公开(公告)号：US20240150545A1

公开(公告)日：2024-05-09

申请号：US18501566

申请日：2023-11-03

Applicant: MONDO S.p.A.

Inventor： Irma NEDI ,  Andrea MARENGHI ,  Maurizio STROPPIANA

IPC: C08K3/26 ,  C08L7/00 ,  C08L9/06 ,  C09C1/02 ,  C09C3/04 ,  E04F15/10

CPC classification number: C08K3/26 ,  C08L7/00 ,  C08L9/06 ,  C09C1/021 ,  C09C3/041 ,  E04F15/10 ,  C01P2002/72 ,  C01P2002/88 ,  C01P2004/61 ,  C08K2003/265 ,  C08K2201/005

Abstract: A floor covering material comprising at least one elastomer, and a biogenic reinforcing filler including calcium carbonate particles in the form of aragonite.

公开(公告)号：US11976176B2

公开(公告)日：2024-05-07

申请号：US17267201

申请日：2019-07-25

Applicant: BRÜCKNER MASCHINENBAU GmbH

Inventor： Jan Barth ,  Roland Lund

IPC: C08J5/18 ,  B32B38/00 ,  C08K3/26 ,  C08L23/12 ,  B32B27/32

CPC classification number: C08K3/26 ,  C08J5/18 ,  C08L23/12 ,  B32B27/327 ,  B32B2038/0028 ,  B32B2323/00 ,  C08J2323/12 ,  C08J2491/06 ,  C08K2003/265 ,  C08K2201/005 ,  C08L2203/16

Abstract: A method for producing a film including at least 20 wt % thermoplastic polymer and 50 to 75 wt % inorganic filler, and including the steps of: providing the mixture, melting the mixture, producing a thin layer from the mixture, cooling the thin layer, producing a film, stretching the film in the longitudinal direction and in the transverse direction, wherein the particle size of the inorganic filler is at most 5 μm and the stretch ratio in the longitudinal direction and in the transverse direction is at least 3.5. The disclosure further relates to films produced by the method and to the use thereof.

公开(公告)号：US20240145126A1

公开(公告)日：2024-05-02

申请号：US18496296

申请日：2023-10-27

Applicant: DelStar Technologies, Inc.

Inventor： Rebecca Wilson ,  Geoffrey Henstock

IPC: H01B7/288 ,  C08K3/04

CPC classification number: H01B7/288 ,  C08K3/04 ,  C08K2201/001 ,  C08K2201/005

Abstract: A water swellable semi-conductive material comprising a semi-conductive layer and a semi-conductive water swellable polymeric layer which is positioned of the semi-conductive layer is provided. The semi-conductive water swellable polymeric layer is comprised of conductive particles dispersed within a crosslinked superabsorbent polymeric matrix. The material can be formed into a tape or other structure used to insulate and protect cables. The water swellable semi-conductive material can be applied to a cable or other conductive material to insulate and protect the cable from water ingress.

公开(公告)号：US20240141222A1

公开(公告)日：2024-05-02

申请号：US18280824

申请日：2021-03-10

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Yuuki HOSHIYAMA ,  Kento TSUCHIYA ,  Nobuhiko INUI

IPC: C09K5/14 ,  C08K7/18 ,  H01L23/373

CPC classification number: C09K5/14 ,  C08K7/18 ,  H01L23/3733 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/014 ,  C08K2201/016

Abstract: The heat-conducting resin sheet according to an aspect of the present invention comprises a thermally conductive plate-shaped particle, a thermally conductive spherical particle, and a resin, wherein the heat-conducting resin sheet has a thermal conductivity of 5 W/m·K or more and a 30% compressive strength B of 1500 kPa or less as measured at a compression rate of 1.0 mm/min. Furthermore, a volume ratio of the thermally conductive plate-shaped particle to the thermally conductive spherical particle (volume of thermally conductive plate-shaped particle/volume of thermally conductive spherical particle) is 30/70 to 90/10, and the total volume of the thermally conductive plate-shaped particle and the thermally conductive spherical particle is 30 to 90% by volume. According to the present invention, there can be provided a heat-conducting resin sheet that is excellent in the thermal conductivity and flexibility and can suppress the increase in the stress even when compressed quickly.

公开(公告)号：US20240141139A1

公开(公告)日：2024-05-02

申请号：US18370022

申请日：2023-09-19

Applicant: Sharp Display Technology Corporation

Inventor： Hisashi WATANABE ,  Hirotoshi YASUNAGA

IPC: C08K9/00

CPC classification number: C08K9/00 ,  C08K2201/005

Abstract: Provided is a display device that makes a desired pattern or the like visible in the non-display state and is capable of displaying a display image without allowing perception of the complementary color of the color of the pattern or the like. The display device includes: a dot matrix display panel; and a design layer disposed in front of a front surface side of the display panel. The design layer includes a design part that includes a binder resin and light-reflective colored particles dispersed in the binder resin. The light-reflective colored particles reflect light having a specific wavelength while absorbing light having a wavelength other than the specific wavelength.

公开(公告)号：US20240141116A1

公开(公告)日：2024-05-02

申请号：US18257766

申请日：2021-12-14

Applicant: INEOS STYROLUTION GROUP GMBH

Inventor： Felix KLAUCK ,  Pierre JUAN ,  Norbert NIESSNER ,  Jonathan LIMBECK ,  Eike JAHNKE

IPC: C08J5/04 ,  C08J5/24 ,  C08K3/26 ,  C08K7/14 ,  C08K7/28 ,  C08L23/16 ,  C08L51/06

CPC classification number: C08J5/043 ,  C08J5/244 ,  C08K3/26 ,  C08K7/14 ,  C08K7/28 ,  C08L23/16 ,  C08L51/06 ,  C08J2323/16 ,  C08J2351/06 ,  C08K2003/265 ,  C08K2201/005 ,  C08L2203/16 ,  C08L2203/30

Abstract: The invention relates to a process for producing a fiber-reinforced composite material (organosheet) containing at least one thermoplastic molding compound, at least one continuous reinforcing fiber layer and at least one inorganic filler material. According to the invention, at least one sheet material consisting of continuous reinforcing fibers is embedded in a matrix composition comprising at least one thermoplastic molding compound, the thermoplastic molding compound including at least one thermoplastic polymer and optionally at least one polarity-functionalized polymer that contains repeat units of at least one functional monomer. The invention also relates to the composite materials produced according to the claimed method.

公开(公告)号：US20240136482A1

公开(公告)日：2024-04-25

申请号：US18492977

申请日：2023-10-23

Applicant: Lextar Electronics Corporation

Inventor： Deng Kong SOH ,  Wen Wan TAI ,  Yu-Chun LEE

IPC: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C09K11/02 ,  H01L33/58

CPC classification number: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C09K11/025 ,  H01L33/58 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2201/005 ,  C08K2201/011

Abstract: A composite encapsulation material is provided, which includes (A) a polymer glue material and (B) a viscosity modifier. The viscosity modifier (B) has a functional group capable of forming non-covalent interaction with the polymer glue material (A). At room temperature, the ratio (log(η0)/log(η28 )) of the logarithm of the viscosity ((log(η0)) of the composite encapsulation material at the shear rate of 1×10−3 s−1 to the logarithm of the viscosity (log(η∞)) of the composite encapsulation material at the shear rate of 1×102 s−1 is 1.1-2.5.

公开(公告)号：US20240124697A1

公开(公告)日：2024-04-18

申请号：US18287068

申请日：2022-03-24

Applicant: DENKA COMPANY LIMITED

Inventor： Eri KAMIMAKI ,  Daisuke MOTOI ,  Hirotaka KOBAYASHI

IPC: C08L25/06 ,  B29C45/00 ,  C08K3/26 ,  C08K11/00

CPC classification number: C08L25/06 ,  B29C45/0001 ,  C08K3/26 ,  C08K11/00 ,  B29K2025/06 ,  C08K2003/265 ,  C08K2201/005 ,  C08L2205/025 ,  C08L2207/04

Abstract: A resin composition has a low styrene-based resin content and that has little impact on the environment, wherein the resin composition has good moldability and yields molded articles having excellent tensile moduli and tensile elongations at break; and a molded article composed of the resin composition. The resin composition contains an inorganic filler containing calcium carbonate and a styrene-based resin containing a diene component, wherein the inorganic filler content is 50 mass % or more relative to the overall mass of the resin composition, and as measured in accordance with ASTM-D638, the tensile modulus is 1,000-3,000 MPa, and the tensile elongation at break is 5% or higher.

公开(公告)号：US20240117170A1

公开(公告)日：2024-04-11

申请号：US17768969

申请日：2020-10-12

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Chen WAN ,  Stephen TAYLOR ,  Bing ZHOU ,  Jeffrey ESHENAUR ,  Robert Russell GALLUCCI ,  Jianhua XU

IPC: C08L25/12 ,  B29C45/00 ,  C08K3/22 ,  C23C18/16

CPC classification number: C08L25/12 ,  B29C45/0001 ,  C08K3/22 ,  C23C18/16 ,  C08K2003/2206 ,  C08K2003/222 ,  C08K2003/2296 ,  C08K2201/005 ,  C08K2201/012 ,  C08L2205/035 ,  C08L2207/53

Abstract: A composition for electroless plating comprises: from 9 to 29 weight percent, 9.7 to 29 weight percent, or 10 to 29 weight percent, of a first graft rubber copolymer which comprises the polymerized form of at least one conjugated diene monomer and at least one monovinyl aromatic monomer, from 70 to 90 weight percent, preferably 70-89.7 weight percent, more preferably 70 to 85 weight percent, of ungrafted styrenic polymer, from 0.1 to 10 weight percent of a core/shell diene-based rubber having particle size of 100 to 500 nanometers (nm), one or more of a stabilizer and/or antioxidant in total amount of from 0.1 to 5 weight percent, a fatty acid or a salt of fatty acid in an amount of from 0.1 to 2 weight percent, 0 to 5 weight percent of a mold release agent, 0 to 1 weight percent of a metal oxide, 0 to 3 weight percent of a lubricant, and 0 to 20 weight percent of polycarbonate wherein weight percent and ppm are based on total weight of the composition. The composition can be formed into an article having a metal coating electroless plated on the composition.

公开(公告)号：US20240110066A1

公开(公告)日：2024-04-04

申请号：US18541191

申请日：2023-12-15

Applicant: Continental Carbon Co.

Inventor： Lashan Madusha Hendavitharanage De Silva ,  Raymond Soufiani ,  Eduardo Vega, JR. ,  Angel Jose Marcucci ,  Michael Brendan Rodgers

IPC: C09C1/56 ,  C08K9/04 ,  C08L9/06 ,  C09C3/08

CPC classification number: C09C1/565 ,  C08K9/04 ,  C08L9/06 ,  C09C3/08 ,  C08K2201/005 ,  C08K2201/006 ,  C08L2205/02

Abstract: A method of producing a surface modified low hysteresis carbon black or a refined surface modified low hysteresis carbon black compound includes treating a surface of a low hysteresis carbon black with about 0.1% weight by volume to about 50% weight by volume of surface modifying agent in a solvent, and heat treating the surface of the low hysteresis carbon black following the treatment of the surface with the surface modifying agent to form a surface modified low hysteresis carbon black compound, wherein the surface modifier includes at least one amine group and at least one thiol group and/or di- and/or polysulfidic linkage.