-
公开(公告)号：US20160368267A1
公开(公告)日：2016-12-22
申请号：US15257625
申请日：2016-09-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Rio Rivas , Ed Friesen , Lawrence Thurber , Garrett E. Clark , Rosanna L. Bigford
CPC classification number: B41J2/1433 , B32B37/1284 , B32B37/18 , B32B38/0004 , B32B38/0008 , B41J2/01 , B41J2/14024 , B41J2/1603 , B41J2/1623 , B41J2/17503 , B41J2/1753 , Y10T156/1064
Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
-
公开(公告)号：US09511584B2
公开(公告)日：2016-12-06
申请号：US14418442
申请日：2012-09-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Garrett E. Clark , Chris Bakker , Mark H. MacKenzie , Glenn D. McCloy
CPC classification number: B41J2/04563 , B41J2/0454 , B41J2/0458 , B41J2/04581 , B41J2/04586 , B41J2/14072 , B41J2/1433 , B41J2/155 , B41J2002/14491
Abstract: A print head die with thermal control is described. In an example, a print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; a temperature sensor formed on the substrate adjacent to a first one of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent to a last one of the liquid feed slots farthest from the first liquid feed slot.
Abstract translation: 描述了具有热控制的打印头模具。 在一个示例中，打印头模具包括其中形成有沿着基板的主要尺寸延伸的液体进料槽的基板和沿着每个液体进料槽的相对侧延伸的喷嘴; 温度传感器，形成在与所述液体供给槽中的第一个相邻的所述基板上; 以及沿着与距离第一液体进料槽最远的最后一个液体进料槽相邻的主要尺寸在基底上形成的电互连。
-
公开(公告)号：US09365034B2
公开(公告)日：2016-06-14
申请号：US14771485
申请日：2013-02-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Garrett E. Clark , Christopher H. Bakker , Yit Hong Tor , Glory J. Abadilla , Andrew Phillips , Glenn D. McCloy
CPC classification number: B41J2/04541 , B41J2/04543 , B41J2/04545 , B41J2/155 , B41J29/02 , B41J2202/17
Abstract: An apparatus and method support a plurality of print head dies (24, 324, 524) on a print bar (22, 322, 522). The plurality of print head dies (24, 324, 524) comprise a print head die (24, 324, 524) having a circuit (26, 526) forming a series (28, 328) of information bits (30), wherein bit locations in the series (28, 328) are mapped to information type definitions based on a location of the print head die (24, 324, 524) on the print bar (22, 322, 522) relative to other print head dies (24, 324, 524) on the print bar (22, 322, 522).
Abstract translation: 一种装置和方法支持打印条（22,322,522）上的多个打印头模具（24,324,524）。 多个打印头模具（24,324,524）包括具有形成信息位（30）的一系列（28,328）的电路（26,526）的打印头模具（24,324,524），其中位 基于打印头（22,324,524）上相对于其他打印头模具（24,324,524）的打印头模具（22,322,524）的位置，系列（28,328）中的位置被映射到信息类型定义 ，324,524）在打印条（22,322,522）上。
-
公开(公告)号：US20160009079A1
公开(公告)日：2016-01-14
申请号：US14771485
申请日：2013-02-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Garrett E. Clark , Christopher H. Bakker , Yit Hong Tor , Glory J. Abadilla , Andrew Phillips , Glenn D. Mccloy
IPC: B41J2/045
CPC classification number: B41J2/04541 , B41J2/04543 , B41J2/04545 , B41J2/155 , B41J29/02 , B41J2202/17
Abstract: An apparatus and method support a plurality of print head dies (24, 324, 524) on a print bar (22, 322, 522). The plurality of print head dies (24, 324, 524) comprise a print head die (24, 324, 524) having a circuit (26, 526) forming a series (28, 328) of information bits (30), wherein bit locations in the series (28, 328) are mapped to information type definitions based on a location of the print head die (24, 324, 524) on the print bar (22, 322, 522) relative to other print head dies (24, 324, 524) on the print bar (22, 322, 522).
Abstract translation: 一种装置和方法支持打印条（22,322,522）上的多个打印头模具（24,324,524）。 多个打印头模具（24,324,524）包括具有形成信息位（30）的一系列（28,328）的电路（26,526）的打印头模具（24,324,524），其中位 基于打印头（22,324,524）上相对于其他打印头模具（24,324,524）的打印头模具（22,322,524）的位置，系列（28,328）中的位置被映射到信息类型定义 ，324,524）在打印条（22,322,522）上。
-
公开(公告)号：US20150022575A1
公开(公告)日：2015-01-22
申请号：US14374807
申请日：2012-01-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Garrett E. Clark , Chris Bakker , Eric T. Martin , Vincent Gerard Heesen , Mark H. Mackenzie
IPC: B41J2/045
CPC classification number: B41J2/0457 , B41J2/0452 , B41J2/04543 , B41J2/04586 , B41J2/2054 , B41J2/2132
Abstract: A printhead system to reduce peak energy usage may include a printhead including a plurality of primitives including nozzles. A printhead control module may control the printhead to increase printed pixel resolution and to reduce peak pixel fill density for print media. The printhead control module may further control the printhead such that all the nozzles with a same address generally disposed in a column do not fire at the same time.
Abstract translation: 用于减少峰值能量使用的打印头系统可以包括包括多个包括喷嘴的图元的打印头。 打印头控制模块可以控制打印头以增加打印像素分辨率并减少打印介质的峰值像素填充密度。 打印头控制模块可以进一步控制打印头，使得具有通常设置在列中的相同地址的所有喷嘴不会同时触发。
-
Patent Agency Ranking
公开(公告)号：US20230286262A1
公开(公告)日：2023-09-14
申请号：US18018253
申请日：2020-07-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Eric Thomas Martin , Garrett E. Clark , Jeremy Spencer , Vincent C. Korthuis , Rogelio Cicili
IPC: B41J2/045
CPC classification number: B41J2/04541 , B41J2/0458
Abstract: A fluidic die includes fluid-transfer elements, and a temperature sensor to monitor a temperature on the fluidic die. The fluidic die includes a trickle-warming circuit to warm fluid transferrable by the fluid-transfer elements, and a pulse-warming circuit to warm the fluid. A warming control circuit selectively activates the trickle-warming and pulse-warming circuits.
-
公开(公告)号：US20220111645A1
公开(公告)日：2022-04-14
申请号：US17560994
申请日：2021-12-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Garrett E. Clark , Michael W. Cumbie , Chien-Hua Chen
Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
-
公开(公告)号：US11285731B2
公开(公告)日：2022-03-29
申请号：US16764368
申请日：2019-01-09
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Garrett E. Clark , Michael W. Cumbie
Abstract: A fluid ejection device may include fluid actuators, ejection chambers adjacent the fluid actuators, nozzles extending from the ejection chambers, and fluid feed holes to supply fluid from a fluid supply passage to the ejection chambers. The fluid feed holes have ports connected to the ejection chambers. The ports are sized to pass bubbles formed by the fluid actuators out of the ejection chambers.
-
公开(公告)号：US11235574B2
公开(公告)日：2022-02-01
申请号：US15772377
申请日：2016-02-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Garrett E. Clark , Michael W. Cumbie , Chien-Hua Chen
IPC: B01L99/00 , B41J2/05 , B41J2/14 , B01L3/00 , F04B43/04 , B81B1/00 , B81B7/00 , B81C1/00 , F04B19/00
Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
-
公开(公告)号：US20210039392A1
公开(公告)日：2021-02-11
申请号：US16965689
申请日：2018-03-12
Applicant: Hewlett- Packard Development Company, L.P.
Inventor： Garrett E. Clark
IPC: B41J2/14
Abstract: A fluid ejection die may include a number of fluid ejection chambers laid to correlate with a number of dividers formed in a fluid channel layer such that adjacent fluid ejection chambers are alternatively arranged on a relatively higher-temperature side of the fluid ejection die and a relatively lower-temperature side of the fluid ejection die.
-
-
-
-
-
-
-
-
-
Search Results
56
records
(took 0.021 seconds)
