公开(公告)号：US20230345668A1

公开(公告)日：2023-10-26

申请号：US18345213

申请日：2023-06-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer ,  John Franz

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20336

Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

公开(公告)号：US20230315133A1

公开(公告)日：2023-10-05

申请号：US17708270

申请日：2022-03-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Michael Scott ,  Harvey J. Lunsman

IPC: G05D16/10 ,  H05K7/20

CPC classification number: G05D16/10 ,  H05K7/20781

Abstract: Example implementations relate to an accumulator for regulating variations in operating pressure of a cool fluid in a closed fluid loop of a coolant distribution unit (CDU). The accumulator includes a cylinder having an internal volume defined between an inlet and outlet, and a hollow piston slidably connected to the cylinder through one of the inlet or outlet to split the internal volume into a first volume portion filled with the cool fluid and a second volume portion filled with a compressible matter that is maintained at the operating pressure by the cool fluid filled in the first volume portion via the hollow piston. The first volume portion is fluidically connected to the closed fluid loop functioning at the operating pressure via the hollow piston and other one of the inlet or the outlet to direct a flow of the cool fluid into the closed fluid loop via the accumulator.

公开(公告)号：US20230262928A1

公开(公告)日：2023-08-17

申请号：US17669753

申请日：2022-02-11

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Steven Dean ,  Michael Scott ,  Harvey J. Lunsman

IPC: H05K7/20 ,  F15B1/04

CPC classification number: H05K7/20272 ,  F15B1/04 ,  H05K7/20781 ,  F15B2201/405 ,  F15B2201/605

Abstract: Examples described herein relate to compact and replaceable accumulator to be utilized in a chassis-level cooling device. The accumulator is a low pressurized device having a housing, a bladder, and a compressible fluid. The housing has an inner surface defining a volume and an opening. The bladder is disposed within a volume portion and attached to the opening. The bladder includes a plurality of elongated wall sections foldably coupled to each other and defining a bladder volume therebetween. The bladder inflates by unfolding the plurality of elongated wall sections to increase the bladder volume in response to an increase in a pressure of a working fluid inside the bladder volume. The compressible fluid is contained in a remaining volume portion between the inner surface of the housing and the bladder. The compressible fluid is compressed to an offset pressure in response to inflation of the plurality of elongated wall sections.

公开(公告)号：US20230180429A1

公开(公告)日：2023-06-08

申请号：US17541499

申请日：2021-12-03

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Tahir Cader

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20272

Abstract: Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.

公开(公告)号：US11662126B2

公开(公告)日：2023-05-30

申请号：US17350493

申请日：2021-06-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Harvey J. Lunsman ,  Benjamin Kufahl

IPC: F25B45/00 ,  H05K7/20 ,  F25B41/24 ,  F25B41/31 ,  F25B49/00

CPC classification number: F25B45/00 ,  F25B41/24 ,  F25B41/31 ,  F25B49/005 ,  H05K7/20272 ,  F25B2345/002 ,  F25B2345/003 ,  F25B2500/222 ,  F25B2600/2513

Abstract: Example implementations relate to a leak mitigation (LM) system. The LM system may include a collection tank, a first valve unit coupled to the collection tank, a second valve unit coupled to a cooling loop carrying a coolant, and an LM pump coupled between the first valve unit and the second valve unit. Moreover, the leak mitigation system may also include a controller operatively coupled to the first valve unit, the second valve unit, and the LM pump to operate, in an event of a leak of the coolant from the cooling loop, the first valve unit, the second valve unit, and the LM pump to transfer at least a portion of the coolant to the collection tank from the cooling loop via the second valve unit and the first valve unit.

公开(公告)号：US11579668B2

公开(公告)日：2023-02-14

申请号：US17030677

申请日：2020-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Steven Dean ,  John Franz ,  Brady Dulian

IPC: G06F1/18 ,  H05K1/14 ,  H05K7/10

Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

公开(公告)号：US20210333846A1

公开(公告)日：2021-10-28

申请号：US16860926

申请日：2020-04-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer Medina ,  Tahir Cader ,  Steven Dean

IPC: G06F1/20 ,  H05K7/20

Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.

公开(公告)号：US10667431B1

公开(公告)日：2020-05-26

申请号：US16398115

申请日：2019-04-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  John Franz ,  Tahir Cader ,  Ernesto Ferrer Medina

IPC: G06F1/20 ,  H05K7/20 ,  H05K1/02

Abstract: An example thermal interface device to attach to and cool a memory module. The device includes two sides sections that cover and contact the side faces of the memory module when installed. The device includes an outer layer that is a thermally conductive and resilient material, and an inner layer that is a thermally conductive and malleable metal. The inner layer may be nested within the outer layer, and the inner layer contacts the memory circuits of the memory module when installed. The outer layer includes spring fingers extending outward so as to contact and be compressed by a heat transfer device, such as a heat pipe, that is positioned on a side of the memory module. A thermally conductive path is thereby provided between the memory module and the heat transfer device via the thermal interface device.

公开(公告)号：US20200163253A1

公开(公告)日：2020-05-21

申请号：US16196372

申请日：2018-11-20

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Harvey J. Lunsman ,  Tahir Cader

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/18 ,  H05K1/02

Abstract: An example cooling system is described herein. The cooling system can include a first cold plate including a first heat pipe to couple to a side of a dual in-line memory module (DIMM) where the first heat pipe transfers heat from the DIMM to the first cold plate; and a second cold plate including a second heat pipe to couple to the side of the DIMM, where the second heat pipe transfers heat from the DIMM to the second cold plate.