公开(公告)号：US20240241440A1

公开(公告)日：2024-07-18

申请号：US18090145

申请日：2022-12-28

Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC

Inventor： Emad Aqad ,  Li Cui ,  Yinjie Cen ,  Wenxu Zhang ,  Mingqi Li ,  James F. Cameron

IPC: G03F7/039 ,  C08F212/14 ,  C08F220/18 ,  G03F7/038

CPC classification number: G03F7/039 ,  C08F212/24 ,  C08F220/1808 ,  C08F220/1809 ,  G03F7/038

Abstract: A polymer, including a first repeating unit comprising a sulfone group, wherein the sulfone group is directly bonded to a group of formula —C(Ra)(Rb)—; and a second repeating unit comprising an acid labile group, a base-decomposable group, a polar group, or a combination thereof, wherein Ra and Rb are each independently hydrogen, halogen, substituted or unsubstituted C1-30 alkyl, substituted or unsubstituted C3-30 cycloalkyl, substituted or unsubstituted C3-30 heterocycloalkyl, substituted or unsubstituted C2-30 alkenyl, substituted or unsubstituted C3-30 cycloalkenyl, substituted or unsubstituted C3-30 heterocycloalkenyl, substituted or unsubstituted C6-30 aryl, substituted or unsubstituted C7-30 arylalkyl, substituted or unsubstituted C7-30 alkylaryl, substituted or unsubstituted C2-30 heteroaryl, substituted or unsubstituted C3-30 heteroarylalkyl, or substituted or unsubstituted C3-30 alkylheteroaryl, provided that at least one of Ra and Rb is hydrogen.

公开(公告)号：US11733609B2

公开(公告)日：2023-08-22

申请号：US17370541

申请日：2021-07-08

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charlotte A. Cutler ,  Li Cui ,  Shintaro Yamada ,  Paul J. LaBeaume ,  Suzanne M. Coley ,  James F. Cameron ,  Daniel Greene

IPC: G03F7/075 ,  G03F7/11 ,  G03F7/16 ,  G03F7/32 ,  G03F7/20 ,  G03F7/42 ,  C08F230/08 ,  C09D143/04 ,  C08F220/18

CPC classification number: G03F7/0752 ,  C08F230/08 ,  C08F230/085 ,  G03F7/11 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/322 ,  G03F7/423 ,  C08F220/1804 ,  C08F2800/10 ,  C09D143/04 ,  C08F220/1804 ,  C08F230/085

Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.

公开(公告)号：US11042093B2

公开(公告)日：2021-06-22

申请号：US16167568

申请日：2018-10-23

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： James F. Cameron ,  Keren Zhang ,  Li Cui ,  Daniel Greene ,  Shintaro Yamada

IPC: G03F7/20 ,  C08G61/10 ,  G03F7/09

Abstract: A method of manufacturing a semiconductor device comprising: providing a semiconductor device substrate having a relief image on a surface of the substrate, the relief image having a plurality of gaps to be filled; applying a coating composition to the relief image to provide a coating layer, wherein the coating composition comprises (i) a polyarylene oligomer comprising as polymerized units one or more first monomers having two or more cyclopentadienone moieties and one or more second monomers having an aromatic moiety and two or more alkynyl moieties; wherein the polyarylene oligomer has a Mw of 1000 to 6000 Da, a PDI of 1 to 2, and a molar ratio of total first monomers to total second monomers of 1:>1; and (ii) one or more organic solvents; curing the coating layer to form a polyarylene film; patterning the polyarylene film; and transferring the pattern to the semiconductor device substrate.

公开(公告)号：US10818493B2

公开(公告)日：2020-10-27

申请号：US16218519

申请日：2018-12-13

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Suzanne M. Coley ,  Paul J. LaBeaume ,  Shintaro Yamada ,  Cecilia W. Kiarie ,  Li Cui ,  Bhooshan Popere

IPC: H01L21/027 ,  C08G77/04 ,  G03F7/09 ,  C09D7/20 ,  C08G77/50 ,  C09D183/14 ,  G03F7/075 ,  C09D5/00 ,  C08G77/00

Abstract: Compositions for forming thin, silicon-containing antireflective coatings and methods of using these compositions in the manufacture of electronic devices are provided. Silicon-containing antireflective coatings formed from the these compositions can be easily removed during processing without the need for a separate removal step.

公开(公告)号：US20180366319A1

公开(公告)日：2018-12-20

申请号：US15622220

申请日：2017-06-14

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Suzanne M. Coley ,  Paul J. LaBeaume ,  Shintaro Yamada ,  Cecilia W. Kiarie ,  Li Cui ,  Bhooshan Popere

IPC: H01L21/027 ,  C08G77/04 ,  C09D7/00 ,  C09D183/04 ,  C09D5/00 ,  G03F7/039 ,  G03F7/038 ,  G03F7/16 ,  G03F7/20 ,  G03F7/09 ,  G03F7/32

CPC classification number: H01L21/0276 ,  C08G77/04 ,  C08G77/80 ,  C09D5/006 ,  C09D7/20 ,  C09D183/04 ,  G03F7/038 ,  G03F7/039 ,  G03F7/091 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/322 ,  G03F7/325

Abstract: Compositions for forming thin, silicon-containing antireflective coatings and methods of using these compositions in the manufacture of electronic devices are provided. Silicon-containing antireflective coatings formed from these compositions can be easily removed during processing without the need for a separate removal step.

公开(公告)号：US20180253006A1

公开(公告)日：2018-09-06

申请号：US15971103

申请日：2018-05-04

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Li Cui ,  Charlotte A. Cutler ,  Suzanne M. Coley ,  Owendi Ongayi ,  Christopher P. Sullivan ,  Paul J. LaBeaume ,  Shintaro Yamada ,  Mingqi Li ,  James F. Cameron

IPC: G03F7/11 ,  G03F7/20 ,  C08F24/00 ,  C08F20/06 ,  C08F16/10 ,  C08F20/30 ,  C08F20/14 ,  C08G63/08 ,  C09D183/04 ,  C09D5/20 ,  C08G77/04 ,  G03F7/42 ,  G03F7/16 ,  G03F7/30

CPC classification number: G03F7/11 ,  C08F16/10 ,  C08F20/06 ,  C08F20/10 ,  C08F20/14 ,  C08F20/30 ,  C08F24/00 ,  C08F220/14 ,  C08F220/20 ,  C08F220/34 ,  C08F222/06 ,  C08F222/40 ,  C08F230/08 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/1891 ,  C08F2220/282 ,  C08F2220/283 ,  C08F2220/325 ,  C08F2800/10 ,  C08G63/08 ,  C08G77/04 ,  C08G77/20 ,  C08G77/80 ,  C09D5/20 ,  C09D183/04 ,  G03F7/0752 ,  G03F7/161 ,  G03F7/20 ,  G03F7/30 ,  G03F7/422 ,  G03F7/423 ,  C08K5/19 ,  C08L33/14

Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

公开(公告)号：US11940732B2

公开(公告)日：2024-03-26

申请号：US17231417

申请日：2021-04-15

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Sheng Liu ,  James F. Cameron ,  Shintaro Yamada ,  Iou-Sheng Ke ,  Keren Zhang ,  Suzanne M. Coley ,  Li Cui ,  Paul J. LaBeaume ,  Deyan Wang

IPC: G03F7/11 ,  C09D4/06 ,  C09D7/47 ,  C09D7/63 ,  G03F7/025 ,  G03F7/075 ,  G03F7/09 ,  G03F7/16 ,  G03F7/20

CPC classification number: G03F7/11 ,  C09D4/06 ,  C09D7/47 ,  C09D7/63 ,  G03F7/025 ,  G03F7/0752 ,  G03F7/091 ,  G03F7/094 ,  G03F7/16 ,  G03F7/2016

Abstract: Coating compositions comprise: a curable compound comprising: a core chosen from a C6 carbocyclic aromatic ring, a C2-5 heterocyclic aromatic ring, a C9-30 fused carbocyclic aromatic ring system, a C4-30 fused heterocyclic aromatic ring system, C1-20 aliphatic, and C3-20 cycloaliphatic, and three or more substituents of formula (1)




wherein at least two substituents of formula (1) are attached to the aromatic core; provided that no substituents of formula (1) are in an ortho position to each other on the same aromatic ring of the core; a polymer; and one or more solvents, wherein the total solvent content is from 50 to 99 wt % based on the coating composition.

公开(公告)号：US20220197143A1

公开(公告)日：2022-06-23

申请号：US17127434

申请日：2020-12-18

Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC

Inventor： Joshua Kaitz ,  Ke Yang ,  Keren Zhang ,  Li Cui ,  James F. Cameron ,  Dan B. Millward ,  Shintaro Yamada

IPC: G03F7/11 ,  C09D171/00 ,  C08G65/40

Abstract: A photoresist underlayer composition comprising a poly(arylene ether); an additive of formula (14): D-(L1-Ar—[X]n)m  (14); and a solvent, wherein, in formula (14), D is a substituted or unsubstituted C1-60 organic group, optionally wherein D is an organic acid salt of the substituted or unsubstituted C1-60 organic group; each L1 is independently a single bond or a divalent linking group, when L1 is a single bond, D may be a substituted or unsubstituted C3-30 cycloalkyl or substituted or unsubstituted C1-20 heterocycloalkyl that is optionally fused with Ar, each Ar is independently a monocyclic or polycyclic C5-60 aromatic group, each X is independently —OR30, —SR31, or —NR32R33, m is an integer of 1 to 6, each n is independently an integer of 0 to 5, provided that a sum of all n is 2 or greater, and R30 to R33 are as provided herein.

公开(公告)号：US20210397093A1

公开(公告)日：2021-12-23

申请号：US17370541

申请日：2021-07-08

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charlotte A. Cutler ,  Li Cui ,  Shintaro Yamada ,  Paul J. LaBeaume ,  Suzanne M. Coley ,  James F. Cameron ,  Daniel Greene

IPC: G03F7/11 ,  C08F230/08 ,  G03F7/16 ,  G03F7/32 ,  G03F7/20 ,  G03F7/42 ,  G03F7/075

Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.

公开(公告)号：US20210247695A1

公开(公告)日：2021-08-12

申请号：US17245326

申请日：2021-04-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Sheng Liu ,  James F. Cameron ,  Shintaro Yamada ,  Iou-Sheng Ke ,  Keren Zhang ,  Daniel Greene ,  Paul J. LaBeaume ,  Li Cui ,  Suzanne M. Coley

IPC: G03F7/11 ,  C09D5/00 ,  G03F7/075

Abstract: Compounds having three or more alkynyl moieties substituted with an aromatic moiety having one or more of certain substituents are useful in forming underlayers useful in semiconductor manufacturing processes.