公开(公告)号：US20100053924A1

公开(公告)日：2010-03-04

申请号：US12450126

申请日：2008-03-12

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: H05K1/11 ,  H01B1/22

CPC classification number: H01R4/04 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  C22C30/04 ,  H01B1/22 ,  H01R12/52 ,  H05K3/323 ,  H05K2203/0425

Abstract: [Problem] A conventional anisotropic conductive material using low melting point particles exhibits a low degree of conductivity between the upper and lower conductors and the insulation resistance between adjoining conductors is also low.[Means for Solving the Problem] According to the anisotropic conductive material of the invention, the low melting point particles have a solidus temperature of at least 125° C., a peak temperature of at most 200° C., and a temperature difference between the solidus temperature and the peak temperature of at least 15° C., and a large particle diameter which are mixed among the low melting point particles have a maximum diameter which is smaller than ¼ of the spacing between adjoining conductors.

Abstract translation: [问题]使用低熔点颗粒的常规各向异性导电材料在上导体和下导体之间表现出低导电性，并且相邻导体之间的绝缘电阻也较低。 解决问题的手段根据本发明的各向异性导电材料，低熔点粒子的固相线温度为至少125℃，峰值温度为200℃以下，温度差为 在低熔点颗粒之间混合的固相线温度和至少15℃的峰值温度和大的粒径具有小于相邻导体间距的1/4的最大直径。

公开(公告)号：US20090301607A1

公开(公告)日：2009-12-10

申请号：US12084793

申请日：2006-11-10

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

IPC: B23K35/14

CPC classification number: B23K35/264 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K35/362 ,  H05K3/3484 ,  H05K2201/0272

Abstract: The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.

Abstract translation: 本发明提供了固相线温度为255℃以上的焊锡膏，并且提高了Bi和Cu或Ag电极之间的润湿性，以达到与含Pb高温焊料即使在低温焊料中几乎相同的润湿性， 温度焊接。 焊膏包括由Bi或Bi合金构成的金属粉末成分，Bi的固相降温金属和能够与固相线降温金属形成金属间化合物的固相金属和助熔剂成分。

公开(公告)号：US07451805B2

公开(公告)日：2008-11-18

申请号：US10594577

申请日：2005-03-31

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: B22D19/14

CPC classification number: F27D27/00 ,  B22D1/00 ,  B22D41/04 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  Y10S164/90 ,  H01L2924/00

Abstract: A pouring apparatus for molten metal includes a stirrer installed in a reservoir. The stirrer is rotated by a rotational drive mechanism installed on the reservoir. Molten solder is placed into the reservoir, high melting point metal particles are charged into the molten solder, stirring is performed with the stirrer to uniformly disperse the metal particles in the molten solder, and then the molten solder and dispersed metal particles are cast into a mold. Casting can be performed quickly after charging the metal particles into the molten solder, so the metal particles do not significantly melt into the molten solder.

Abstract translation: 用于熔融金属的浇注装置包括安装在储存器中的搅拌器。 搅拌器由安装在储液器上的旋转驱动机构旋转。 将熔融焊料放入储存器中，将高熔点金属颗粒装入熔融焊料中，用搅拌器进行搅拌以使金属颗粒均匀分散在熔融焊料中，然后将熔融的焊料和分散的金属颗粒浇铸成 模子。 在将金属颗粒填充到熔融焊料中之后，可以快速进行铸造，因此金属颗粒不会显着熔化到熔融焊料中。

公开(公告)号：US20080061117A1

公开(公告)日：2008-03-13

申请号：US11889356

申请日：2007-08-10

Applicant: Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

Inventor： Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

IPC: B23K31/02 ,  C22C13/00

CPC classification number: C22C13/00 ,  B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K35/262 ,  B23K2101/42 ,  H05K3/3463

Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

Abstract translation: 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金还可以含有总量最多为4重量％的Ag和Sb的至少一种元素，和/或Ni，Co，Fe，Mn，Cr和Mo中的至少一种元素的总量为 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn的至少一种元素，其总量最多为5重量％，最多为0.5重量％。

公开(公告)号：US07282175B2

公开(公告)日：2007-10-16

申请号：US10824647

申请日：2004-04-15

Applicant: Masazumi Amagai ,  Masako Watanabe ,  Kensho Murata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Takeshi Tashima ,  Daisuke Souma ,  Takahiro Roppongi ,  Hiroshi Okada

Inventor： Masazumi Amagai ,  Masako Watanabe ,  Kensho Murata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Takeshi Tashima ,  Daisuke Souma ,  Takahiro Roppongi ,  Hiroshi Okada

IPC: C22C13/02

CPC classification number: B23K35/262 ,  B23K2101/36

Abstract: A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.

Abstract translation: 无铅焊料包括0.05-5质量％的Ag，0.01-0.5质量％的Cu，至少一种P，Ge，Ga，Al和Si，总量为0.001-0.05质量％，余量为 的Sn。 可以添加用于提高耐热循环性的过渡元素中的一种或多种，​​诸如Bi，In或Zn的熔点降低元素，以及用于改善抗冲击性的元素如Sb。

公开(公告)号：US20050036902A1

公开(公告)日：2005-02-17

申请号：US10614351

申请日：2003-07-08

Applicant: Masazumi Amagai ,  Masako Watanabe ,  Osamu Munekata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Hiroshi Okada

Inventor： Masazumi Amagai ,  Masako Watanabe ,  Osamu Munekata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Hiroshi Okada

IPC: B23K35/02 ,  B23K35/26 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K35/0244 ,  B23K2101/42

Abstract: A lead-free solder alloy comprises 1.0-5.0 wt % Ag, 0.01-0.5 wt % Ni, one or both of (a) 0.001-0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001-0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.

Abstract translation: 一种无铅焊料合金包含1.0-5.0重量％的Ag，0.01-0.5重量％的Ni，（a）0.001-0.05重量％的Co中的一个或两个，和（b）一个或多个P，Ge和Ga中的至少一个， 总量为0.001-0.05重量％，余量为Sn。 焊料可以形成具有高粘合强度并且在焊接后不经历黄变的焊料凸块。