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公开(公告)号：US20060205118A1
公开(公告)日：2006-09-14
申请号：US11356070
申请日：2006-02-17
Applicant: Ming-Hang Hwang , Yu-Chiang Cheng , Chao-Yi Chen , Ping-Feng Lee , Hsin-Lung Kuo , Bin-Wei Lee , Wei-Chung Hsiao
Inventor： Ming-Hang Hwang , Yu-Chiang Cheng , Chao-Yi Chen , Ping-Feng Lee , Hsin-Lung Kuo , Bin-Wei Lee , Wei-Chung Hsiao
IPC: H01L21/00
CPC classification number: H01L23/3736 , H01L23/10 , H01L23/3675 , H01L23/3732 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15312 , H01L2924/16152 , H01L2224/0401
Abstract: This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.
Abstract translation: 本发明公开了一种用于芯片散热的制造方法和结构。 该散热结构包括电路结构的底板，中央处理单元的模具和盖。 该盖通常用于进行从芯片产生的废热。 盖可以由特殊的导热材料制成，包括具有高导热性的碳元素的金属和支架结构，以提高热传导的效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法进行。 碳元素的支架结构可以涂覆在金属表面上，也可以混入金属中。
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公开(公告)号：US06417460B1
公开(公告)日：2002-07-09
申请号：US09800412
申请日：2001-03-06
Applicant: Yu-Chiang Cheng
Inventor： Yu-Chiang Cheng
IPC: H05K103
CPC classification number: H05K1/024 , H05K1/0298 , H05K1/0366 , H05K3/4688 , H05K2201/0145 , H05K2201/0191 , H05K2201/09327
Abstract: A multi-layer circuit board includes first, second, third, fourth, fifth, sixth and seventh insulating substrates; first, second, third, fourth and fifth signal wiring layers; first and second ground wiring layers; and a power wiring layer. Each of the first and seventh insulating substrates has a thickness ranging from 2.5 to 6.5 mil. Each of the second, fourth and sixth insulating substrates has a thickness ranging from 3 to 9 mil. Each of the third and fifth insulating substrates has a thickness ranging from 3 to 23 mil. The first signal wiring layer has a first resistance with respect to the first ground wiring layer. The second signal wiring layer has a second resistance with respect to the first ground wiring layer and the power wiring layer. The third signal wiring layer has a third resistance with respect to the first ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the second ground wiring layer and the power wiring layer. The fifth signal wiring layer has a fifth resistance with respect to the second ground wiring layer. The first, second, third, fourth and fifth resistances are within the range of 49.5 to 60.5 ohms.
Abstract translation: 多层电路板包括第一，第二，第三，第四，第五，第六和第七绝缘基板; 第一，第二，第三，第四和第五信号布线层; 第一和第二接地布线层; 和电力布线层。 第一和第七绝缘基板中的每一个具有2.5至6.5密耳的厚度。 第二，第四和第六绝缘基板中的每一个具有3至9密耳的厚度。 第三和第五绝缘基板中的每一个具有3至23密耳的厚度。 第一信号布线层相对于第一接地布线层具有第一电阻。 第二信号布线层相对于第一接地布线层和电源布线层具有第二电阻。 第三信号布线层相对于第一接地布线层和电源布线层具有第三电阻。 第四信号布线层相对于第二接地布线层和电源布线层具有第四电阻。 第五信号布线层相对于第二接地布线层具有第五电阻。 第一，第二，第三，第四和第五电阻在49.5至60.5欧姆的范围内。
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43.发明授权Antenna device with surface antenna pattern integrally coated casing of electronic device 有权天线装置具有天线方向图整体涂覆电子装置外壳公开(公告)号：US07825862B2
公开(公告)日：2010-11-02
申请号：US11898525
申请日：2007-09-13
Applicant: Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
Inventor： Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
IPC: H01Q1/24
CPC classification number: H01Q1/2258
Abstract: An antenna device with a surface antenna pattern is formed either on an internal surface or on the external surface of a casing of an electronic device by film coating technology. The surface antenna pattern is either directly connected to a signal feeding line or connected to a signal feeding line through a signal guiding passage. In an embodiment, a recess is pre-formed on the external surface of the casing and then a surface antenna pattern is coated to the recess. The antenna device may further comprise an antenna coupling element arranged at the internal surface of the casing, in opposite to the surface antenna pattern. The antenna coupling element is inductively coupled with the surface antenna pattern for transceiving the signals to the electronic device.
Abstract translation: 具有表面天线图案的天线装置通过薄膜涂覆技术形成在电子装置的壳体的内表面或外表面上。 表面天线图案或者直接连接到信号馈送线或者通过信号引导通道连接到信号馈送线。 在一个实施例中，在壳体的外表面上预先形成凹部，然后将表面天线图案涂覆到凹部。 天线装置还可以包括天线耦合元件，其布置在壳体的内表面处，与表面天线图案相对。 天线耦合元件与表面天线方向感应耦合，用于将信号收发到电子设备。
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公开(公告)号：US20090066588A1
公开(公告)日：2009-03-12
申请号：US11898314
申请日：2007-09-11
Applicant: Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
Inventor： Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
IPC: H01Q1/24
CPC classification number: H01Q1/40 , H01Q1/2266
Abstract: A case structure of an electronic device is used for directly integrating an antenna of a signal transceiver circuit and a case of the electronic device, so as to improve a space utilization rate of the electronic device. At least one trench pattern is formed on a specific region of the metal case of the electronic device. When the metal case is electrically coupled to the signal transceiver circuit of the electronic device, the metal case and the trench pattern constitute at least one antenna of the electronic device.
Abstract translation: 电子设备的壳体结构用于直接集成信号收发电路的天线和电子设备的壳体，以提高电子设备的空间利用率。 在电子设备的金属壳体的特定区域上形成至少一个沟槽图案。 当金属壳体电耦合到电子设备的信号收发器电路时，金属壳体和沟槽图案构成电子设备的至少一个天线。
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45.发明申请Antenna device with surface antenna pattern integrally coated casing of electronic device 有权天线装置具有天线方向图整体涂覆电子装置外壳公开(公告)号：US20080297420A1
公开(公告)日：2008-12-04
申请号：US11898525
申请日：2007-09-13
Applicant: Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
Inventor： Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
CPC classification number: H01Q1/2258
Abstract: An antenna device with a surface antenna pattern is formed either on an internal surface or on the external surface of a casing of an electronic device by film coating technology. The surface antenna pattern is either directly connected to a signal feeding line or connected to a signal feeding line through a signal guiding passage. In an embodiment, a recess is pre-formed on the external surface of the casing and then a surface antenna pattern is coated to the recess. The antenna device may further comprise an antenna coupling element arranged at the internal surface of the casing, in opposite to the surface antenna pattern. The antenna coupling element is inductively coupled with the surface antenna pattern for transceiving the signals to the electronic device.
Abstract translation: 具有表面天线图案的天线装置通过薄膜涂覆技术形成在电子装置的壳体的内表面或外表面上。 表面天线图案或者直接连接到信号馈送线或者通过信号引导通道连接到信号馈送线。 在一个实施例中，在壳体的外表面上预先形成凹部，然后将表面天线图案涂覆到凹部。 天线装置还可以包括天线耦合元件，其布置在壳体的内表面处，与表面天线图案相对。 天线耦合元件与表面天线方向感应耦合，用于将信号收发到电子设备。
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Patent Agency Ranking
公开(公告)号：US20080198087A1
公开(公告)日：2008-08-21
申请号：US11676181
申请日：2007-02-16
Applicant: Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zeng Chou
Inventor： Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zeng Chou
IPC: H01Q1/48
Abstract: A dual-band antenna is provided, which includes a signal resonance unit, a grounding unit, a connection unit, and a signal line. The grounding unit is disposed opposite to the signal resonance unit. The connection unit has a first connection element and a second connection element, wherein one end of the first connection element is connected to the signal resonance unit and the other end of the first connection element is connected to the grounding unit, while one end of the second connection element is connected to one side of the first connection element. The signal line has a signal feeding end and a circuit connection end, wherein the signal feeding end is electrically connected to the second connection element, and the circuit connection end is electrically connected to a wireless circuit device.
Abstract translation: 提供了一种双频天线，其包括信号共振单元，接地单元，连接单元和信号线。 接地单元设置成与信号谐振单元相对。 连接单元具有第一连接元件和第二连接元件，其中第一连接元件的一端连接到信号谐振单元，并且第一连接元件的另一端连接到接地单元，而第一连接元件的一端 第二连接元件连接到第一连接元件的一侧。 信号线具有信号馈送端和电路连接端，其中信号馈送端电连接到第二连接元件，并且电路连接端电连接到无线电路装置。
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公开(公告)号：US20070236399A1
公开(公告)日：2007-10-11
申请号：US11474935
申请日：2006-06-27
Applicant: Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
Inventor： Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
CPC classification number: H01Q1/2266 , H01Q9/30
Abstract: Disclosed is an antenna device with an antenna element with a predetermined shorten length, and a resonance circuit coupled to the antenna element, having a predetermined resonance frequency for matching the shorten length of the antenna element to adaptively make the antenna element in response to and transceive a wireless signal with a predetermined frequency.
Abstract translation: 公开了具有预定缩短长度的天线元件和耦合到天线元件的谐振电路的天线装置，具有用于匹配天线元件的缩短长度的预定谐振频率，以自适应地使天线元件响应于和收发 具有预定频率的无线信号。
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公开(公告)号：US20070216581A1
公开(公告)日：2007-09-20
申请号：US11404812
申请日：2006-04-17
Applicant: Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
Inventor： Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
CPC classification number: H01Q1/40 , H01Q1/2266 , H01Q1/38
Abstract: Disclosed is an antenna device having a substrate, an antenna element for transceiving a wireless signal, an antenna signal feeding line for feeding the wireless signal, and an ion-implanted resonant pattern, which includes a first coupling pattern implanted in the substrate by an Ion-implantation process and a second coupling pattern formed at a position corresponding to the first coupling pattern with a predetermined distance therebetween, formed at an adjacent position with respect to the antenna element. As the antenna element transceives the wireless signal of the predetermined radiation frequency and generates an induction voltage, the first coupling pattern and the second coupling pattern each generates a coupled induction voltage and a capacitance therebetween, hence forming a resonance with the antenna element.
Abstract translation: 公开了具有基板，用于收发无线信号的天线元件，用于馈送无线信号的天线信号馈送线以及离子注入谐振图案的天线装置，其包括通过离子注入到基板中的第一耦合图案 在相对于天线元件的相邻位置处形成有在与第一耦合图案相对应的位置处与其间具有预定距离的位置处理和第二耦合图案。 当天线元件收发预定辐射频率的无线信号并产生感应电压时，第一耦合模式和第二耦合模式各自产生耦合的感应电压和它们之间的电容，从而与天线元件形成谐振。
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49.发明申请Coupling antenna device having antenna pattern with multi-frequency resonating sectors 有权具有多频谐振扇区的天线方向图的耦合天线装置公开(公告)号：US20070210963A1
公开(公告)日：2007-09-13
申请号：US11404809
申请日：2006-04-17
Applicant: Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
Inventor： Yu-Chiang Cheng , Ping-Cheng Chang , Cheng-Zing Chou
IPC: H01Q1/38
Abstract: Disclosed is a coupling antenna device for transceiving a plurality of wireless signals with multiple radiation frequencies. The coupling antenna device includes an antenna pattern having a plurality of adjacent resonating sectors, each of the resonating sectors having a length determined by a specific radiation frequency responsive to one of the wireless signals.
Abstract translation: 公开了一种用于收发具有多个辐射频率的多个无线信号的耦合天线装置。 耦合天线装置包括具有多个相邻谐振扇区的天线方向图，每个谐振扇区具有响应于一个无线信号的特定辐射频率确定的长度。
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公开(公告)号：US20070199682A1
公开(公告)日：2007-08-30
申请号：US11307845
申请日：2006-02-24
Applicant: Ming-Hang Hwang , Yu-Chiang Cheng , Chao-Yi Chen , Hsin-Lung Kuo , Bin-Wei Lee , Wei-Chung Hsiao
Inventor： Ming-Hang Hwang , Yu-Chiang Cheng , Chao-Yi Chen , Hsin-Lung Kuo , Bin-Wei Lee , Wei-Chung Hsiao
IPC: F28D15/00
CPC classification number: F28D15/046
Abstract: This invention discloses a manufacturing method and the structure for a dissipation heat pipe. The dissipation heat pipe includes a hollow closed pipe, a column, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.
Abstract translation: 本发明公开了一种散热管的制造方法和结构。 耗散热管包括中空封闭管，柱，一种流体和芯结构。 耗散热管经常用于从芯片传导热量。 散热管可以由特殊的导热材料制成，包括具有高导热性的金属和碳元素的支架结构，从而提高导热效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的支架结构可以涂在金属表面上，也可以混入金属中。
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