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公开(公告)号：US09731509B2
公开(公告)日：2017-08-15
申请号：US14770425
申请日：2013-07-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie
CPC classification number: B41J2/1637 , B41J2/14016 , B41J2/14201 , B41J2/1601 , B41J2/1607 , B41J2/1628 , B41J2/1632 , B41J2/1645 , B41J2002/14491 , B41J2202/19 , B41J2202/20
Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding, and a fluid feed hole formed through the micro device. A fluid channel is fluidically coupled to the fluid feed hole and includes a first compression molded channel segment and a second material ablated channel segment.
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公开(公告)号：US09707766B2
公开(公告)日：2017-07-18
申请号：US15111148
申请日：2014-01-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Sterling Chaffins , Kevin P. DeKam , Chien-Hua Chen
CPC classification number: B41J2/175 , B29B11/06 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1637 , B41J2002/14362 , H01L2924/181 , H01L2924/186
Abstract: A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.
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公开(公告)号：US20170072693A1
公开(公告)日：2017-03-16
申请号：US15341851
申请日：2016-11-02
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie
IPC: B41J2/155
CPC classification number: B41J2/155 , B41J2/14 , B41J2/1404 , B41J2/14129 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/145 , B41J2/1603 , B41J2/1607 , B41J2/1637 , B41J25/34 , B41J2002/14419 , B41J2202/20
Abstract: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow o the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.
Abstract translation: 在一个示例中，流体喷射装置包括嵌入印刷电路板中的打印头芯片。 流体可以通过印刷电路板中的插入式流体供给槽并进入打印头芯片而流过打印头芯片。
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公开(公告)号：US20160257117A1
公开(公告)日：2016-09-08
申请号：US15032022
申请日：2013-10-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie , Zhuqing Zhang
CPC classification number: B41J2/1433 , B41J2/14024 , B41J2/14072 , B41J2/1601 , B41J2/1623 , H01L21/56 , H01L21/67126 , H01L24/48 , H01L24/85 , H01L2224/4382 , H01L2224/45005 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48157 , H01L2224/4845 , H01L2224/48464 , H01L2224/8592 , H01L2924/01004 , H01L2924/01047 , H01L2924/10253 , H01L2924/00014
Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.
Abstract translation: 封装具有低轮廓封装的接合线包括在与第一端上的管芯连接的接合线上施加封装，并在第二端上施加封装，并截断封装形状以形成截头形状。
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公开(公告)号：US09287126B2
公开(公告)日：2016-03-15
申请号：US13872632
申请日：2013-04-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Hua Chen , Kianush Naeli , Stephen R. Farrar
CPC classification number: H01L21/2007 , C03C27/00 , H01L24/74 , H01L24/80 , H01L2224/05638 , H01L2224/05687 , H01L2224/08145 , H01L2224/08225 , H01L2224/74 , H01L2224/75102 , H01L2224/7525 , H01L2224/759 , H01L2224/75901 , H01L2224/80048 , H01L2224/80487 , H01L2224/80488 , H01L2224/80893 , H01L2924/1461 , H01L2924/00 , H01L2224/80 , H01L2924/00012 , H01L2924/01014 , H01L2924/05442
Abstract: An electric field concurrently anodically bonds together wafers of each of a plurality of independent wafer pairs.
Abstract translation: 电场同时阳极连接在多个独立晶片对中的每一个的晶片。
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Patent Agency Ranking
公开(公告)号：US20160016404A1
公开(公告)日：2016-01-21
申请号：US14770691
申请日：2013-12-19
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie
CPC classification number: B41J2/1623 , B41J2/1404 , B41J2/14072 , B41J2/1603 , B41J2/1628 , B41J2/1632 , B41J2202/20
Abstract: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow to the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.
Abstract translation: 在一个示例中，流体喷射装置包括嵌入印刷电路板中的打印头芯片。 流体可以通过印刷电路板中的插入式流体供给槽并进入打印头芯片而流动到打印头模具。
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公开(公告)号：US20160009084A1
公开(公告)日：2016-01-14
申请号：US14769994
申请日：2013-02-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie
IPC: B41J2/14
CPC classification number: B41J2/155 , B41J2/14 , B41J2/1404 , B41J2/14129 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/145 , B41J2/1603 , B41J2/1607 , B41J2/1637 , B41J25/34 , B41J2002/14419 , B41J2202/20
Abstract: In one example, a fluid flow structure includes a micro device embedded in a molding having a channel therein through which fluid may flow directly into the device and/or onto the device.
Abstract translation: 在一个示例中，流体流动结构包括嵌入在其中具有通道的模制件中的微型装置，流体可以通过该通道直接流入装置和/或流向装置。
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公开(公告)号：US12134274B2
公开(公告)日：2024-11-05
申请号：US18454771
申请日：2023-08-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie , Michael G. Groh
Abstract: An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.
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公开(公告)号：US20240100849A1
公开(公告)日：2024-03-28
申请号：US17919006
申请日：2020-04-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Hua Chen , Michael G Groh , Bo Song
CPC classification number: B41J2/17553 , B41J2/1606 , B41J2/1632
Abstract: A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.
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公开(公告)号：US20230356527A1
公开(公告)日：2023-11-09
申请号：US18222369
申请日：2023-07-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Michael W. Cumbie , Anthony M. Fuller , Chien-Hua Chen
CPC classification number: B41J2/1433 , B41J2/162 , B41J2/1637
Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.
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