公开(公告)号：US20190074480A1

公开(公告)日：2019-03-07

申请号：US16125244

申请日：2018-09-07

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee YOO ,  Seung Min LEE ,  Hyun Suk KIM ,  Suk Ky CHANG ,  Jung Ok MOON

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

Abstract: Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.

公开(公告)号：US20190019987A1

公开(公告)日：2019-01-17

申请号：US16119600

申请日：2018-08-31

Applicant: LG CHEM, LTD.

Inventor： Ban Seok CHOI ,  Hyun Jee YOO ,  Hyun Suk KIM ,  Seung Min LEE ,  Jung Ok MOON ,  Se Woo YANG

IPC: H01L51/52 ,  C08J5/18 ,  C08L63/00 ,  H01L51/00 ,  H01L51/50 ,  H01L51/56

Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

公开(公告)号：US20180072927A1

公开(公告)日：2018-03-15

申请号：US15560042

申请日：2016-03-24

Applicant: LG CHEM, LTD.

Inventor： Seung Min LEE ,  So Young KIM ,  Jung Sup SHIM ,  Se Woo YANG

IPC: C09J133/04 ,  C08L33/06 ,  C08L101/02

CPC classification number: C09J133/04 ,  C08L33/04 ,  C08L33/06 ,  C08L63/00 ,  C08L75/04 ,  C08L101/02 ,  C08L2203/206 ,  H01L51/5246

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

公开(公告)号：US20180072925A1

公开(公告)日：2018-03-15

申请号：US15560025

申请日：2016-03-24

Applicant: LG CHEM, LTD.

Inventor： So Young KIM ,  Seung Min LEE ,  Jung Sup SHIM ,  Se Woo YANG

IPC: C09J123/22 ,  C09J11/04 ,  H01L51/00

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and excellent reliability at high temperature and high humidity, and an OED including the same.

公开(公告)号：US20170170427A1

公开(公告)日：2017-06-15

申请号：US15116158

申请日：2015-02-17

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee YOO ,  Seung Min LEE ,  Hyun Suk KIM ,  Jung Ok MOON ,  Ban Seok CHOI ,  Se Woo YANG

IPC: H01L51/52 ,  C08J5/18 ,  H01L51/00 ,  H01L51/50

CPC classification number: H01L51/5253 ,  B32B7/06 ,  B32B15/082 ,  B32B15/085 ,  B32B15/09 ,  B32B15/095 ,  B32B15/20 ,  B32B17/00 ,  B32B27/08 ,  B32B27/281 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/40 ,  B32B2250/03 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/302 ,  B32B2307/40 ,  B32B2307/416 ,  B32B2307/7246 ,  B32B2307/748 ,  B32B2457/206 ,  C08J5/18 ,  C08J2363/00 ,  C08J2463/04 ,  C08J2471/12 ,  C08L63/00 ,  H01L51/0035 ,  H01L51/5012 ,  H01L51/5218 ,  H01L51/5234 ,  H01L51/5243 ,  H01L51/5259 ,  H01L51/5284 ,  H01L51/529 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2251/5392

Abstract: Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device can be prevented.

公开(公告)号：US20170170426A1

公开(公告)日：2017-06-15

申请号：US15115862

申请日：2015-02-17

Applicant: LG CHEM, LTD.

Inventor： Jung Ok MOON ,  Hyun Jee YOO ,  Seung Min LEE ,  Hyun Suk KIM ,  Ban Seok CHOI ,  Se Woo YANG

IPC: H01L51/52 ,  H01L51/00 ,  C08J5/18 ,  H01L51/56 ,  C08L63/00

Abstract: Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

公开(公告)号：US20160155987A1

公开(公告)日：2016-06-02

申请号：US14899518

申请日：2014-06-19

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee YOO ,  Seung Min LEE ,  Yoon Gyung CHO ,  Kyung Yul BAE ,  Jung Sup SHIM ,  Suk Ky CHANG ,  Hyun Suk KIM ,  Jung Pk MOON ,  Ban Seok CHOI ,  Se Woo YANG

IPC: H01L51/52 ,  H01L51/00

CPC classification number: H01L51/5259 ,  C08J5/18 ,  C08K3/10 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08L2203/206 ,  G01N21/958 ,  H01L51/0034 ,  H01L51/0043

Abstract: There are provided a film and an organic electronic device. The present application may provide a film that may be provided for an evaluation method in which reliability of an encapsulant film is simply and easily evaluated only by measuring a haze immediately before the encapsulant film is used, thereby a failure of a product is determined and reliability may be predicted.

Abstract translation: 提供了一种胶片和一种有机电子装置。 本申请可以提供一种薄膜，其可以用于评估方法，其中密封剂薄膜的可靠性简单且容易地仅通过测量使用密封膜之前的雾度来评估，从而确定产品的故障和可靠性 可以预测。

公开(公告)号：US20160149131A1

公开(公告)日：2016-05-26

申请号：US14899978

申请日：2014-06-18

Applicant: LG CHEM, LTD.

Inventor： Jung Sup SHIM ,  Yoon Gyung CHO ,  Suk Ky CHANG ,  Hyun Jee YOO ,  Seung Min LEE ,  Kyung YuI BAE

IPC: H01L51/00 ,  H01L51/52 ,  C08J5/18 ,  C08L23/22

CPC classification number: H01L51/004 ,  C08J5/18 ,  C08J2323/22 ,  C08J2423/30 ,  C08L23/22 ,  C08L101/02 ,  C08L2203/206 ,  C08L2205/02 ,  C08L2205/08 ,  H01L23/293 ,  H01L51/0043 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There are provided a composition for encapsulation film, an encapsulation film, and an electronic device having the same. The present application may provide an encapsulation film having an excellent moisture barrier property, operability, workability, and durability and a structure including an element encapsulated by the encapsulation film.

Abstract translation: 提供了一种用于封装膜，封装膜和具有该组合物的电子器件的组合物。 本申请可以提供具有优异的防潮性，可操作性，可加工性和耐久性的包封膜和包括由封装膜包封的元件的结构。

公开(公告)号：US20150144932A1

公开(公告)日：2015-05-28

申请号：US14609172

申请日：2015-01-29

Applicant: LG Chem, Ltd.

Inventor： Kyung Yul BAE ,  Hyun Jee YOO ,  Seung Min LEE ,  Yoon Gyung CHO ,  Suk Ky CHANG ,  Jung Sup SHIM

IPC: H01L51/52 ,  C09J163/00 ,  C09J7/02 ,  B32B38/10 ,  B32B37/18

CPC classification number: H01L51/5253 ,  B32B37/025 ,  B32B37/12 ,  B32B2310/0806 ,  B32B2457/206 ,  C09J7/00 ,  C09J7/10 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2463/00 ,  Y10T428/1471

Abstract: The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for encapsulating an organic electronic device comprises: a protective film layer, a first adhesive layer, a second adhesive layer and a release film layer sequentially arranged. The peel strength (A) between the first adhesive layer and the protective film layer is lower than the peel strength (B) between the second adhesive layer and the release film layer, and the peel strength (B) between the second adhesive layer and the release film layer is lower than the peel strength (C) between the first adhesive layer and an encapsulation substrate, thus improving faults during a peeling process.

Abstract translation: 本发明涉及一种粘合膜，涉及使用其的有机电子器件的封装产品以及使用该有机电子器件封装的方法。 更具体地，用于封装有机电子器件的粘合膜包括：顺序地布置保护膜层，第一粘合层，第二粘合层和剥离膜层。 第一粘合层和保护膜层之间的剥离强度（A）低于第二粘合层和剥离膜层之间的剥离强度（B），第二粘合层与剥离膜层之间的剥离强度（B） 剥离膜层比第一粘合层和封装基板的剥离强度（C）低，从而改善剥离过程中的缺陷。

公开(公告)号：US20150079726A1

公开(公告)日：2015-03-19

申请号：US14552123

申请日：2014-11-24

Applicant: LG CHEM, LTD.

Inventor： Yoon Gyung CHO ,  Suk Ky Chang ,  Jung Sup SHIM ,  Hyun Jee YOO ,  Seung Min LEE

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/44 ,  C09J7/00 ,  H01L51/10

CPC classification number: H01L51/5246 ,  C09J5/06 ,  C09J7/00 ,  C09J133/062 ,  C09J133/08 ,  C09J163/00 ,  C09J2201/606 ,  C09J2423/00 ,  C09J2463/00 ,  H01L51/0024 ,  H01L51/107 ,  H01L51/448 ,  H01L51/5259 ,  H01L51/56

Abstract: Provided is a method of manufacturing an organic electronic device using a pressure-sensitive adhesive film. The method of manufacturing an organic electronic device including an encapsulation layer having excellent moisture barrier property and adhesiveness may be provided. In addition, according to the manufacturing method, for example, though the encapsulation layer is formed on an entire surface of an organic electronic element, a flexibility phenomenon of the organic electronic device may be minimized, and the organic electronic device may be manufactured without damage to the organic electronic element for a short process time.

Abstract translation: 提供一种使用压敏粘合膜制造有机电子器件的方法。 可以提供包括具有优异的防潮性和粘合性的封装层的有机电子器件的制造方法。 此外，根据制造方法，例如，尽管在有机电子元件的整个表面上形成封装层，但是可以使有机电子器件的柔性现象最小化，并且可以在不损坏的情况下制造有机电子器件 到有机电子元件处理时间短。