：2018-04-12
申请号：US15725909
申请日：2017-10-05
Applicant: Corning Incorporated
Inventor： Steven Edward DeMartino , Daniel Warren Hawtof , Archit Lal , Xinghua Li , Daniel L. Maurey , Kevin William Uhlig
Abstract: A method for processing material includes sintering a portion of a sheet of material at a location on the sheet, moving the sintering location along the sheet of material at a first rate, and pulling the sintered material away from the sintering location at a second rate that is greater than the first rate.
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公开(公告)号：US20180057390A1
公开(公告)日：2018-03-01
申请号：US15560390
申请日：2016-03-23
Applicant: Corning Incorporated
Inventor： Thomas Hackert , Xinghua Li , Sasha Marjanovic , Moussa N'Gom , David Andrew Pastel , Garrett Andrew Piech , Daniel Schnitzler , Robert Stephen Wagner , James Joseph Watkins
IPC: C03B33/02 , B23K26/364 , C03C3/093
CPC classification number: C03B33/0222 , B23K26/364 , B23K26/53 , B23K2103/54 , C03B33/0215 , C03C3/093 , Y02P40/57
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (
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公开(公告)号：US20180016179A1
公开(公告)日：2018-01-18
申请号：US15541938
申请日：2016-01-06
Applicant: CORNING INCORPORATED
Inventor： Erin Kathleen Canfield , Todd Benson Fleming , Xinghua Li , Anping Liu , Leonard Thomas Masters
CPC classification number: C03B33/03 , B32B7/06 , B32B17/06 , B32B38/105 , B32B2309/105 , B65G49/061 , C03B33/033 , C03B33/091 , Y02P40/57
Abstract: A method of processing a flexible glass sheet having a thickness of equal to or less than 300 μm includes separating an outer edge portion of the flexible glass sheet from a bonded portion of the flexible glass sheet along a separation path while the bonded portion of the flexible glass sheet remains bonded with respect to a first major surface of a carrier substrate. The step of separating the outer edge portion provides the flexible glass sheet with a new outer edge extending along the separation path. A lateral distance between the new outer edge of the flexible glass sheet and an outer periphery of the first major surface of the carrier substrate is equal to or less than about 750 μm.
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