公开(公告)号：US20090115664A1

公开(公告)日：2009-05-07

申请号：US12153738

申请日：2008-05-23

Applicant: Shyh-Jong Chung ,  Ching-Wei Ling ,  Yu-Chiang Cheng

Inventor： Shyh-Jong Chung ,  Ching-Wei Ling ,  Yu-Chiang Cheng

IPC: H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q5/371

Abstract: Disclosed is a planar inverted-F antenna with an extended grounding plane. The planar inverted-F antenna has a grounding metal plate having a selected side edge on which the extended grounding plane is formed and has a predetermined height. At least one antenna signal radiating plate is connected to the grounding metal plate by a short-circuit piece and is substantially parallel to and spaced from the grounding metal plate by a distance. A feeding point extends from the antenna signal radiating plate in a direction toward the grounding metal plate and corresponds to the extended grounding plane with a predetermined gap therebetween. With the arrangement of the extended grounding plane, the impedance matching of the antenna is improved and the impedance bandwidth of the antenna is increased.

Abstract translation: 公开了具有扩展接地平面的平面倒F天线。 平面倒F天线具有接地金属板，所述接地金属板具有选定的侧边缘，所述扩展接地平面形成在该边缘上并具有预定高度。 至少一个天线信号辐射板通过短路片连接到接地金属板，并且与接地金属板基本上平行并间隔一定距离。 馈电点从天线信号辐射板沿着接地金属板的方向延伸，并且对应于延伸的接地平面，其间具有预定的间隙。 随着扩展接地平面的布置，天线的阻抗匹配得到改善，天线的阻抗带宽增加。

公开(公告)号：US07504148B2

公开(公告)日：2009-03-17

申请号：US11307854

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: B32B3/00 ,  H05K1/09

CPC classification number: H05K3/28 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/05 ,  H05K2201/0179 ,  H05K2201/0323 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/30

Abstract: This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a surface of the metal and also can be mixed into the metal.

Abstract translation: 本发明公开了一种印刷电路板的制造方法和结构。 印刷电路板通常用于支持电路中的电子元件并从电子元件传导热量。 印刷电路板结构包括层叠结构。 层叠结构包括导电层和绝缘层。 导电层可以由特殊的导热材料制成，包括金属和碳元素的支架结构。 绝缘层也可以由导热材料制成，结合碳元素的支架结构。 碳元素的支架结构具有高导热性，从而提高导热效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的支架结构可以涂覆在金属的表面上，并且也可以混入金属中。

公开(公告)号：USRE40068E1

公开(公告)日：2008-02-19

申请号：US10888966

申请日：2004-07-09

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H05K1/03

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K1/0366 ,  H05K3/4688 ,  H05K2201/0145 ,  H05K2201/0191 ,  H05K2201/09327

Abstract: A multi-layer circuit board includes first, second, third, fourth, fifth, sixth and seventh insulating substrates; first, second, third, fourth and fifth signal wiring layers; first and second ground wiring layers; and a power wiring layer. Each of the first and seventh insulating substrates has a thickness ranging from 2.5 to 6.5 mil. Each of the second, fourth and sixth insulating substrates has a thickness ranging from 3 to 9 mil. Each of the third and fifth insulating substrates has a thickness ranging from 3 to 23 mil. The first signal wiring layer has a first resistance with respect to the first ground wiring layer. The second signal wiring layer has a second resistance with respect to the first ground wiring layer and the power wiring layer. The third signal wiring layer has a third resistance with respect to the first ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the second ground wiring layer and the power wiring layer. The fifth signal wiring layer has a fifth resistance with respect to the second ground wiring layer. The first, second, third, fourth and fifth resistances are within the range of 49.5 to 60.5 ohms.

Abstract translation: 多层电路板包括第一，第二，第三，第四，第五，第六和第七绝缘基板; 第一，第二，第三，第四和第五信号布线层; 第一和第二接地布线层; 和电力布线层。 第一和第七绝缘基板中的每一个具有2.5至6.5密耳的厚度。 第二，第四和第六绝缘基板中的每一个具有3至9密耳的厚度。 第三和第五绝缘基板中的每一个具有3至23密耳的厚度。 第一信号布线层相对于第一接地布线层具有第一电阻。 第二信号布线层相对于第一接地布线层和电源布线层具有第二电阻。 第三信号布线层相对于第一接地布线层和电源布线层具有第三电阻。 第四信号布线层相对于第二接地布线层和电源布线层具有第四电阻。 第五信号布线层相对于第二接地布线层具有第五电阻。 第一，第二，第三，第四和第五电阻在49.5至60.5欧姆的范围内。

公开(公告)号：US20080018551A1

公开(公告)日：2008-01-24

申请号：US11878667

申请日：2007-07-26

Applicant: Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

Inventor： Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

IPC: H01Q1/40

CPC classification number: H01Q1/2266 ,  G06F1/1616 ,  G06F1/1698 ,  H01Q9/0407

Abstract: Disclosed is an antenna device for transceiving a wireless signal with an insert-molded antenna pattern embedded inside a casing of an electronic device. The insert-molded antenna pattern is connected to an antenna module of a motherboard of the electronic device in order to feed the wireless signal transceived by the insert-molded antenna pattern through an antenna signal feeding line connected to the insert-molded antenna pattern and the antenna module, or by an antenna coupling element coupled with the insert-molded antenna pattern.

Abstract translation: 公开了一种用于收发无线信号的天线装置，嵌入式天线图案嵌入电子设备的外壳内。 插入成型的天线图案连接到电子设备的母板的天线模块，以便通过插入成型天线图案收发的无线信号通过连接到插入成型的天线图案的天线信号馈送线路馈送， 天线模块，或通过与插入成型的天线图案耦合的天线耦合元件。

公开(公告)号：US20070199677A1

公开(公告)日：2007-08-30

申请号：US11307834

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: H05K7/20

CPC classification number: H01L23/373 ,  H01L21/4871 ,  H01L23/3672 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This invention discloses a manufacturing method and the structure for a heat sink fin. This heat sink fin structure includes an attachment and a plurality of heat sink fins. The plurality of heat sink fins is often used in conducting the waste heat from a chip. The plurality of heat sink fins and the attachment can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a metal surface and can be mixed into the metal.

Abstract translation: 本发明公开了散热片的制造方法和结构。 该散热鳍片结构包括附件和多个散热片。 多个散热片通常用于从芯片进行废热。 多个散热鳍片和附件可以由特殊的导热材料制成，包括具有高导热性的金属和碳元素的支架结构，从而提高热传导效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的托架结构可以涂覆在金属表面上，并可以混入金属中。

公开(公告)号：US20060071840A1

公开(公告)日：2006-04-06

申请号：US11149795

申请日：2005-06-09

Applicant: Yu-Chiang Cheng ,  Kuo-Ming Chuang

Inventor： Yu-Chiang Cheng ,  Kuo-Ming Chuang

IPC: H03M1/12

CPC classification number: H05K1/024 ,  H01P3/085 ,  H05K2201/0191 ,  H05K2201/0715

Abstract: A circuit structure for modifying characteristic impedance by using different reference planes is provided. The structure comprises an analog signal line, a digital signal line, a reference plane for analog signals and a reference plane for digital signals. Wherein, the line width of the analog signal line is the same as that of the digital signal line. In addition, the distance between the analog signal line and the analog signal reference plane is longer than the distance between the digital signal line and the digital signal reference plane. Accordingly, the characteristic impedance mismatch during signal transmission can be solved and the quality of signal transmission can be improved.

Abstract translation: 提供了通过使用不同的参考平面来修改特性阻抗的电路结构。 该结构包括模拟信号线，数字信号线，用于模拟信号的参考平面和用于数字信号的参考平面。 其中，模拟信号线的线宽与数字信号线的线宽相同。 此外，模拟信号线和模拟信号参考平面之间的距离长于数字信号线与数字信号参考平面之间的距离。 因此，可以解决信号传输期间的特征阻抗失配，并且可以提高信号传输的质量。

公开(公告)号：US06922049B2

公开(公告)日：2005-07-26

申请号：US10358879

申请日：2003-02-04

Applicant: Yu-Chiang Cheng ,  Hsueh-Chin Liao

Inventor： Yu-Chiang Cheng ,  Hsueh-Chin Liao

IPC: G01R31/28 ,  H05K1/02 ,  G01R1/04 ,  G01R31/26

CPC classification number: G01R31/2815 ,  H05K1/0268 ,  H05K2201/09236

Abstract: A testing method is provided for a printed circuit board that includes a board body formed with first and second conductive traces thereon. The first and second conductive traces are configured for transmitting a high-frequency differential signal and have segments parallel to each other. Each of the segments has an inner edge proximate to the segment of the other of the first and second conductive traces, and an outer edge distal from the segment of the other of the first and second conductive traces. Each of a pair of conductive pads formed on the printed circuit board is disposed proximate to and is connected electrically to the outer edge of the segment of a respective one of the first and second conductive traces.

Abstract translation: 提供了一种用于印刷电路板的测试方法，该印刷电路板包括在其上形成有第一和第二导电迹线的板体。 第一和第二导电迹线被配置用于发送高频差分信号并且具有彼此平行的段。 每个段具有靠近第一和第二导电迹线中的另一个的段的内边缘以及远离第一和第二导电迹线中另一个的段的外边缘。 形成在印刷电路板上的一对导电焊盘中的每一个设置成靠近并且与第一和第二导电迹线中的相应一个的段的外边缘电连接。

公开(公告)号：US06489570B2

公开(公告)日：2002-12-03

申请号：US09800215

申请日：2001-03-06

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H05K103

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K3/4688 ,  H05K2201/0191

Abstract: A multi-layer circuit board includes first, second, third, fourth, fifth, sixth and seventh insulating substrates disposed sequentially one above the other; first, second, third and fourth signal wiring layers; first, second and third ground wiring layers; and a power wiring layer. Each of the first and seventh insulating substrates has a thickness ranging from 2.5 to 7.5 mil. Each of the second and sixth insulating substrates has a thickness ranging from 3 to 13 mil. Each of the third and fifth insulating substrates has a thickness ranging from 3 to 15 mil. The fourth insulating substrate has a thickness ranging from 2 to 6 mil. The first signal wiring layer has a first resistance with respect to the first ground wiring layer. The second signal wiring layer has a second resistance with respect to the first and second ground wiring layers. The third signal wiring layer has a third resistance with respect to the third ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the third ground wiring layer. The first, second, third and fourth resistances are within the range of 49.5 to 60.5 ohms.

Abstract translation: 多层电路板包括依次一个上下设置的第一，第二，第三，第四，第五，第六和第七绝缘衬底; 第一，第二，第三和第四信号布线层; 第一，第二和第三接地布线层; 和电力布线层。 第一和第七绝缘基板中的每一个的厚度范围为2.5至7.5密耳。 第二和第六绝缘基板中的每一个具有3至13密耳的厚度。 第三和第五绝缘基板中的每一个具有3至15密耳的厚度。 第四绝缘基板具有2至6密耳的厚度。 第一信号布线层相对于第一接地布线层具有第一电阻。 第二信号布线层相对于第一和第二接地布线层具有第二电阻。 第三信号布线层相对于第三接地布线层和电源布线层具有第三电阻。 第四信号布线层相对于第三接地布线层具有第四电阻。 第一，第二，第三和第四电阻在49.5至60.5欧姆的范围内。

公开(公告)号：US06326557B1

公开(公告)日：2001-12-04

申请号：US09799900

申请日：2001-03-06

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H05K103

CPC classification number: H05K1/024 ,  H05K1/0216 ,  H05K1/0298 ,  H05K1/0366 ,  H05K3/4611 ,  H05K2201/0145 ,  H05K2201/0191 ,  H05K2201/0352 ,  H05K2201/09327

Abstract: A multi-layer circuit board includes first, second, third, fourth and fifth insulating substrates, first, second, third and fourth wiring layers, a ground wiring layer and a power wiring layer. The insulating substrates and the wiring layers are press-bonded to each other to form the circuit board with a thickness of about 1.6 mm. Each of the first and fifth insulating substrates has a thickness of 5.7±0.285 mil. Each of the second and fourth insulating substrates has a thickness of 8±0.4 mil. The third insulating substrate has a thickness of 24.6±1.23 mil. The first signal wiring layer has a first resistance with respect to the ground wiring layer. The second signal wiring layer has a second resistance with respect to the ground wiring layer and the power wiring layer. The third signal wiring layer has a third resistance with respect to the ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the power wiring layer. The first, second, third and fourth resistances are within the range of 49.5 to 60.5 ohms.

Abstract translation: 多层电路板包括第一，第二，第三，第四和第五绝缘基板，第一，第二，第三和第四布线层，接地布线层和电力布线层。 绝缘基板和布线层彼此压接，形成约1.6mm厚度的电路板。 第一和第五绝缘基板中的每一个具有5.7±0.285密耳的厚度。 第二绝缘基板和第四绝缘基板中的每一个具有8±0.4密耳的厚度。 第三绝缘基板的厚度为24.6±123密耳。 第一信号布线层相对于接地布线层具有第一电阻。 第二信号布线层相对于接地布线层和电力布线层具有第二电阻。 第三信号布线层相对于接地布线层和电源布线层具有第三电阻。 第四信号布线层相对于电力布线层具有第四电阻。 第一，第二，第三和第四电阻在49.5至60.5欧姆的范围内。

公开(公告)号：US08013799B2

公开(公告)日：2011-09-06

申请号：US12213606

申请日：2008-06-23

Applicant: Shyh-Jong Chung ,  Yu-Hsin Wang ,  Yu-Chiang Cheng

Inventor： Shyh-Jong Chung ,  Yu-Hsin Wang ,  Yu-Chiang Cheng

IPC: H01Q9/04

CPC classification number: H01Q9/40 ,  H01Q5/364 ,  H01Q9/30

Abstract: Disclosed is a dual-band monopole antenna with antenna signal fed through a short-circuit terminal of a transmission line load. The dual-band monopole antenna includes an antenna extension section and a transmission line load. The antenna extension section has a top terminal and a transmission line connection terminal. The transmission line connection terminal is connected to the transmission line load. The transmission line load includes a core transmission line, an outer circumferential conductor, and a dielectric layer. The core transmission line has an extension section connection terminal and a signal feeding terminal. The extension section connection terminal is connected to the transmission line connection terminal of the antenna extension section. The outer circumferential conductor circumferentially surrounds and is spaced from the core transmission line by a given distance and the outer circumferential conductor has an open terminal and a short-circuit terminal.

Abstract translation: 公开了一种双频单极天线，其天线信号通过传输线负载的短路端子馈送。 双频单极天线包括天线延伸部分和传输线路负载。 天线延伸部具有顶端子和传输线连接端子。 传输线连接端子连接到传输线负载。 传输线负载包括芯传输线，外周导体和电介质层。 核心传输线具有延伸部分连接端子和信号馈送端子。 延伸部连接端子连接到天线延伸部分的传输线连接端子。 外周导体周向地包围并与芯传输线隔开一定距离，外周导体具有开路端子和短路端子。