公开(公告)号：US20190071553A1

公开(公告)日：2019-03-07

申请号：US16119740

申请日：2018-08-31

Applicant: LG CHEM, LTD.

Inventor： Seung Min LEE ,  Suk Ky CHANG ,  Hyun Jee YOO ,  Jung Sup SHIM ,  Yoon Gyung CHO ,  Kyung Yul BAE

IPC: C08K3/22 ,  C08L63/00 ,  C08G59/50 ,  C09J163/00 ,  C08K3/01 ,  H01L21/56 ,  H01L51/52

Abstract: Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.

公开(公告)号：US20170166715A1

公开(公告)日：2017-06-15

申请号：US15116167

申请日：2015-02-17

Applicant: LG CHEM, LTD.

Inventor： Ban Seok CHOI ,  Hyun Jee YOO ,  Hyun Suk KIM ,  Seung Min LEE ,  Jung Ok MOON ,  Se Woo YANG

IPC: C08J5/18 ,  H01L51/52

CPC classification number: H01L51/5253 ,  B32B2457/206 ,  C08J5/18 ,  C08J2363/00 ,  C08J2463/04 ,  C08J2471/12 ,  C08L63/00 ,  H01L51/0035 ,  H01L51/5012 ,  H01L51/5218 ,  H01L51/5234 ,  H01L51/5243 ,  H01L51/5259 ,  H01L51/5284 ,  H01L51/529 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2251/5392

Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

公开(公告)号：US20160133872A1

公开(公告)日：2016-05-12

申请号：US14892929

申请日：2014-05-21

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee YOO ,  Seung Min LEE ,  Hyun Suk KIM ,  Suk Ky CHANG ,  Jung Ok MOON

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L51/0035 ,  H01L51/004 ,  H01L51/0043 ,  H01L51/5243 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/303 ,  H01L2251/558

Abstract: Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.

Abstract translation: 提供一种有机电子器件（OED）及其制造方法。 OED可以有效地阻止从外部环境渗透到OED中的水分或氧气，通过增加有机电子二极管的寿命和耐用性来提供高可靠性，并且在封装有机电子二极管的膜的附着过程中最小化对准误差 到基底。

公开(公告)号：US20160118620A1

公开(公告)日：2016-04-28

申请号：US14890818

申请日：2014-05-21

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee YOO ,  Hyun Suk KIM ,  Suk Ky CHANG ,  Seung Min LEE ,  Jung Ok MOON

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L51/0035 ,  H01L51/004 ,  H01L51/0094 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/303

Abstract: Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, prevent adhesion failure and damage to an organic film due to volume expansion occurring by a reaction between a moisture adsorbent and moisture, and provide high reliability due to increases in a lifespan and durability of the OED.

Abstract translation: 提供了一种封装膜，用于封装使用其的有机电子器件（OED）的产品，以及封装OED的方法。 封装膜可以有效地阻止从外部环境渗透到OED中的水分或氧气，防止由于水分吸附剂和水分之间的反应而发生体积膨胀而导致的粘附破坏和有机膜的损坏，并且由于增加 OED的寿命和耐久性。

公开(公告)号：US20160093830A1

公开(公告)日：2016-03-31

申请号：US14892110

申请日：2014-05-21

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee YOO ,  Seung Min LEE ,  Hyun Suk KIM ,  Suk Ky CHANG ,  Jung Ok MOON

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L51/0035 ,  H01L51/004 ,  H01L51/0043 ,  H01L51/5243 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/303 ,  H01L2251/558

Abstract: Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.

Abstract translation: 提供了一种封装膜，用于封装使用其的有机电子器件（OED）的产品，以及封装OED的方法。 封装膜可以有效地阻止从外部环境渗透到OED中的水分或氧气，由于OED的寿命和耐久性的增加而提供高可靠性，并且使膜附着到基板上的过程中的对准误差最小化。

公开(公告)号：US20150060836A1

公开(公告)日：2015-03-05

申请号：US14528828

申请日：2014-10-30

Applicant: LG CHEM, LTD.

Inventor： Jung Sup SHIM ,  Hyun Jee YOO ,  Seung Min LEE ,  Suk Ky CHANG ,  Yoon Gyung CHO ,  Kyung Yul BAE

IPC: H01L51/52 ,  H01L51/56 ,  C09J7/02

CPC classification number: H01L51/5246 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/556 ,  H05B33/04 ,  H05B33/10 ,  Y10T428/24942 ,  Y10T428/28 ,  Y10T428/2826

Abstract: Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan δ) at 60 to 100° C. of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same.

Abstract translation: 提供一种粘合膜，使用其的有机电子器件（OED）封装产品和一种封装有机电子器件的方法，更具体地，涉及一种用于封装包含具有损耗的第一粘合剂层的有机电子元件的粘合膜 60〜100℃的系数（tanδ）为1〜5，第一粘合层上形成第二粘合层，以及使用该有机电子器件封装的方法。

公开(公告)号：US20140319999A1

公开(公告)日：2014-10-30

申请号：US14323703

申请日：2014-07-03

Applicant: LG CHEM, LTD.

Inventor： Yoon Gyung CHO ,  Hyun Jee YOO ,  Suk Ky CHANG ,  Jung Sup SHIM ,  Seung Min LEE

IPC: B32B27/08 ,  H01L51/52 ,  H01L51/56 ,  B32B27/18

CPC classification number: H01L51/5259 ,  B32B3/04 ,  B32B27/08 ,  B32B27/18 ,  B32B37/10 ,  B32B37/142 ,  B32B43/00 ,  B32B2037/1223 ,  B32B2037/243 ,  B32B2307/54 ,  B32B2307/7265 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2457/206 ,  C09D123/22 ,  C09D163/00 ,  H01L21/56 ,  H01L23/293 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/56 ,  H01L2924/0002 ,  H05B33/04 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/31511 ,  Y10T428/31931 ,  Y10T428/31938 ,  H01L2924/00

Abstract: Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

Abstract translation: 提供一种封装膜，电子器件及其制造方法。 可以提供具有优异的防湿性，可操作性，可加工性和耐久性的包封膜以及包含用封装膜封装的二极管的结构。

公开(公告)号：US20140318707A1

公开(公告)日：2014-10-30

申请号：US14323827

申请日：2014-07-03

Applicant: LG CHEM, LTD.

Inventor： Yoon Gyung CHO ,  Hyun Jee YOO ,  Suk Ky CHANG ,  Jung Sup SHIM ,  Seung Min LEE

IPC: B32B43/00

CPC classification number: H01L51/5259 ,  B32B3/04 ,  B32B27/08 ,  B32B27/18 ,  B32B37/10 ,  B32B37/142 ,  B32B43/00 ,  B32B2037/1223 ,  B32B2037/243 ,  B32B2307/54 ,  B32B2307/7265 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2457/206 ,  C09D123/22 ,  C09D163/00 ,  H01L21/56 ,  H01L23/293 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/56 ,  H01L2924/0002 ,  H05B33/04 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/31511 ,  Y10T428/31931 ,  Y10T428/31938 ,  H01L2924/00

Abstract: Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method.

Abstract translation: 提供一种制造电子设备的方法。 可以通过该方法提供具有优异的防潮性和耐久性的电子装置。