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公开(公告)号：US20160368267A1
公开(公告)日：2016-12-22
申请号：US15257625
申请日：2016-09-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Rio Rivas , Ed Friesen , Lawrence Thurber , Garrett E. Clark , Rosanna L. Bigford
CPC classification number: B41J2/1433 , B32B37/1284 , B32B37/18 , B32B38/0004 , B32B38/0008 , B41J2/01 , B41J2/14024 , B41J2/1603 , B41J2/1623 , B41J2/17503 , B41J2/1753 , Y10T156/1064
Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
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公开(公告)号：US09579893B2
公开(公告)日：2017-02-28
申请号：US15257625
申请日：2016-09-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Rio Rivas , Ed Friesen , Lawrence Thurber , Garrett E. Clark , Rosanna L. Bigford
CPC classification number: B41J2/1433 , B32B37/1284 , B32B37/18 , B32B38/0004 , B32B38/0008 , B41J2/01 , B41J2/14024 , B41J2/1603 , B41J2/1623 , B41J2/17503 , B41J2/1753 , Y10T156/1064
Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
Abstract translation: 控制基材和载体之间的粘合剂包括在印刷头的基材的背面的接合区域中形成凹陷，其中接合区域形成在靠近基板的厚度形成的供墨槽，从背面到前面 侧面 将粘合剂放置在接合区域和基板载体之间，并且将基板和基板载体移动到一起，使得粘合剂流入凹部。
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