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    Camera module and electric holder and assembling method thereof
    41.
    发明授权
    Camera module and electric holder and assembling method thereof 有权

    公开(公告)号：US10212322B2

    公开(公告)日：2019-02-19

    申请号：US15057068

    申请日：2016-02-29

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Mingzhu Wang ,  Nan Guo ,  Feifan Chen ,  Bojie Zhao ,  Bo Peng ,  Zhen Huang

    IPC: H04N5/225

    Abstract: A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a driver and an optical lens but also forms an electrical connection unit for electrically connecting to the driver, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.

    Camera module and photosensitive assembly thereof, electronic device, and manufacturing method
    47.
    发明授权
    Camera module and photosensitive assembly thereof, electronic device, and manufacturing method 有权

    公开(公告)号：US12010412B2

    公开(公告)日：2024-06-11

    申请号：US17607947

    申请日：2020-02-28

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Mingzhu Wang ,  Takehiko Tanaka ,  Xiaodi Liu ,  Zhen Huang ,  Zhenyu Chen

    IPC: H04N23/54 ,  H04N23/55 ,  H04N23/57

    CPC classification number: H04N23/54 ,  H04N23/55 ,  H04N23/57

    Abstract: A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip. The molded base is integrally combined with the photosensitive chip, the at least one resistance-capacitance device, and the expanded wiring layer.

    Camera module and molded circuit board assembly thereof, array camera module and electronic device
    50.
    发明授权
    Camera module and molded circuit board assembly thereof, array camera module and electronic device 有权

    公开(公告)号：US11233079B2

    公开(公告)日：2022-01-25

    申请号：US16613571

    申请日：2018-05-18

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Mingzhu Wang ,  Nan Guo ,  Zhenyu Chen ,  Takehiko Tanaka ,  Jingfei He ,  Zhen Huang ,  Zhongyu Luan ,  Feifan Chen

    IPC: H01L27/146 ,  H04M1/02 ,  H04N5/225 ,  H05K1/18

    Abstract: A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.

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