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公开(公告)号：US20090008766A1
公开(公告)日：2009-01-08
申请号：US11772812
申请日：2007-07-02
Applicant: Chien-Wei Chang , Ting-Hao Lin
Inventor： Chien-Wei Chang , Ting-Hao Lin
CPC classification number: H01L23/5389 , H01L24/16 , H01L24/48 , H01L24/81 , H01L24/85 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2224/85455 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A high-density fine line structure mainly includes two semiconductor devices formed on the same surface, without stacking to each other. One of the semiconductor devices is directly installed on a fine line circuit layer, and the other semiconductor device is installed on the fine line circuit layer within a dielectric layer cavity. In the method of the present invention, electroplating rather than the etching method is used for forming the fine line circuit layer, and a carrier and a metal barrier layer, which are needed during or at the end of the manufacturing process, are removed to increase the wiring density for realizing the object of high-density.
Abstract translation: 高密度细线结构主要包括形成在相同表面上的两个半导体器件，而不彼此堆叠。 其中一个半导体器件直接安装在细线电路层上，另一个半导体器件安装在电介质层腔内的细线电路层上。 在本发明的方法中，电镀而不是蚀刻方法用于形成细线电路层，并且去除在制造过程期间或结束时需要的载体和金属阻挡层，以增加 用于实现高密度物体的布线密度。
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公开(公告)号：US20080285245A1
公开(公告)日：2008-11-20
申请号：US11749752
申请日：2007-05-17
Applicant: Ting-Hao Lin , Chien-Wei Chang
Inventor： Ting-Hao Lin , Chien-Wei Chang
CPC classification number: H05K1/162 , H05K1/165 , H05K1/167 , H05K3/108 , H05K3/205 , H05K2201/09236 , H05K2201/09881 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49128 , Y10T29/49155
Abstract: Embedded passive device structure and its manufacturing method for mainly embedding the passive device structure in the printed circuit board are presented. In this structure, both the source electrode and the ground electrode of the passive device belong to the same level, and includes several source branches and several ground branches that are formed vertically on the inside of the dielectric layer of the circuit board which are connected, respectively, to avoid the conducting between the source electrode and the ground electrode during lamination. When it is in the form of the capacitor structure, through the use of the ultra-fine wiring technique, these source branches and ground branches are separated by a small gap between each other. Therefore, the side face area and quantities of the source branches and ground branches are both increased.
Abstract translation: 介绍了嵌入式无源器件结构及其主要将无源器件结构嵌入印刷电路板的制造方法。 在该结构中，无源器件的源电极和接地电极都属于同一水平，并且包括垂直形成在电路板的电介质层的内部上的多个源极分支和几个接地分支， 以避免在层压期间源电极和接地电极之间的导电。 当它是电容器结构的形式时，通过使用超细布线技术，这些源极分支和接地分支之间彼此间有很小的间隙。 因此，源分支和接地分支的侧面积和数量都增加。
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公开(公告)号：US06864513B2
公开(公告)日：2005-03-08
申请号：US10431013
申请日：2003-05-07
Applicant: Ting-Hao Lin , Li-Wei Kuo
Inventor： Ting-Hao Lin , Li-Wei Kuo
CPC classification number: H01L25/0753 , F21K9/23 , F21K9/232 , F21K9/233 , F21V29/67 , F21V29/677 , F21V29/74 , F21V29/763 , F21V29/89 , F21W2111/00 , F21W2121/00 , F21Y2113/17 , F21Y2115/10 , H01L2224/48091 , Y10S362/80 , H01L2924/00014
Abstract: A light emitting diode (LED) bulb includes a heat sink, a circuit layer having two opposite sides, multiple LEDs mounted on one side and an electrical insulating layer connected between the opposite side and the heat sink. Heat generated by the LEDs is conducted to the heat sink through the circuit layer and the electrical insulting layer and is dissipated quickly. Further, a fan can be mounted on the fins to dissipate heat from the heat sink more quickly. Therefore, the LED bulb has good heat dissipating efficiency.
Abstract translation: 发光二极管（LED）灯泡包括散热器，具有两个相对侧的电路层，安装在一侧的多个LED和连接在相对侧和散热器之间的电绝缘层。 由LED产生的热量通过电路层和电绝缘层传导到散热器，并迅速消散。 此外，风扇可以安装在翅片上，以更快速地散发来自散热器的热量。 因此，LED灯泡具有良好的散热效率。
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