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    DUAL-INTERFACE HYBRID METAL SMARTCARD WITH A BOOSTER ANTENNA OR COUPLING FRAME
    42.
    发明申请
    DUAL-INTERFACE HYBRID METAL SMARTCARD WITH A BOOSTER ANTENNA OR COUPLING FRAME 审中-公开
    双接口混合金属智能卡，带有天线或耦合框架

    公开(公告)号：US20150269477A1

    公开(公告)日：2015-09-24

    申请号：US14660941

    申请日：2015-03-18

    Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy ,  Klaus Ummenhofer

    Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy ,  Klaus Ummenhofer

    IPC: G06K19/077

    CPC classification number: G06K19/07794 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G06K19/07722 ,  G06K19/07747 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00

    Abstract: A dual-interface metal hybrid smartcard comprising a plastic card body (CB); a metal slug (MS) disposed in the card body; and a booster antenna (BA) disposed in the card body. The metal slug may have a surface area which is at least 50% of a surface area of the card body, and may comprise titanium or alloys thereof. A antenna chip module (AM) having an antenna (MA) and contact pads (CP) may be disposed in an opening of the card body. The metal slug may comprise two or more separate metal slug components (MS-1, MS-2), which may overlap one another or which may be disposed at different locations in the card body (CB), without overlapping one another. The first metal slug component (MS-1) may be disposed around a peripheral portion of the card body (CB) as an “open loop” discontinuous metal frame around (external to) the booster antenna (BA). The second metal slug component (MS-2) may be disposed internal to the card antenna (CA) component of the booster antenna (BA).

    Abstract translation: 一种双接口金属混合智能卡，包括塑料卡体（CB）; 设置在卡体内的金属块（MS）; 以及设置在卡体内的增强天线（BA）。 金属块可以具有至少占卡体表面积的50％的表面积，并且可以包括钛或其合金。 具有天线（MA）和接触垫（CP）的天线芯片模块（AM）可以设置在卡体的开口中。 金属块可以包括两个或更多个分开的金属块状部件（MS-1，MS-2），其可以彼此重叠或者可以布置在卡体（CB）中的不同位置处，而不会彼此重叠。 第一金属块状部件（MS-1）可以围绕卡体（CB）的周边部分设置为围绕（外部）增强天线（BA）的“开环”不连续金属框架。 第二金属芯块组件（MS-2）可以设置在增强天线（BA）的卡天线（CA）部件的内部。

    OFFSETTING SHIELDING AND ENHANCING COUPLING IN METALLIZED SMART CARDS
    45.
    发明申请
    OFFSETTING SHIELDING AND ENHANCING COUPLING IN METALLIZED SMART CARDS 审中-公开
    在金属化智能卡中取消屏蔽和增强耦合

    公开(公告)号：US20150178615A1

    公开(公告)日：2015-06-25

    申请号：US14552504

    申请日：2014-11-25

    Applicant: David Finn

    Inventor： David Finn

    IPC: G06K19/077 ,  H01F38/14

    CPC classification number: G06K19/07794 ,  G06K19/07771 ,  G06K19/07783 ,  H01F38/14 ,  H01F2038/143 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H05K1/0239 ,  H05K1/165 ,  H05K3/103 ,  H05K2201/09036 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2203/0285 ,  Y10T29/49016 ,  Y10T29/49018

    Abstract: A dual-interface smart card having a booster antenna with coupler coil in its card body, and a metallized face plate having a window opening for the antenna module. Performance may be improved by one or more of making the window opening substantially larger than the antenna module, providing perforations through the face plate, disposing ferrite material between the face plate and the booster antenna. Additionally, by one or more of modifying contact pads on the antenna module, disposing a compensating loop under the booster antenna, offsetting the antenna module with respect to the coupler coil, arranging the booster antenna as a quasi-dipole, providing the module antenna with capacitive stubs, and disposing a ferrite element in the antenna module between the module antenna and the contact pads.

    Abstract translation: 一种双接口智能卡，其具有在其卡体中具有耦合线圈的增强天线，以及具有用于天线模块的窗口的金属化面板。 可以通过将窗户开口大大地大于天线模块的一个或多个来提高性能，从而提供通过面板的穿孔，在面板和增强天线之间设置铁氧体材料。 另外，通过一个或多个修改天线模块上的接触焊盘，在增强天线之下设置补偿环路，相对于耦合线圈偏移天线模块，将增强天线布置为准偶极子，为模块天线提供 并且在天线模块中在模块天线和接触垫之间设置铁氧体元件。

    TRANSPONDER CHIP MODULE WITH COUPLING FRAME ON A COMMON SUBSTRATE FOR SECURE AND NON-SECURE SMARTCARDS AND TAGS
    46.
    发明申请
    TRANSPONDER CHIP MODULE WITH COUPLING FRAME ON A COMMON SUBSTRATE FOR SECURE AND NON-SECURE SMARTCARDS AND TAGS 有权
    用于安全和非安全智能卡和标签的通用基板上的耦合框架的传输芯片模块

    公开(公告)号：US20150136858A1

    公开(公告)日：2015-05-21

    申请号：US14551376

    申请日：2014-11-24

    Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

    Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

    IPC: G06K19/077

    CPC classification number: G06K19/07754 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G06K19/07722 ,  G06K19/07747 ,  G06K19/07794 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2924/00014

    Abstract: A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is “open loop”. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.

    Abstract translation: 电容耦合增强型（CCE）应答器芯片模块（TCM）包括RFID芯片（CM，IC），可选的接触焊盘（CP），模块天线（MA）和耦合框架（CF） 或模块磁带（MT）。 耦合框架（CF，320A）可以是具有内边缘（IE），外边缘IE 324和中心开口（OP）的环的形式，其紧邻和围绕模块天线（ 嘛）。 狭缝（S）可以从内边缘（IE）延伸到联接框架（CF）的外边缘（OE），使得联接框架（CF）是“开环”。 RFID设备可以包括具有模块天线（MA），设备基板（DS）和设置在设备基板（DS）上并与模块天线（MA）连接的天线结构（AS））的应答器芯片模块（TCM） ）。 在蚀刻模块天线（MA）之后残留的导电层（CL，904）的一部分可以被分割成具有几个更小的隔离导电结构。

    CONNECTION BRIDGES FOR DUAL INTERFACE TRANSPONDER CHIP MODULES
    47.
    发明申请
    CONNECTION BRIDGES FOR DUAL INTERFACE TRANSPONDER CHIP MODULES 审中-公开
    双接口传输芯片模块的连接桥

    公开(公告)号：US20150129665A1

    公开(公告)日：2015-05-14

    申请号：US14523993

    申请日：2014-10-27

    Applicant: David Finn ,  Mustafa Lotya

    Inventor： David Finn ,  Mustafa Lotya

    IPC: G06K19/077

    CPC classification number: G06K19/07769 ,  B23K26/21 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/32 ,  B23K2101/36 ,  B23K2101/40 ,  B23K2103/50 ,  G06K19/07722 ,  G06K19/07747 ,  G06K19/07794 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2924/00014 ,  H01L2924/01033

    Abstract: Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).

    Abstract translation: 用于双接口转发器芯片模块（TCM）200的连接桥（CBR）可以具有基本上等于或大于接触焊盘阵列（CPA）的接触焊盘（CP）的面积的面积。 给定的连接桥可以是L形的并且可以包括（i）设置在接触垫阵列外部并平行于插入方向延伸的第一部分，以及（ii）从第一部分的端部垂直延伸到第二部分 在接触焊盘阵列（CPA）内的插入方向，例如C1和C5之间。 连接桥可以围绕接触焊盘阵列的角部延伸，可以足够大以容纳引线接合，并且可以与围绕接触焊盘阵列延伸的耦合框架（CF）成一体。 应答器芯片模块可以集成到智能卡（SC）中。

    Plastic cards with high density particles
    48.
    发明授权
    Plastic cards with high density particles 有权
    具有高密度颗粒的塑料卡

    公开(公告)号：US09016591B2

    公开(公告)日：2015-04-28

    申请号：US13962925

    申请日：2013-08-08

    Applicant: John Herslow ,  Bradley A. Paulson ,  David Finn

    Inventor： John Herslow ,  Bradley A. Paulson ,  David Finn

    IPC: G06K19/06 ,  G06K19/02 ,  G06K19/08

    CPC classification number: G06K19/02 ,  B32B27/08 ,  B32B27/20 ,  B32B27/302 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/40 ,  B32B2264/105 ,  B32B2307/41 ,  B32B2307/702 ,  B32B2307/704 ,  B32B2307/75 ,  B32B2425/00 ,  B42D25/305 ,  B42D25/36 ,  B42D25/373 ,  G06K19/07722 ,  G06K19/07749 ,  G06K19/07794 ,  G06K19/083 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/268

    Abstract: High density metal or mineral particles, sized to be less than 10 microns, are compounded into a base plastic layer to form a compounded composite layer used to form the core layer of the card, any layer of the card or the entire card. The amount of high density particles compounded into the plastic layer is controlled so the card: (a) is at least twice as heavy as any standard PVC card; (b) can be manufactured using standard current plastic card equipment and tooling. (c) is not brittle; and (d) is electrically non-conductive whereby it is not subject to electrostatic discharge properties. The card can include RFID functionality integrated into the card body. The compounded composite layer does not interfere with the integrity of the data communication between an RFID chip packaged in an antenna module and coupled with an embedded booster antenna, and a contactless reader or terminal.

    Abstract translation: 尺寸小于10微米的高密度金属或矿物颗粒被复合到基础塑料层中以形成用于形成卡的芯层，卡的任何层或整个卡的复合复合层。 混合到塑料层中的高密度颗粒的量被控制，使得卡（a）至少是任何标准PVC卡的两倍; （b）可以使用标准的当前塑料卡设备和工具制造。 （c）不脆; 和（d）不导电，由此不受静电放电性能的影响。 该卡可以包括集成到卡体内的RFID功能。 复合复合层不会干扰封装在天线模块中的RFID芯片与嵌入式增强天线耦合的数字通信的完整性以及非接触读取器或终端。

    SMARTCARD WITH COUPLING FRAME AND METHOD OF INCREASING ACTIVATION DISTANCE OF A TRANSPONDER CHIP MODULE
    49.
    发明申请
    SMARTCARD WITH COUPLING FRAME AND METHOD OF INCREASING ACTIVATION DISTANCE OF A TRANSPONDER CHIP MODULE 有权
    具有耦合框架的智能卡和增加传输芯片模块的激活距离的方法

    公开(公告)号：US20150021403A1

    公开(公告)日：2015-01-22

    申请号：US14492113

    申请日：2014-09-22

    Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

    Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

    IPC: G06K19/077

    CPC classification number: G06K19/07747 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G06K19/07722 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00

    Abstract: A conductive coupling frame (CF) having two ends, forming an open loop having two ends or a discontinuous metal layer disposed surrounding and closely adjacent a transponder chip module (TCM, 610), and substantially coplanar with an antenna structure (AS, CES, LES) in the transponder chip module (TCM). A metal card body (MCB, CB) or a transaction card with a discontinuous metal layer having a slit (S) or a non-conductive strip (NCS, 1034) extending from a module opening (MO) to a periphery of the card body to function as a coupling frame (CF). The coupling frame (CF) may be thick enough to be non-transparent to RF at frequencies of interest. A switch (SW) may be provided to connect ends of the coupling frame (CF) across the slit (S, 630). A reinforcing structure (RS) may be provided to stabilize the coupling frame (CF) and card body (CB). The transponder chip module (TCM) may comprise an antenna structure which may be a laser-etched antenna structure (LES) or a chemical-etched antenna structure (CES), and may comprise and a non-perforated contact pad (CP) arrangement. A coupling frame (CF) may be incorporated onto the module tape (MT, CCT) for a transponder chip module (TCM).

    Abstract translation: 一种具有两端的导电耦合框架（CF），形成具有两端的开环或设置在应答器芯片模块（TCM，610）周围并紧密相邻的不连续金属层，并且与天线结构（AS，CES， LES）在转发器芯片模块（TCM）中。 金属卡体（MCB，CB）或具有不连续金属层的交易卡，具有从模块开口（MO）延伸到卡体周边的狭缝（S）或非导电条（NCS，1034） 用作耦合框架（CF）。 耦合框架（CF）可以足够厚以便在感兴趣的频率对RF不透明。 可以提供开关（SW）以将耦合框架（CF）的端部跨过狭缝（S，630）连接。 可以提供加强结构（RS）以稳定耦合框架（CF）和卡体（CB）。 应答器芯片模块（TCM）可以包括可以是激光蚀刻天线结构（LES）或化学蚀刻天线结构（CES）的天线结构，并且可以包括非穿孔接触焊盘（CP）布置。 耦合框架（CF）可以结合到用于应答器芯片模块（TCM）的模块带（MT，CCT）上。

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