公开(公告)号：US20180157175A1

公开(公告)日：2018-06-07

申请号：US15802094

申请日：2017-11-02

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Sheng Liu ,  Shintaro Yamada ,  James F. Cameron ,  Li Cui ,  Suzanne M. Coley ,  Joshua A. Kaitz ,  Keren Zhang

IPC: G03F7/038 ,  G03F7/09 ,  G03F7/11

CPC classification number: G03F7/0384 ,  G03F7/0752 ,  G03F7/091 ,  G03F7/094 ,  G03F7/11

Abstract: Polyarylene resins and compositions containing them are useful as underlayers in semiconductor manufacturing processes.