公开(公告)号：US20140041915A1

公开(公告)日：2014-02-13

申请号：US13960829

申请日：2013-08-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

Abstract: In a monolithic capacitor mounting structure, assuming that a portion of a first outer electrode joined with a first bonding material is a first bonding portion and a portion of a second outer electrode joined with a second bonding material is a second bonding portion, a length of each of the first and second bonding portions in a lengthwise direction of the monolithic capacitor is about 0.2 times to about 0.5 times a length of an elementary body in the lengthwise direction, and a center of each of the first and second bonding portions in the lengthwise direction is located at a position different from a center of the elementary body in the lengthwise direction. Vibration noise is changed depending on positions of outer electrodes of the monolithic capacitor, the outer electrodes being used to bond the monolithic capacitor to a mounting substrate.

Abstract translation: 在单体电容器安装结构中，假设与第一接合材料接合的第一外部电极的一部分是第一接合部分，并且与第二接合材料接合的第二外部电极的一部分是第二接合部分， 单片电容器的长度方向上的第一接合部和第二接合部中的每一个在长度方向上为基本体的长度的约0.2倍〜约0.5倍，长度方向上的第一接合部和第二接合部的中心 方向位于与基本体的长度方向的中心不同的位置。 振动噪声根据单体电容器的外部电极的位置而变化，外部电极用于将单片电容器接合到安装基板。

公开(公告)号：US20130284507A1

公开(公告)日：2013-10-31

申请号：US13927251

申请日：2013-06-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Tadateru YAMADA ,  Isamu FUJIMOTO

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H01G2/02 ,  H01G2/06 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09145 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/2045 ,  Y02P70/611

Abstract: In an electronic component, upper surface electrodes are located on one main surface of an insulating substrate of an interposer on which a multilayer ceramic capacitor is mounted. The insulating substrate has substantially the same shape as that of the multilayer ceramic capacitor, viewed from a direction perpendicular or substantially perpendicular to the main surface, and has the multilayer ceramic capacitor mounted thereon so that the length direction of the multilayer ceramic capacitor substantially coincides with the length direction of the insulating substrate. The insulating substrate includes cutouts that include connection electrodes, respectively, and that are located at the four corners viewed from the direction perpendicular or substantially perpendicular to the main surface. The upper surface electrodes on the one main surface are connected via the connection electrodes to lower surface electrodes, respectively, that are located on the other main surface and are connected to a circuit board.

Abstract translation: 在电子部件中，上表面电极位于其上安装有多层陶瓷电容器的插入器的绝缘基板的一个主表面上。 绝缘基板的形状与多层陶瓷电容器的形状基本相同，从与主表面垂直或大致垂直的方向观察，并将多层陶瓷电容器安装在其上，使多层陶瓷电容器的长度方向基本上与 绝缘基板的长度方向。 绝缘基板包括分别包括连接电极并且位于从垂直于或基本上垂直于主表面的方向观察的四个拐角处的切口。 一个主表面上的上表面电极经由连接电极分别连接到位于另一个主表面上并连接到电路板的下表面电极。