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公开(公告)号：US10777521B2
公开(公告)日：2020-09-15
申请号：US14823917
申请日：2015-08-11
Applicant: X Display Company Technology Limited
Inventor： Matthew Meitl , Christopher Bower , Ronald S. Cok
Abstract: A printable component structure includes a chiplet having a semiconductor structure with a top side and a bottom side, one or more top electrical contacts on the top side of the semiconductor structure, and one or more bottom electrical contacts on the bottom side of the semiconductor structure. One or more electrically conductive spikes are in electrical contact with the one or more top electrical contacts. Each spike protrudes from the top side of the semiconductor structure or a layer in contact with the top side of the semiconductor structure.
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公开(公告)号：US20200168760A1
公开(公告)日：2020-05-28
申请号：US16777192
申请日：2020-01-30
Applicant: X Display Company Technology Limited
Inventor： Brook Raymond , Christopher Andrew Bower , Matthew Meitl , Ronald S. Cok
Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.
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