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41.发明申请公开(公告)号：US20140252421A1
公开(公告)日：2014-09-11
申请号：US14281100
申请日：2014-05-19
Inventor： Yi-Shao Liu , Chun-Ren Cheng , Ching-Ray Chen , Yi-Hsien Chang , Fei-Lung Lai , Chun-Wen Cheng
IPC: G01N27/414
CPC classification number: G01N27/4145 , G01N27/4148 , H01L21/31105 , H01L27/088 , H01L29/66477
Abstract: The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.
Abstract translation: 本公开提供了生物场效应晶体管（BioFET）器件和制造BioFET和BioFET器件的方法。 该方法包括使用与互补金属氧化物半导体（CMOS）工艺兼容或典型的一个或多个工艺步骤形成BioFET。 BioFET器件包括设置在衬底的第一表面上的栅极结构和形成在衬底的第二表面上的界面层。 在形成界面层之前，从第二表面减薄衬底以暴露沟道区。
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公开(公告)号：US20140239986A1
公开(公告)日：2014-08-28
申请号：US13774708
申请日：2013-02-22
Inventor： Yi-Shao Liu , Chun-Ren Cheng , Chun-Wen Cheng
CPC classification number: G01R1/07307 , B01J2219/00531 , B01J2219/00653 , B01J2219/00659 , B01J2219/00693 , G01N27/4145 , G01N27/4163 , G01R1/06783
Abstract: The present disclosure provides a biosensor device wafer testing and processing methods, system and apparatus. The biosensor device wafer includes device areas separated by scribe lines. A number of test areas that allow fluidic electrical testing are embedded in scribe lines or in device areas. An integrated electro-microfluidic probe card includes a fluidic mount that may be transparent, a microfluidic channels in the fluidic mount in a testing portion, at least one microfluidic probe and a number of electronic probe tips at the bottom of the fluidic mount, fluidic and electronic input and output ports on the sides of the fluidic mount, and at least one handle lug on the fluidic mount. The method includes aligning a wafer, mounting the integrated electro-microfluidic probe card, flowing one or more test fluids in series, and measuring and analyzing electrical properties to determine process qualities and an acceptance level of the wafer.
Abstract translation: 本公开提供了生物传感器装置晶片测试和处理方法，系统和装置。 生物传感器装置晶片包括由划线分开的装置区域。 允许流体电气测试的许多测试区域嵌入划线或设备区域。 集成的电微流体探针卡包括可以是透明的流体安装件，在测试部分中的流体安装件中的微流体通道，至少一个微流体探针和在流体安装底部的多个电子探针尖端，流体和/ 流体支架侧面的电子输入和输出端口以及流体支架上的至少一个手柄凸耳。 该方法包括对准晶片，安装集成的电微流体探针卡，串联流动一个或多个测试流体，以及测量和分析电特性以确定晶片的工艺质量和接受程度。
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公开(公告)号：US12029130B2
公开(公告)日：2024-07-02
申请号：US17880773
申请日：2022-08-04
Inventor： Ching-Hui Lin , Chun-Ren Cheng , Shih-Fen Huang , Fu-Chun Huang
IPC: H01L41/113 , G01N27/414 , H10N30/05 , H10N30/08 , H10N30/30 , H10N30/87 , H10N30/88
CPC classification number: H10N30/302 , G01N27/4141 , H10N30/05 , H10N30/08 , H10N30/878 , H10N30/88
Abstract: In some embodiments, a piezoelectric biosensor is provided. The piezoelectric biosensor includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A sensing reservoir is disposed over the piezoelectric structure and exposed to an ambient environment, where the sensing reservoir is configured to collect a fluid comprising a number of bio-entities.
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公开(公告)号：US11897759B2
公开(公告)日：2024-02-13
申请号：US17838023
申请日：2022-06-10
Inventor： Po Chen Yeh , Yi-Hsien Chang , Fu-Chun Huang , Ching-Hui Lin , Chiahung Liu , Shih-Fen Huang , Chun-Ren Cheng
CPC classification number: B81B7/007 , B81C1/00301 , B81B2201/0271 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , B81B2207/097 , B81C2203/0792
Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.
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公开(公告)号：US11834325B2
公开(公告)日：2023-12-05
申请号：US17840892
申请日：2022-06-15
Inventor： Fan Hu , Chun-Ren Cheng , Hsiang-Fu Chen , Wen-Chuan Tai
CPC classification number: B81B3/0013 , B81C1/00968 , B81B2203/0109 , B81B2203/04 , B81B2207/012 , B81B2207/03 , B81B2207/07
Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a first dielectric structure disposed over a first semiconductor substrate, where the first dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the first dielectric structure and includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. A first piezoelectric anti-stiction structure is disposed between the movable mass and the first dielectric structure, wherein the first piezoelectric anti-stiction structure includes a first piezoelectric structure and a first electrode disposed between the first piezoelectric structure and the first dielectric structure.
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Patent Agency Ranking
公开(公告)号：US20230387164A1
公开(公告)日：2023-11-30
申请号：US17824183
申请日：2022-05-25
Inventor： Yi-Hsien Chang , Shih-Fen Huang , Chun-Ren Cheng , Fu-Chun Huang , Ching-Hui Lin
IPC: H01L27/146
CPC classification number: H01L27/14627 , H01L27/14621 , H01L27/14678 , H01L27/14685 , H01L27/14629 , A61B5/68
Abstract: The present disclosure relates to an integrated chip including a semiconductor layer and a photodetector disposed along the semiconductor layer. A color filter is over the photodetector. A micro-lens is over the color filter. A dielectric structure comprising one or more dielectric layers is over the micro-lens. A receptor layer is over the dielectric structure. An optical signal enhancement structure is disposed along the dielectric structure and between the receptor layer and the micro-lens.
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47.发明申请公开(公告)号：US20220384709A1
公开(公告)日：2022-12-01
申请号：US17881934
申请日：2022-08-05
Inventor： Alexander Kalnitsky , Chun-Ren Cheng , Chi-Yuan Shih , Kai-Fung Chang , Shih-Fen Huang , Yi-Chuan Teng , Yi Heng Tsai , You-Ru Lin , Yan-Jie Liao
IPC: H01L41/253
Abstract: In some embodiments, a piezoelectric device is provided. The piezoelectric device includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A heating element is disposed over the semiconductor substrate. The heating element is configured to heat the piezoelectric structure to a recovery temperature for a period of time, where heating the piezoelectric structure to the recovery temperature for the period of time improves a degraded electrical property of the piezoelectric device.
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公开(公告)号：US11220422B2
公开(公告)日：2022-01-11
申请号：US16353484
申请日：2019-03-14
Inventor： Fan Hu , Wen-Chuan Tai , Hsiang-Fu Chen , Chun-Ren Cheng
IPC: B81B3/00 , G01C19/5656
Abstract: A micro-electro-mechanical system (MEMS) device includes a substrate, a proof mass, and a piezoelectric bump. The substrate has a surface. The proof mass is suspended over the surface of the substrate, wherein the proof mass is movable with respect to the substrate. The piezoelectric bump is disposed on the surface of the substrate and extends a distance from the surface of the substrate toward the proof mass.
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公开(公告)号：US20210115507A1
公开(公告)日：2021-04-22
申请号：US17111255
申请日：2020-12-03
Inventor： Allen Timothy Chang , Yi-Hsien Chang , Chun-Ren Cheng
IPC: C12Q1/6869 , G01N27/447 , B01L3/00 , B01F13/00 , G01N21/05 , G01N21/64
Abstract: An integrated semiconductor device for manipulating and processing bio-entity samples and methods are described. The device includes a lower substrate, at least one optical signal conduit disposed on the lower substrate, at least one cap bonding pad disposed on the lower substrate, a cap configured to form a capped area, and disposed on the at least one cap bonding pad, a fluidic channel, wherein a first side of the fluidic channel is formed on the lower substrate and a second side of the fluidic channel is formed on the cap, a photosensor array coupled to sensor control circuitry, and logic circuitry coupled to the fluidic control circuitry, and the sensor control circuitry.
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公开(公告)号：US10688786B2
公开(公告)日：2020-06-23
申请号：US15959988
申请日：2018-04-23
Inventor： Jung-Huei Peng , Chun-Ren Cheng , Jiou-Kang Lee , Shang-Ying Tsai , Ting-Hau Wu
Abstract: MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.
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