公开(公告)号：US09814117B2

公开(公告)日：2017-11-07

申请号：US13377359

申请日：2010-05-18

Applicant: Damien Loveland ,  A. J. W. A Vermuelen ,  Ian Ashdown ,  Louis Ketelaars

Inventor： Damien Loveland ,  A. J. W. A Vermuelen ,  Ian Ashdown ,  Louis Ketelaars

IPC: H05B37/02

CPC classification number: H05B37/0245

Abstract: Systems and methods for deriving and modifying personal preferences related to at least one controllable lighting network are disclosed. The systems include a processor that can be used in conjunction with a personal communication device and a preferences database. The processor is used to detect an identifier for a user, a plurality of adjustments to the at least one controllable lighting network requested by the user, and a context corresponding to each of the plurality of adjustments. The processor in some such systems has an associated local memory to store the plurality of adjustments, corresponding contexts, and the identifier of the associated user. The processor is further used to analyze the plurality of lighting adjustments and the corresponding contexts. Based on the analysis, the processor identifies a correlation between the plurality of adjustments and the contexts, and create at least one personal preference rule associated with the user identifier based on the correlation. The preferences database in some such systems is used to store the rules and the plurality of adjustments.

公开(公告)号：US09246070B2

公开(公告)日：2016-01-26

申请号：US14631392

申请日：2015-02-25

Applicant: Tom Pinnington ,  Henry Ip ,  Michael A. Tischler ,  Ian Ashdown ,  Philippe M. Schick

Inventor： Tom Pinnington ,  Henry Ip ,  Michael A. Tischler ,  Ian Ashdown ,  Philippe M. Schick

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/32 ,  H01L33/60 ,  H01L33/62 ,  H01L23/495

CPC classification number: H01L33/505 ,  H01L23/495 ,  H01L27/15 ,  H01L27/156 ,  H01L33/32 ,  H01L33/504 ,  H01L33/507 ,  H01L33/508 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/07811 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.

公开(公告)号：US08988005B2

公开(公告)日：2015-03-24

申请号：US13398316

申请日：2012-02-16

Applicant: Paul Jungwirth ,  Ian Ashdown ,  Michael Albert Tischler

Inventor： Paul Jungwirth ,  Ian Ashdown ,  Michael Albert Tischler

IPC: H05B37/02 ,  H05B33/08

CPC classification number: H05B33/0824

Abstract: In various embodiments, an illumination system includes multiple light-emitting strings that are selectively activated or deactivated to regulate an overall output of the array.

Abstract translation: 在各种实施例中，照明系统包括多个发光串，其被选择性地激活或去激活以调节阵列的总体输出。

公开(公告)号：US20150001465A1

公开(公告)日：2015-01-01

申请号：US14456573

申请日：2014-08-11

Applicant: Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

Inventor： Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

IPC: H01L33/62 ,  H01L33/00 ,  H01L27/15 ,  H01L33/60

CPC classification number: F21K9/66 ,  F21K9/20 ,  F21K9/275 ,  F21K9/278 ,  F21K9/64 ,  F21K9/65 ,  F21V3/02 ,  F21V9/30 ,  F21V23/003 ,  F21V23/02 ,  F21V29/74 ,  F21Y2115/10 ,  G02F1/133603 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L27/156 ,  H01L31/0468 ,  H01L33/0025 ,  H01L33/06 ,  H01L33/08 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10321 ,  H01L2924/10322 ,  H01L2924/10323 ,  H01L2924/10324 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10334 ,  H01L2924/10335 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/381 ,  H02S30/00 ,  H05B33/0854 ,  H05B37/0218 ,  H05B37/0227 ,  H05B37/0245 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/302 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

公开(公告)号：US20140218915A1

公开(公告)日：2014-08-07

申请号：US14199375

申请日：2014-03-06

Applicant: Ian Ashdown ,  Michael A. Tischler

Inventor： Ian Ashdown ,  Michael A. Tischler

IPC: F21V5/00 ,  F21V5/04

CPC classification number: F21V33/00 ,  F21V5/007 ,  F21V5/04 ,  F21V5/045 ,  F21V5/08 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02B3/0056 ,  G02B3/08 ,  G02B19/0028 ,  G02B19/0066 ,  G02B27/0961 ,  G02B2207/113 ,  Y10T29/49

Abstract: In various embodiments, a lens array comprises a plurality of aspheric lens elements each optically coupled to a light-emitting element and producing an out-of-focus image thereof. The images combine to generate a target luminous intensity distribution, e.g., providing constant illuminance on a plane.

Abstract translation: 在各种实施例中，透镜阵列包括多个非球面透镜元件，每个非球面透镜元件光学耦合到发光元件并产生离焦图像。 这些图像组合以产生目标发光强度分布，例如在平面上提供恒定的照度。

公开(公告)号：US20140191257A1

公开(公告)日：2014-07-10

申请号：US14169384

申请日：2014-01-31

Applicant: Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

Inventor： Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

IPC: H01L33/58 ,  H01L33/50

CPC classification number: F21K9/66 ,  F21K9/20 ,  F21K9/275 ,  F21K9/278 ,  F21K9/64 ,  F21K9/65 ,  F21V3/02 ,  F21V9/30 ,  F21V23/003 ,  F21V23/02 ,  F21V29/74 ,  F21Y2115/10 ,  G02F1/133603 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L27/156 ,  H01L31/0468 ,  H01L33/0025 ,  H01L33/06 ,  H01L33/08 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10321 ,  H01L2924/10322 ,  H01L2924/10323 ,  H01L2924/10324 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10334 ,  H01L2924/10335 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/381 ,  H02S30/00 ,  H05B33/0854 ,  H05B37/0218 ,  H05B37/0227 ,  H05B37/0245 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/302 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

公开(公告)号：US08552463B2

公开(公告)日：2013-10-08

申请号：US13751563

申请日：2013-01-28

Applicant: Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

Inventor： Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

IPC: H01L33/00 ,  H01L21/00

CPC classification number: F21K9/66 ,  F21K9/20 ,  F21K9/275 ,  F21K9/278 ,  F21K9/64 ,  F21K9/65 ,  F21V3/02 ,  F21V9/30 ,  F21V23/003 ,  F21V23/02 ,  F21V29/74 ,  F21Y2115/10 ,  G02F1/133603 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L27/156 ,  H01L31/0468 ,  H01L33/0025 ,  H01L33/06 ,  H01L33/08 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10321 ,  H01L2924/10322 ,  H01L2924/10323 ,  H01L2924/10324 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10334 ,  H01L2924/10335 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/381 ,  H02S30/00 ,  H05B33/0854 ,  H05B37/0218 ,  H05B37/0227 ,  H05B37/0245 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/302 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

公开(公告)号：US20120184299A1

公开(公告)日：2012-07-19

申请号：US13381381

申请日：2010-06-17

Applicant: Damien Loveland ,  A.J.W.A. Vermeullen ,  Ian Ashdown

Inventor： Damien Loveland ,  A.J.W.A. Vermeullen ,  Ian Ashdown

IPC: G05D25/00 ,  H04W4/02

CPC classification number: H05B37/0245 ,  G05B15/02 ,  H04L12/2829 ,  H04L63/08 ,  H04L63/102 ,  H04L67/125 ,  H04L67/306 ,  H04L2012/285 ,  H05B33/0854 ,  H05B37/0227 ,  H05B37/029

Abstract: Systems and methods for managing interaction with controllable lighting networks are disclosed. Particularly, a user's input regarding the user's preferred level of interaction with a controllable lighting network is used in conjunction with memories and processors, to selectively allow the controllable lighting network access to the user's personal data such as the user's identity or the user's personal lighting preferences. A user's preferred level of interaction with a controllable lighting network is also used, in conjunction with personal mobile electronic communication devices, to allow the user to control lighting within controllable lighting networks.

Abstract translation: 公开了用于管理与可控照明网络的交互的系统和方法。 特别地，用户关于用户与可控照明网络的优选交互水平的输入结合存储器和处理器使用，以选择性地允许可控照明网络访问用户的个人数据，例如用户的身份或用户的个人照明偏好 。 与可控照明网络的用户优选的交互水平也与个人移动电子通信设备一起使用，以允许用户控制可控照明网络内的照明。

公开(公告)号：US20120027557A1

公开(公告)日：2012-02-02

申请号：US12966992

申请日：2010-12-13

Applicant: Ian Ashdown ,  Ingo Speier

Inventor： Ian Ashdown ,  Ingo Speier

IPC: H01L21/677 ,  H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L33/005 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/95145 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/303 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A transfer stamp that can be charged with a spatial pattern of electrostatic charge for picking up selected semiconductor dice from a host substrate and transferring them to a target substrate. The stamp may be bulk charged and then selectively discharged using irradiation through a patterned mask. The technique may also be used to electrostatically transfer selected semiconductor dice from a host substrate to a target substrate.

Abstract translation: 可以带有静电电荷的空间图案的传送印记，用于从主机基板拾取所选择的半导体晶片并将其传送到目标基板。 印模可以是体积充电的，然后通过图案化掩模的照射选择性地放电。 该技术还可以用于将选定的半导体晶片从主机衬底静电转移到目标衬底。

公开(公告)号：US07894050B2

公开(公告)日：2011-02-22

申请号：US11814472

申请日：2006-11-17

Applicant: Ian Ashdown ,  Shane Robinson ,  Marc Salsbury

Inventor： Ian Ashdown ,  Shane Robinson ,  Marc Salsbury

IPC: G01J1/42

CPC classification number: G01J3/36 ,  G01J3/51 ,  G01J3/513 ,  G01J9/00 ,  G01J2001/4247 ,  G01J2003/1213

Abstract: The present invention provides a method and apparatus for determining intensities and peak wavelengths of light. The apparatus comprises one or more pairs of sensing units for sensing the light, a first sensing unit of a pair configured to sense a first intensity of the light in a first predetermined wavelength range with a first predetermined spectral responsivity and a second sensing unit of a pair configured to sense a second intensity of the light in the first predetermined wavelength range with a second predetermined spectral responsivity. The apparatus further comprises a processing system operatively connected to the one or more pairs of sensing units; the processing system configured to determine the intensity and peak wavelength for each of the one or more predetermined wavelength ranges of the light according to one or more predetermined functional relationships between each of the first intensity and second intensity.

Abstract translation: 本发明提供一种用于确定光的强度和峰值波长的方法和装置。 该装置包括用于感测光的一对或多对感测单元，配置成以第一预定光谱响应度感测具有第一预定光谱响应度的第一预定波长范围内的光的第一强度的一对第一感测单元和第一感测单元 配置成以第二预定光谱响应度感测第一预定波长范围内的光的第二强度。 该装置还包括可操作地连接到一对或多对感测单元的处理系统; 所述处理系统被配置为根据所述第一强度和第二强度中的每一个之间的一个或多个预定函数关系来确定所述一个或多个预定波长范围中的每一个的强度和峰值波长。