公开(公告)号：US09196752B2

公开(公告)日：2015-11-24

申请号：US13976086

申请日：2011-12-28

Applicant: Rajashree Baskaran ,  Christopher M. Pelto

Inventor： Rajashree Baskaran ,  Christopher M. Pelto

IPC: H01L29/84 ,  B81C1/00 ,  B81B7/02 ,  H01L23/00 ,  H01L21/768

CPC classification number: B81B7/0006 ,  B81B3/0021 ,  B81B7/02 ,  B81C1/00246 ,  B81C2203/0771 ,  H01L21/76898 ,  H01L24/13 ,  H01L24/16 ,  H01L29/84 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13025 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit device that comprises a single semiconductor substrate, a device layer formed on a frontside of the single semiconductor substrate, a redistribution layer formed on a backside of the single semiconductor substrate, a through silicon via (TSV) formed within the single semiconductor substrate that is electrically coupled to the device layer and to the redistribution layer, a logic-memory interface (LMI) formed on a backside of the single semiconductor substrate that is electrically coupled to the redistribution layer, and a MEMS device formed on the backside of the single semiconductor substrate that is electrically coupled to the redistribution layer.

Abstract translation: 一种集成电路器件，其包括单个半导体衬底，形成在单个半导体衬底的前侧上的器件层，形成在单个半导体衬底的背面上的再分配层，形成在单个半导体衬底内的贯通硅通孔（TSV） 其被电耦合到器件层和再分配层，形成在单个半导体衬底的背面上的逻辑存储器接口（LMI），该逻辑存储器接口电耦合到再分配层;以及MEMS器件，其形成在 电耦合到再分布层的单个半导体衬底。

公开(公告)号：US20150271408A1

公开(公告)日：2015-09-24

申请号：US14220744

申请日：2014-03-20

Applicant: Ramon Cancel Olmo ,  Kunjal Parikh ,  Rajashree Baskaran ,  Daniel Zhang

Inventor： Ramon Cancel Olmo ,  Kunjal Parikh ,  Rajashree Baskaran ,  Daniel Zhang

IPC: H04N5/232 ,  G06F3/01

CPC classification number: G06F3/013 ,  G06F1/1626 ,  G06F1/1686 ,  G06F1/1694 ,  G06F2200/1637 ,  H04N5/23219 ,  H04N5/23293

Abstract: Various embodiments are generally directed to an apparatus and method for determining when an eye is focused on a display scene and determining movement of the eye based on image information when the eye is focused on the display scene. Various embodiments may also include detecting motion of an apparatus based on motion information and adjusting at least one of a position and a size of a frame in the display scene based on at least one of the movement of the eye and the motion of the apparatus.

Abstract translation: 各种实施例通常涉及用于当眼睛聚焦在显示场景时确定眼睛何时聚焦在显示场景上并基于图像信息确定眼睛的移动的装置和方法。 各种实施例还可以包括基于运动信息来检测装置的运动，并且基于眼睛的运动和装置的运动中的至少一个来调整显示场景中的帧的位置和尺寸中的至少一个。

公开(公告)号：US20150266725A1

公开(公告)日：2015-09-24

申请号：US14733926

申请日：2015-06-08

Applicant: Rajashree Baskaran

Inventor： Rajashree Baskaran

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2207/012 ,  B81C1/00015 ,  B81C2203/0118 ,  B81C2203/0136 ,  B81C2203/035 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L23/315 ,  H01L2224/16 ,  H01L2924/00 ,  H01L2924/0002

Abstract: Methods of forming integrated MEMS structures are described. Those methods and structures may include forming at least one MEMS structure on a first substrate, forming a first bonding layer on a top surface of the first substrate, and then coupling the first bonding layer disposed on the first substrate to a second substrate, wherein the second substrate comprises a device layer. The bonding may comprise a layer transfer process, wherein an integrated MEMS device is formed.

Abstract translation: 描述了形成集成MEMS结构的方法。 这些方法和结构可以包括在第一衬底上形成至少一个MEMS结构，在第一衬底的顶表面上形成第一结合层，然后将设置在第一衬底上的第一结合层耦合到第二衬底，其中 第二衬底包括器件层。 接合可以包括层转移工艺，其中形成集成的MEMS器件。

公开(公告)号：US07821073B2

公开(公告)日：2010-10-26

申请号：US12061935

申请日：2008-04-03

Applicant: Gilroy J. Vandentop ,  Rajashree Baskaran

Inventor： Gilroy J. Vandentop ,  Rajashree Baskaran

IPC: H01L27/092

CPC classification number: H01L21/6835 ,  H01L21/823807 ,  H01L21/84 ,  H01L29/7842 ,  H01L2221/6834 ,  H01L2221/6835 ,  H01L2221/68363

Abstract: Some embodiments of the present invention include selectively inducing back side stress opposite transistor regions to optimize transistor performance.

Abstract translation: 本发明的一些实施例包括选择性地诱导与晶体管区域相反的背侧应力以优化晶体管性能。

公开(公告)号：US20070128773A1

公开(公告)日：2007-06-07

申请号：US11296959

申请日：2005-12-07

Applicant: Rajashree Baskaran

Inventor： Rajashree Baskaran

IPC: H01L21/84 ,  H01L21/00

CPC classification number: H01L27/16 ,  H01L21/4882 ,  H01L23/38 ,  H01L27/12 ,  H01L2924/0002 ,  Y10S257/93 ,  H01L2924/00

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a first plurality of openings through a first surface of a substrate, forming a p-type TFTEC material within the first plurality of openings, forming a second plurality of openings substantially adjacent to the first plurality of openings through the first surface of the substrate, and then forming an n-type TFTEC material within the second plurality of openings.

Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括通过基板的第一表面形成第一多个开口，在第一多个开口内形成p型TFTEC材料，形成基本上邻近第一多个开口的第二多个开口，穿过第一 然后在第二多个开口内形成n型TFTEC材料。

公开(公告)号：US20070075420A1

公开(公告)日：2007-04-05

申请号：US11242176

申请日：2005-09-30

Applicant: Daoqiang Lu ,  Chuan Hu ,  Gilroy Vandentop ,  Shriram Ramanathan ,  Rajashree Baskaran ,  Valery Dubin

Inventor： Daoqiang Lu ,  Chuan Hu ,  Gilroy Vandentop ,  Shriram Ramanathan ,  Rajashree Baskaran ,  Valery Dubin

IPC: H01L23/34

CPC classification number: H01L24/83 ,  H01L21/4871 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/19106 ,  H01L2924/00

Abstract: A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.

Abstract translation: 一种制造具有直接接触散热器的微电子封装的方法，根据该方法形成的封装，根据该方法形成的模具散热器组合以及包含封装的系统。 该方法包括金属化微电子管芯的背面以形成直接接触并固定到管芯背面的散热器主体，从而产生模具散热器组合。 该封装包括模具散热器组合和与模具结合的衬底。

公开(公告)号：US20150309070A1

公开(公告)日：2015-10-29

申请号：US14264358

申请日：2014-04-29

Applicant: Rajashree Baskaran ,  Neil Goodey

Inventor： Rajashree Baskaran ,  Neil Goodey

IPC: G01P21/00 ,  G01C25/00

CPC classification number: G01P21/00 ,  G01C17/38 ,  G01C25/005

Abstract: Briefly, in accordance with one or more embodiments, a method to test one or more sensors of a device under test may comprise capturing visual motion data of the device under test disposed on an arm of a pendulum apparatus while the arm of the pendulum apparatus is in motion, capturing data from the one or more sensors while the arm of the pending apparatus is in motion, and comparing the visual motion data with the data from the one or more sensors to determine a relationship between the visual motion data and the data from the one or more sensors.

Abstract translation: 简而言之，根据一个或多个实施例，一种测试被测设备的一个或多个传感器的方法可以包括捕获摆设装置的臂上的待测设备的视觉运动数据，而摆锤装置的臂是 在运动中捕获来自一个或多个传感器的数据，同时待处理装置的臂处于运动状态，并将视觉运动数据与来自一个或多个传感器的数据进行比较，以确定视觉运动数据与来自 一个或多个传感器。

公开(公告)号：US20130000117A1

公开(公告)日：2013-01-03

申请号：US13173933

申请日：2011-06-30

Applicant: Rajashree Baskaran ,  Kimin Jun ,  Ting Zhong ,  Roy E. Swart ,  Paul B. Fischer

Inventor： Rajashree Baskaran ,  Kimin Jun ,  Ting Zhong ,  Roy E. Swart ,  Paul B. Fischer

IPC: H01R43/16

CPC classification number: G01R1/0416 ,  G01R1/06783 ,  H01R3/08 ,  Y10T29/49204

Abstract: Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.

Abstract translation: 本发明的实施例提供了使用液态金属形成电连接的方法。 使用液态金属的电气连接对于半导体器件的测试和验证是有用的。 通过液态金属区域在测试界面的探针和被测器件的电子接口之间形成电连接。 在本发明的实施例中，液态金属互连由镓或镓的液态金属合金构成。 为了可靠地进行电连接，使用液态金属触点不需要施加预定量的力。

公开(公告)号：US07723759B2

公开(公告)日：2010-05-25

申请号：US11257595

申请日：2005-10-24

Applicant: Rajashree Baskaran ,  Shriram Ramanathan ,  Patrick R. Morrow

Inventor： Rajashree Baskaran ,  Shriram Ramanathan ,  Patrick R. Morrow

IPC: H01L23/34

CPC classification number: H01L21/76898 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/481 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/06181 ,  H01L2224/13 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: An apparatus includes a metallization region including a plurality of metal layers on a device layer of a substrate, a via extending through the substrate and the device layer, and a heat spreading and stress engineering region in the substrate and adjacent to the device layer. The via contacts a metal layer in the metallization region.

Abstract translation: 一种装置包括金属化区域，该金属化区域包括在基板的器件层上的多个金属层，延伸穿过基板和器件层的通孔，以及在基板中并与器件层相邻的散热和应力工程区域。 通孔接触金属化区域中的金属层。

公开(公告)号：US07557438B2

公开(公告)日：2009-07-07

申请号：US11414273

申请日：2006-04-27

Applicant: Gregory M. Chrysler ,  Rajashree Baskaran

Inventor： Gregory M. Chrysler ,  Rajashree Baskaran

IPC: H01L23/02 ,  H01L23/34 ,  H01L23/36 ,  H01L23/373 ,  H01L23/473 ,  H01L25/065

CPC classification number: H01L23/473 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked die package includes a substrate (210, 310), a first die (220, 320) above the substrate, a spacer (230, 330) above the first die, a second die (240, 340) above the spacer, and a mold compound (250, 370) disposed around at least a portion of the first die, the spacer, and the second die. The spacer includes a heat transfer conduit (231, 331, 333, 351, 353) representing a path of lower overall thermal resistance than that offered by the mold compound itself. The heat transfer path created by the heat transfer conduit may result in better thermal performance, higher power dissipation rates, and/or lower operating temperatures for the stacked die package.

Abstract translation: 堆叠的管芯封装包括衬底（210,310），衬底上的第一管芯（220,320），第一管芯上方的间隔物（230,330），间隔物上方的第二管芯（240,340），以及 设置在第一模具，间隔件和第二模具的至少一部分周围的模具化合物（250,370）。 间隔件包括传热管道（231,331,333,351,353），其表示比由模具化合物本身提供的更低的整体热阻的路径。 由传热导管产生的传热路径可以导致堆叠管芯封装具有更好的热性能，更高的功耗率和/或较低的工作温度。