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公开(公告)号:US20170081184A1
公开(公告)日:2017-03-23
申请号:US15259478
申请日:2016-09-08
Applicant: Point Engineering Co., Ltd.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
IPC: B81C1/00
CPC classification number: B81C1/00825 , B81C1/00888 , B81C2201/0114 , H01L21/78
Abstract: An anodic oxide film structure cutting method is provided. The method includes: an etching step of forming an etched groove by etching one surface of an anodic oxide film having a plurality of anodizing pores along a predetermined cutting line and forming increased-diameter pores by enlarging entrances of the anodizing pores positioned on an inner bottom surface of the etched groove; and a cutting step of cutting the anodic oxide film along the etched groove. Also provided is a unit anodic oxide film structure produced by the cutting method.
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公开(公告)号:US20170067842A1
公开(公告)日:2017-03-09
申请号:US15247530
申请日:2016-08-25
Applicant: Point Engineering Co., Ltd.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
CPC classification number: G01N27/123 , G01N27/125 , G01N27/128 , G01N33/0027 , H05B3/03 , H05B3/265
Abstract: The present invention relates to a micro heater and a micro sensor wherein an anti-etching dam is formed on the first supporting portion, and thus, the first supporting portion maintains its initial shape thereby so that the heat capacity of the first supporting portion becomes small, and temperature uniformity thereof is enhanced.
Abstract translation: 微加热器和微型传感器技术领域本发明涉及一种微加热器和微型传感器,其中在第一支撑部分上形成有抗蚀刻凹槽,因此第一支撑部分保持其初始形状,使得第一支撑部分的热容变小 ,并且其温度均匀性增强。
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公开(公告)号:US12296378B2
公开(公告)日:2025-05-13
申请号:US18674384
申请日:2024-05-24
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed are a method of manufacturing a metal product that uses an anodic aluminum oxide film and a patternable material together, in which a space where the metal product is manufactured is formed by the patternable material and the anodic aluminum oxide film provides structural support to the patternable material; and a mold using an anodic aluminum oxide film used therefor.
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公开(公告)号:US12270828B2
公开(公告)日:2025-04-08
申请号:US17919742
申请日:2021-04-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.
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公开(公告)号:US12151461B2
公开(公告)日:2024-11-26
申请号:US18058177
申请日:2022-11-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.
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公开(公告)号:US11619655B2
公开(公告)日:2023-04-04
申请号:US17029979
申请日:2020-09-23
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: A probe card is configured to perform a circuit test on a wafer to realize a reduction in size and pitch of probe insertion holes. The probe card includes a first plate, a second plate coupled to a lower portion of the first plate, an upper guide plate provided on an upper surface of the first plate, a lower guide plate provided on a lower surface of the second plate, and a reinforcing plate coupled to at least a surface of each of the upper and lower guide plates. At least one of the upper and lower guide plates is made of an anodic oxide film material, and as viewed from above, the upper and lower guide plates and the reinforcing plate are configured to have smaller areas than the first and second plates, so that upper and lower surfaces of the first and second plates are exposed.
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公开(公告)号:US11581210B2
公开(公告)日:2023-02-14
申请号:US16529407
申请日:2019-08-01
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
IPC: H01L21/677 , H01L21/683 , H01L33/00
Abstract: The present invention relates to provide a hot air supplying head for transferring a micro LED and a micro LED transfer system using the same, the hot air supplying head effectively transferring micro LEDs.
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公开(公告)号:US11543432B2
公开(公告)日:2023-01-03
申请号:US17211812
申请日:2021-03-24
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed are a probe head and a probe card having the same. The probe head includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; an intermediate guide plate having an intermediate guide hole, and provided between the upper guide plate and the lower guide plate; and a guide member provided at a side of the intermediate guide plate, wherein the intermediate guide plate is limited in movement by the guide member.
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公开(公告)号:US11342207B2
公开(公告)日:2022-05-24
申请号:US16989431
申请日:2020-08-10
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
IPC: H01L21/67 , B65G47/91 , H01L21/683 , H01L25/16
Abstract: A micro LED transfer head is proposed. The micro LED transfer head includes: a holding member including a holding region that holds a micro LED by means of vacuum holding force and a non-holding region that does not hold the micro LED; and a porous member provided on top of the holding member and having arbitrary pores, wherein the holding region includes: a first holding region; and a second holding region provided above the first holding region, formed to have a larger opening area than the first holding region, and communicating with the first holding region and the porous member, whereby the micro LED transfer head selectively transfers the micro LED.
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公开(公告)号:US11061070B2
公开(公告)日:2021-07-13
申请号:US16666132
申请日:2019-10-28
Applicant: POINT ENGINEERING CO., LTD.
Inventor: Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Disclosed is a guide plate for a probe card guiding a probe pin of the probe card and a manufacturing method thereof, and the probe card having the same. Particularly, the guide plate and a manufacturing method thereof, and the probe card securing reliability of the probe card are intended to be provided, wherein probe pins are easily inserted into the guide plate, and pin insertion holes into which the probe pins are inserted are precisely formed in a small size.
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