公开(公告)号：US20060220198A1

公开(公告)日：2006-10-05

申请号：US11095856

申请日：2005-03-30

Applicant: Rajashree Baskaran

Inventor： Rajashree Baskaran

IPC: H01L23/495

CPC classification number: H01L24/12 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/562 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1131 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/01031 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A packaged integrated circuit (IC) is described having an integrated circuit that is electrically coupled to its package's wiring with Carbon nanotubes (CNTs) placed within an electrically conductive material.

Abstract translation: 描述了一种封装的集成电路（IC），其具有集成电路，其与放置在导电材料内的碳纳米管（CNT）电耦合到其封装的布线。