公开(公告)号：US09243166B2

公开(公告)日：2016-01-26

申请号：US14606682

申请日：2015-01-27

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Bum Gyu Choi ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C08G77/04 ,  C09D183/04 ,  C08L83/04 ,  H01L23/29 ,  H01L33/56

CPC classification number: C09D183/04 ,  C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/80 ,  C08K5/5419 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  H01L23/293 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.

Abstract translation: 提供可固化组合物及其用途。 该固化性组合物具有优异的加工性，加工性和粘合性，显示出优异的光提取效率，抗裂性，硬度，耐热冲击性和固化后的粘合性，即使在恶劣条件下也具有持久的耐久性和可靠性，并且不会引起美白或表面 粘性。 可固化组合物可以用作诸如LED的光学半导体的密封剂或粘合剂材料。

公开(公告)号：US09147819B2

公开(公告)日：2015-09-29

申请号：US14161563

申请日：2014-01-22

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Bum Gyu Choi ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C09K19/00 ,  H01L33/56 ,  G02F1/1335 ,  C08L83/04 ,  C08K3/00 ,  C08G77/12 ,  C08G77/20 ,  H01L23/29 ,  C08G77/00 ,  C08G77/14

CPC classification number: H01L33/56 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/80 ,  C08K3/01 ,  C08K3/22 ,  C08K3/36 ,  C08K2201/002 ,  C08L83/00 ,  C08L83/04 ,  C08L2205/22 ,  G02F1/133603 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/1059 ,  Y10T428/1068 ,  H01L2924/00 ,  C08K3/0008

Abstract: A curable composition and use thereof are provided. The composition can be useful in exhibiting excellent processability and workability, and providing a cured product which exhibits superior light extraction efficiency, crack resistance, hardness, thermal shock resistance, and adhesive properties, has superior reliability under severe conditions for a long period of time and prevents opacity and stickiness onto a surface thereof when cured. Also, the curable composition capable of preventing precipitation of an additive such as a fluorescent material or a photoconversion material and being formed into a cured product having excellent transparency even when the additive is added to the curable composition can be provided.

Abstract translation: 提供了可固化组合物及其用途。 该组合物可用于显示出优异的加工性和加工性，并且提供显示出优异的光提取效率，抗裂纹性，硬度，耐热冲击性和粘合性能的固化产物，在长时间的苛刻条件下具有优异的可靠性， 在固化时防止其表面上的不透明度和粘性。 另外，可以提供能够防止添加剂如荧光材料或光转化材料沉淀的固化性组合物，并且即使在添加剂添加到固化性组合物中时也可以形成为透明性良好的固化物。

公开(公告)号：US09056985B2

公开(公告)日：2015-06-16

申请号：US14458008

申请日：2014-08-12

Applicant: LG CHEM, LTD

Inventor： Min Jin Ko ,  Kyung Mi Kim ,  Young Ju Park

IPC: C08L83/04 ,  C08G77/04 ,  H01L33/56

CPC classification number: C08L83/04 ,  C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/80 ,  C08L2203/206 ,  H01L33/56 ,  C08L83/00

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance, and low gas permeability, and thus provides a device having excellent initial performance when being applied to a semiconductor device and maintaining stable performance when being used at a high temperature for a long time.

Abstract translation: 提供可固化组合物及其用途。 可固化组合物可以提供具有优异的加工性，加工性和粘合性，并且不具有美白和表面粘性的固化产物。 该固化性组合物具有优异的耐热裂纹性和低透气性，因此提供了当应用于半导体器件时具有优异的初始性能并且在长时间使用高温时保持稳定性能的器件。

公开(公告)号：US08921496B2

公开(公告)日：2014-12-30

申请号：US13935852

申请日：2013-07-05

Applicant: LG Chem, Ltd.

Inventor： Bum Gyu Choi ,  Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C08L83/04 ,  H01L23/29 ,  C08K5/5419 ,  H01L33/56 ,  C08G77/00 ,  C08G77/20 ,  C08G77/04 ,  C08G77/12

CPC classification number: H01L33/56 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract translation: 提供了可固化组合物及其用途。 示例性的可固化组合物可显示出优异的加工性和可加工性。 此外，固化性组合物在固化前后可具有高折射率。 该组合物在固化前后的透湿性低，显示出优异的抗裂性，耐热冲击性，粘合性和硬度。 此外，该组合物在高温或高湿度条件下不引起白化等颜色变化，并且在其表面上不显示粘性。 可固化组合物可以用作粘合剂材料或用作诸如LED，CCD，光电耦合器或光伏电池的半导体器件的封装材料。

公开(公告)号：US08809127B2

公开(公告)日：2014-08-19

申请号：US14139389

申请日：2013-12-23

Applicant: LG Chem, Ltd.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Myung Sun Moon ,  Bum Gyu Choi ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: H01L21/00 ,  B32B33/00 ,  C08G77/04 ,  H01L33/00 ,  H01L23/29

CPC classification number: H01L33/56 ,  C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/0025 ,  C08K5/54 ,  C08K5/56 ,  C08L83/06 ,  H01L23/296 ,  H01L2924/0002 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00

Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processability and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract translation: 提供可固化组合物及其用途。 固化性组合物可以表现出优异的加工性和加工性。 该固化性组合物具有优异的光提取效率，耐裂纹性，硬度，耐热冲击性和固化后的粘合性。 可固化组合物可以在苛刻条件下长时间提供稳定的耐久性和可靠性的固化产物，并且没有美白和表面粘性。

公开(公告)号：US20130296515A1

公开(公告)日：2013-11-07

申请号：US13935865

申请日：2013-07-05

Applicant: LG CHEM, LTD.

Inventor： Bum Gyu Choi ,  Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: H01L33/56

CPC classification number: H01L33/56 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract translation: 提供了可固化组合物及其用途。 示例性的可固化组合物可显示出优异的加工性和可加工性。 此外，固化性组合物在固化前后可具有高折射率。 该组合物在固化前后的透湿性低，显示出优异的抗裂性，耐热冲击性，粘合性和硬度。 此外，该组合物在高温或高湿度条件下不引起变色，例如增白，并且在其表面上不显示粘性。 可固化组合物可以用作粘合剂材料或用作诸如LED，CCD，光电耦合器或光伏电池的半导体器件的封装材料。

公开(公告)号：US12173195B2

公开(公告)日：2024-12-24

申请号：US17262524

申请日：2019-07-25

Applicant: LG Chem, Ltd.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Min A Yu ,  Min Kyoun Kim ,  Byung Kyu Cho ,  Taek Yong Lee ,  Dong Yong Kim

IPC: C09J175/16 ,  C08L63/00

Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range.

公开(公告)号：US09660155B2

公开(公告)日：2017-05-23

申请号：US14648145

申请日：2013-11-28

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko

IPC: H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/56 ,  H01L33/50 ,  H01L33/501 ,  H01L33/504 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091

Abstract: Provided are a light emitting diode, a method of manufacturing the same, and a use thereof. The light emitting diode having excellent initial light flux and excellent color uniformity and dispersion, the method of manufacturing the same, and the use thereof may be provided.

公开(公告)号：US09379296B2

公开(公告)日：2016-06-28

申请号：US14143854

申请日：2013-12-30

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Bum Gyu Choi ,  Dae Ho Kang ,  Min Kyoun Kim

IPC: H01L33/56 ,  C08G77/20 ,  H01L23/29 ,  C08L83/04 ,  C09K3/10 ,  C08G77/12 ,  C08K5/56 ,  C08G77/00

CPC classification number: H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08K5/56 ,  C08L83/04 ,  C09K3/1018 ,  H01L23/296 ,  H01L2924/0002 ,  C08L83/00 ,  H01L2924/00

Abstract: A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.

Abstract translation: 提供硅树脂。 有机硅树脂可以有效地用于封装半导体元件，例如发光二极管的发光元件。

公开(公告)号：US09355926B2

公开(公告)日：2016-05-31

申请号：US14030562

申请日：2013-09-18

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Bum Gyu Choi ,  Jae Ho Jung ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C08G77/08 ,  H01L23/29 ,  C08L83/04 ,  C08L83/06 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20

CPC classification number: H01L23/296 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/80 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  C09J183/14 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability, and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions and that does not cause whitening or surface stickiness.

Abstract translation: 提供可固化组合物及其用途。 固化性组合物可以表现出优异的加工性和加工性。 固化性组合物在固化后表现出优异的光提取效率，硬度，耐热和抗冲击性，耐湿性，透气性和粘合性。 此外，固化性组合物可以提供即使在恶劣条件下也具有持久耐久性和可靠性的固化物，并且不会引起白化或表面粘性。