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公开(公告)号：US20140268488A1
公开(公告)日：2014-09-18
申请号：US14205769
申请日：2014-03-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo HATTORI , Isamu FUJIMOTO
IPC: H01G4/30
Abstract: A monolithic capacitor includes a multilayer body including a plurality of stacked dielectric layers, first and second capacitor electrodes inside the multilayer body, and outer electrodes on at least one surface of the multilayer body. The first and second capacitor electrodes are arranged perpendicularly or substantially perpendicularly to first and second surfaces of the multilayer body. The first capacitor electrode includes a capacitor portion opposed to the second capacitor electrode with the dielectric layer interposed therebetween, a lead portion connected to one outer electrode, and an intermediate portion not opposed to the second outer electrode. The second capacitor electrode includes a capacitor portion opposed to the first capacitor electrode with the dielectric layer interposed therebetween, and a lead portion connected to the other outer electrode. The intermediate portion is arranged in a gap area that is surrounded, when viewed in a stacking direction of the dielectric layers, by imaginary lines extending from inner exposed ends of the lead portions in a direction interconnecting the first and second surfaces of the multilayer body, by the capacitor portions, and by the first surface.
Abstract translation: 单片电容器包括：多层堆叠体，多层堆叠电介质层，多层体内的第一和第二电容器电极以及多层体的至少一个表面的外部电极。 第一和第二电容器电极布置成垂直于或基本垂直于多层体的第一和第二表面。 第一电容器电极包括与第二电容器电极相对的电介质层，介电层插入其间，与一个外部电极连接的引线部分和与第二外部电极不相对的中间部分。 所述第二电容器电极包括与所述第一电容器电极相对的电容器部分，所述第一电容器电极介于所述第一电容器电极之间，并且所述引线部分连接到所述另一外部电极。 中间部分布置在间隙区域中，当从电介质层的层叠方向观察时，沿着互连多层体的第一表面和第二表面的方向从引线部分的内露出端延伸的虚线， 通过电容器部分和第一表面。
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2.发明申请METHOD OF MANUFACTURING MOUNTING SUBSTRATE ON WHICH MONOLITHIC CERAMIC CAPACITORS ARE MOUNTED AND MOUNTING STRUCTURE 有权制造安装在各种陶瓷电容器上的安装基板的方法和安装结构公开(公告)号：US20140110161A1
公开(公告)日：2014-04-24
申请号：US14050842
申请日：2013-10-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo HATTORI , Isamu FUJIMOTO , Norio SHIROIWA
CPC classification number: H05K1/181 , H01G2/065 , H01G4/232 , H01G4/30 , H05K1/111 , H05K3/303 , H05K3/3415 , H05K3/3442 , H05K2201/10015 , H05K2201/10545 , H05K2201/2045 , Y02P70/611 , Y02P70/613 , Y10T29/4913
Abstract: A method of manufacturing a mounting substrate in which a pair of monolithic ceramic capacitors each of which includes a multilayer body in which a plurality of dielectric ceramic sheets and a plurality of substantially planar inner electrodes are stacked on top of one another and at least a pair of outer electrodes electrically connected to the inner electrodes and provided on a surface of the multilayer body are mounted on a circuit board includes a process of joining the outer electrodes to lands formed on the front rear surfaces of the circuit board, the lands formed on the front surface being formed at positions that are plane-symmetrical to positions of the corresponding lands formed on the rear surface while being electrically connected to the corresponding lands formed on the rear surface, such that surface directions of planes of the inner electrodes match each other.
Abstract translation: 一种制造安装基板的方法，其中，一对叠层陶瓷电容器包括多层体，其中多个介电陶瓷片和多个基本上平面的内电极彼此堆叠并且至少一对 电连接到内部电极并设置在多层体的表面上的外部电极安装在电路板上，包括将外部电极连接到形成在电路板的前后表面上的平台， 前表面形成在与形成在后表面上的相应焊盘的位置平面对称的位置处，同时电连接到形成在后表面上的相应焊盘，使得内电极的平面的表面方向彼此匹配。
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公开(公告)号：US20140043723A1
公开(公告)日：2014-02-13
申请号：US13959938
申请日：2013-08-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo HATTORI , Isamu FUJIMOTO , Toshiki TANAKA
CPC classification number: H05K1/0216 , H01G2/065 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38 , H05K3/3442 , H05K2201/10015 , H05K2201/2045 , Y02P70/613
Abstract: Laminated ceramic capacitors include ceramic layers and inner electrodes that are alternately laminated. The inner electrodes are laminated in the same lamination direction, and a first outer electrode and a second outer electrode are electrically connected to the inner electrodes. In a mounting process, the laminated ceramic capacitors are mounted on a mounting surface such that the inner electrodes are perpendicular or substantially perpendicular to the mounting surface.
Abstract translation: 层压陶瓷电容器包括交替层压的陶瓷层和内部电极。 内部电极以相同的层叠方向层叠，并且第一外部电极和第二外部电极与内部电极电连接。 在安装过程中，层叠的陶瓷电容器安装在安装表面上，使得内部电极垂直或基本垂直于安装表面。
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公开(公告)号：US20140016242A1
公开(公告)日：2014-01-16
申请号：US14027685
申请日：2013-09-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo HATTORI , Isamu FUJIMOTO
IPC: H01G4/01
CPC classification number: H01G4/12 , H01G2/06 , H01G4/01 , H01G4/224 , H01G4/30 , H05K1/0271 , H05K1/141 , H05K1/181 , H05K3/3442 , H05K2201/041 , H05K2201/049 , H05K2201/09181 , H05K2201/10015 , H05K2201/2045 , Y02P70/611
Abstract: A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.
Abstract translation: 多层陶瓷电容器包括层叠的扁平状内部电极。 插入器包括比多层陶瓷电容器的轮廓大的绝缘基板。 安装多层陶瓷电容器的第一安装电极位于绝缘基板的第一主表面上，以及用于连接到位于第二主表面上的外部电路板的第一外部连接电极。 多层陶瓷电容器以这样的方式安装到内插器上，使得内部电极的主表面平行或基本上平行于中介层的主表面，即绝缘基板的第一和第二主表面。
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公开(公告)号：US20130329389A1
公开(公告)日：2013-12-12
申请号：US13906695
申请日：2013-05-31
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Kazuo HATTORI , Isamu FUJIMOTO
IPC: H05K1/02
CPC classification number: H05K1/181 , H01G4/232 , H01G4/30 , H01G4/35 , H05K1/0216 , H05K1/141 , H05K3/1258 , H05K3/341 , H05K3/3442 , H05K2201/049 , H05K2201/09036 , H05K2201/09072 , H05K2201/09181 , H05K2201/10015 , H05K2201/10378 , H05K2201/10636 , H05K2201/10962 , H05K2201/10984 , H05K2201/2045 , Y02P70/611 , Y02P70/613
Abstract: A chip-component structure includes an interposer on which a multilayer capacitor is mounted. The interposer includes component connecting electrodes, external connection electrodes, side electrodes, and in-hole electrodes. The component connecting electrodes and the external connection electrodes are electrically connected by the side electrodes and the in-hole electrodes. Outer electrodes of the capacitor are joined to the component connecting electrodes.
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Patent Agency Ranking
公开(公告)号：US20180197682A1
公开(公告)日：2018-07-12
申请号：US15832903
申请日：2017-12-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tadateru YAMADA , Kazuo HATTORI , Isamu FUJIMOTO
CPC classification number: H01G4/30 , H01G2/065 , H01G4/005 , H01G4/12 , H01G4/224 , H01G4/232 , H05K1/181 , H05K3/3442 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045
Abstract: A multilayer ceramic capacitor includes a stacked body and first and second external electrodes. When a dimension of the stacked body in a length direction is L0, a dimension of the stacked body in a width direction is W0, a dimension of the stacked body in a stacking direction is T0, a dimension of the first outer layer portion in the stacking direction is T1, a dimension of the second outer layer portion in the stacking direction is T2, a dimension of the first side margin in the width direction is W1, a dimension of the second side margin in the width direction is W2, a dimension of the first end margin in the length direction is L1, and a dimension of the second end margin in the length direction is L2, conditions of (L1+L2)/L0>(W1+W2)/W0 and (L1+L2)/L0>(T1+T2)/T0 are satisfied, and a condition of 0.244≤(L1+L2)/L0≤0.348 is satisfied.
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公开(公告)号：US20170011856A1
公开(公告)日：2017-01-12
申请号：US15205120
申请日：2016-07-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo HATTORI , Isamu FUJIMOTO , Shinichiro KUROIWA
Abstract: A composite electronic component includes an electronic element mounted on a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, and first and second upper surface conductors on the upper surface of the base portion. The first and second upper surface conductors are separated from each other in the length direction, and the resistor is located between the first and second upper surface conductors. A dimension in the height direction of the resistor is smaller than both a dimension in the height direction of the first external electrode of a portion located on a lower surface of the electronic element body, and a dimension in the height direction of the second external electrode of a portion located on a lower surface of the electronic element body.
Abstract translation: 复合电子部件包括安装在电阻元件上的高度方向的电子元件。 电子元件包括电子元件主体，以及在长度方向上彼此分离的第一和第二外部电极。 电阻元件包括基部，设置在基部的上表面上的电阻器，以及在基部的上表面上的第一和第二上表面导体。 第一和第二上表面导体在长度方向上彼此分离，并且电阻器位于第一和第二上表面导体之间。 电阻器的高度方向的尺寸小于位于电子元件主体的下表面的部分的第一外部电极的高度方向的尺寸和第二外部电极的高度方向的尺寸 位于电子元件主体的下表面上的部分。
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公开(公告)号：US20150270068A1
公开(公告)日：2015-09-24
申请号：US14661018
申请日：2015-03-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo HATTORI , Isamu FUJIMOTO
CPC classification number: H01G4/30 , H01C1/14 , H01C7/18 , H01F27/292 , H01G2/065 , H01G4/12 , H01G4/228 , H01G4/232 , H05K1/113 , H05K1/141 , H05K1/181 , H05K3/0097 , H05K2201/049 , H05K2201/09181
Abstract: An electronic component includes an electronic element including external electrodes on a surface and a substrate terminal on which the electronic element is mounted. The substrate terminal includes a first main surface, a second main surface opposite the first main surface, and a peripheral surface joining the first main surface and the second main surface. The substrate terminal includes mounting electrodes provided on the second main surface and electrically connected to the external electrodes of the electronic element, and connection electrodes provided on the first main surface and electrically connected to lands of a circuit substrate. A maximum width of the connection electrodes is greater than a maximum width of the mounting electrodes.
Abstract translation: 电子部件包括电子元件，其包括表面上的外部电极和安装有电子元件的基板端子。 基板端子包括第一主表面，与第一主表面相对的第二主表面和连接第一主表面和第二主表面的外周表面。 基板端子包括设置在第二主表面上并电连接到电子元件的外部电极的安装电极，以及设置在第一主表面上并电连接到电路基板的焊盘的连接电极。 连接电极的最大宽度大于安装电极的最大宽度。
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公开(公告)号：US20150270065A1
公开(公告)日：2015-09-24
申请号：US14663725
申请日：2015-03-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuo HATTORI , Isamu FUJIMOTO , Hirobumi ADACHI
CPC classification number: H01G2/065 , H01G4/232 , H01G4/30 , H05K3/3442 , H05K3/403 , H05K2201/049 , H05K2201/09181 , H05K2201/10015 , H05K2201/2045 , Y02P70/613
Abstract: An electronic component includes an electronic element including outer electrodes on a surface, a substrate terminal on which the electronic element is mounted, and a conductor that covers at least a portion of the substrate terminal. The substrate terminal includes a first main surface, a second main surface at a side opposite to the first main surface, and a side surface connecting the first main surface and the second main surface. The substrate terminal includes a mounting electrode that is provided on the first main surface and is electrically connected to the outer electrodes of the electronic element. The mounting electrode includes adjacent portions that are located to be adjacent to the side surface of the substrate terminal. The conductor covers at least a portion of the adjacent portion.
Abstract translation: 电子部件包括电子元件，其包括表面上的外部电极，安装有电子元件的基板端子和覆盖基板端子的至少一部分的导体。 基板端子包括第一主表面，与第一主表面相对的一侧的第二主表面和连接第一主表面和第二主表面的侧表面。 基板端子包括设置在第一主表面上并与电子元件的外部电极电连接的安装电极。 安装电极包括邻近基板端子的侧表面邻近的部分。 导体覆盖相邻部分的至少一部分。
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10.发明申请公开(公告)号：US20140332261A1
公开(公告)日：2014-11-13
申请号：US14270403
申请日：2014-05-06
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Isamu FUJIMOTO , Kazuo HATTORI
CPC classification number: H05K1/111 , H01G4/248 , H01G4/30 , H05K3/3442 , H05K2201/09227 , H05K2201/10015 , H05K2201/10522 , H05K2201/2045 , Y02P70/611 , Y10T29/4913
Abstract: A circuit board includes a wiring board on which is mounted first and second laminated ceramic capacitors near or adjacent to each other, arranged along a direction parallel or substantially parallel to a main surface of the wiring board, and electrically connected in series or in parallel via a conductive pattern provided on the wiring board. One width direction side surface of the first laminated ceramic capacitor and one length direction end surface of the second laminated ceramic capacitor oppose each other perpendicularly or approximately perpendicularly.
Abstract translation: 电路板包括布线板，第一和第二层叠陶瓷电容器彼此靠近或相邻地布置，沿着平行或基本上平行于布线板的主表面的方向布置，并且串联或并联电连接 设置在布线板上的导电图案。 第一层叠陶瓷电容器的宽度方向侧表面和第二层叠陶瓷电容器的一个长度方向端面垂直或大致垂直地彼此相对。
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