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公开(公告)号:US10910285B2
公开(公告)日:2021-02-02
申请号:US15943736
申请日:2018-04-03
Applicant: InnoLux Corporation
Inventor: Yi-Hung Lin , Chien-Chang Lu , Cheng-I Wu , Li-Wei Sung , Cheng-Chi Wang , Chin-Lung Ting
IPC: H01L23/31 , H01L23/00 , H01L27/02 , H01L25/065 , H01L27/12
Abstract: The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.
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公开(公告)号:US10825743B2
公开(公告)日:2020-11-03
申请号:US16438729
申请日:2019-06-12
Applicant: InnoLux Corporation
Inventor: Ker-Yih Kao , Liang-Lu Chen , Chin-Lung Ting
IPC: H01L21/66 , H01L25/075 , H01L33/62 , H01L27/12
Abstract: An electronic device is provided. The electronic device includes a substrate and an electronic unit disposed on the substrate. The electronic unit includes a light-emitting diode, a conductive structure, a first driving circuit, and a second driving circuit. The conductive structure is disposed between the light-emitting diode and the substrate. The first driving circuit includes a first output wire. The second driving circuit includes a second output wire. The first driving circuit is electrically connected to the light-emitting diode by the conductive structure. The second driving circuit is electrically insulated from the light-emitting diode. In addition, the conductive structure at least partially overlaps the first output wire and the second output wire in a normal direction of the substrate.
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公开(公告)号:US10820425B2
公开(公告)日:2020-10-27
申请号:US16446653
申请日:2019-06-20
Applicant: Innolux Corporation
Inventor: Wei-Cheng Chu , Chia-Cheng Liu , Chih-Yuan Lee , Chin-Lung Ting , Tong-Jung Wang
IPC: H05K1/00 , H05K1/02 , H05K1/18 , H05K3/30 , H05K3/32 , H05K3/36 , H01L21/02 , H01L21/44 , H01L23/48 , H01L23/498 , H01J17/02 , H01J17/34 , H05K1/11 , H05K3/06 , H05K1/14 , G02F1/1345 , H05K3/46
Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.
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公开(公告)号:US10811769B2
公开(公告)日:2020-10-20
申请号:US16000242
申请日:2018-06-05
Applicant: InnoLux Corporation
Inventor: Chin-Lung Ting , Chen-Chang Wang , Kuang-Hsiang Lee , Hsiu-Tung Lin
Abstract: A liquid-crystal antenna apparatus is provided. The liquid-crystal antenna apparatus includes: a liquid-crystal antenna unit and a control unit. The liquid-crystal antenna unit is configured to receive a wireless signal. The liquid-crystal antenna unit includes a plurality of microwave elements, and each of the microwave elements includes a first electrode, a second electrode opposite to the first electrode, and a liquid-crystal cell disposed between the first electrode and the second electrode. The control unit is electrically connected to the liquid-crystal antenna unit, and is configured to control the liquid-crystal antenna unit to form a first beam having a first direction. The control unit determines a source orientation of the wireless signal according to the wireless signal received by the liquid-crystal antenna unit, and controls the first direction of the first beam to direct toward the source orientation.
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公开(公告)号:US10651549B2
公开(公告)日:2020-05-12
申请号:US16026171
申请日:2018-07-03
Applicant: InnoLux Corporation
Inventor: I-Yin Li , Chin-Lung Ting , Chia-Chi Ho , Yi-Hung Lin
Abstract: A microwave device includes a first substrate having a first surface, a first metal layer, a second substrate having a second surface corresponding to the first substrate, a second metal layer, a sealing element, a modulation material, and a fill material. The first metal layer is disposed on the first surface, and the first metal layer includes openings. The second metal layer is disposed on the second surface. The second metal layer includes electrodes corresponding to the openings. The sealing element is located between the first substrate and the second substrate. An active zone is formed by a space between the sealing element, the first substrate, and the second substrate. The modulation material is filled within the active area. The fill material is disposed in the active area. The thickness of the fill material is greater than 0.3 μm, and less than the thickness of the sealing element.
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公开(公告)号:US10534400B2
公开(公告)日:2020-01-14
申请号:US15987917
申请日:2018-05-24
Applicant: InnoLux Corporation
Inventor: Yuan-Lin Wu , Kuan-Feng Lee , Chin-Lung Ting
Abstract: A foldable electronic device includes an electronic element including a folding line and a cover layer connected to the electronic element through an intermediate layer. The electronic element, the cover layer and the intermediate layer form at least one air gap across the folding line.
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公开(公告)号:US20190325825A1
公开(公告)日:2019-10-24
申请号:US16362683
申请日:2019-03-24
Applicant: InnoLux Corporation
Inventor: Ming-Chun Tseng , Chin-Lung Ting , Li-Wei Mao
IPC: G09G3/3233 , G09G3/3291
Abstract: An electronic device includes an electronic unit including a light emitting diode (LED) and a driving unit coupled to the light emitting diode for receiving a data voltage. The electronic unit has a plurality of driving periods in a frame period, and the driving unit drives the LED according to the data voltage in the plurality of driving periods.
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公开(公告)号:US10249949B2
公开(公告)日:2019-04-02
申请号:US15869786
申请日:2018-01-12
Applicant: InnoLux Corporation
Inventor: I-Yin Li , Chia-Chi Ho , Chin-Lung Ting , Yan-Zheng Wu
Abstract: A microwave modulation device includes a first radiator; a second radiator disposed on the first radiator; a third radiator disposed on the second radiator; a support structure disposed between the first radiator and the second radiator; and a modulation structure disposed between the second radiator and the third radiator. A microwave-transmission layer is located among the space defined by the first radiator, the second radiator, and the support structure. The microwave-transmission layer is gas, substantially vacuum, liquid or insulating material.
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公开(公告)号:US20250063801A1
公开(公告)日:2025-02-20
申请号:US18934223
申请日:2024-10-31
Applicant: Innolux Corporation
Inventor: Chin-Lung Ting , Jen-Hai Chi , Chia-Ping Tseng , Chen-Lin Yeh , Chung-Kuang Wei , Cheng-Hsu Chou
IPC: H01L27/06 , H01L29/778 , H01L29/93
Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.
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公开(公告)号:US20240312375A1
公开(公告)日:2024-09-19
申请号:US18671953
申请日:2024-05-22
Applicant: InnoLux Corporation
Inventor: Chin-Lung Ting , Chung-Kuang Wei , Li-Wei Mao , Chi-Liang Chang , Chia-Hui Lin
CPC classification number: G09F9/3026 , G09G3/32 , G09G2300/026
Abstract: The present disclosure provides an electronic device including a substrate, a plurality of bumps, a plurality of diodes, and a shielding layer. The substrate has a plurality of first through holes. The bumps are disposed on the substrate. The diodes are disposed on the substrate. The shielding layer is disposed on the substrate. One of the bumps is located between two adjacent ones of the diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the bumps and at least a portion of the first through holes.
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