公开(公告)号：US20240336542A1

公开(公告)日：2024-10-10

申请号：US18624628

申请日：2024-04-02

Applicant: Lextar Electronics Corporation

Inventor： Yung Chuan CHUANG ,  Wen Wan TAI ,  Yu-Chun LEE

IPC: C07B59/00 ,  C08L63/00 ,  C08L83/08 ,  H01L25/075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62

CPC classification number: C07B59/004 ,  C07B59/001 ,  C08L63/00 ,  C08L83/08 ,  H01L25/0753 ,  H01L33/502 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  C07B2200/05

Abstract: An isotopic polymer includes a silicone resin, an aromatic polymer, a modified silicone resin, a halogenated polysilane, an epoxy resin, or a combination thereof, wherein at least part of 12C, 1H and/or 16O in the isotopic polymer is replaced with 14C, 3H and/or 15O. The decaying age of the isotopic polymer is less than 50,000 years.

公开(公告)号：US20240234653A9

公开(公告)日：2024-07-11

申请号：US18492977

申请日：2023-10-24

Applicant: Lextar Electronics Corporation

Inventor： Deng Kong SOH ,  Wen Wan TAI ,  Yu-Chun LEE

IPC: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C09K11/02 ,  H01L33/58

CPC classification number: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C09K11/025 ,  H01L33/58 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2201/005 ,  C08K2201/011

Abstract: A composite encapsulation material is provided, which includes (A) a polymer glue material and (B) a viscosity modifier. The viscosity modifier (B) has a functional group capable of forming non-covalent interaction with the polymer glue material (A). At room temperature, the ratio (log(η0)/log(η28 )) of the logarithm of the viscosity ((log(η0)) of the composite encapsulation material at the shear rate of 1×10−3 s−1 to the logarithm of the viscosity (log(η∞)) of the composite encapsulation material at the shear rate of 1×102 s−1 is 1.1-2.5.

公开(公告)号：US20240136482A1

公开(公告)日：2024-04-25

申请号：US18492977

申请日：2023-10-23

Applicant: Lextar Electronics Corporation

Inventor： Deng Kong SOH ,  Wen Wan TAI ,  Yu-Chun LEE

IPC: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C09K11/02 ,  H01L33/58

CPC classification number: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C09K11/025 ,  H01L33/58 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2201/005 ,  C08K2201/011

Abstract: A composite encapsulation material is provided, which includes (A) a polymer glue material and (B) a viscosity modifier. The viscosity modifier (B) has a functional group capable of forming non-covalent interaction with the polymer glue material (A). At room temperature, the ratio (log(η0)/log(η28 )) of the logarithm of the viscosity ((log(η0)) of the composite encapsulation material at the shear rate of 1×10−3 s−1 to the logarithm of the viscosity (log(η∞)) of the composite encapsulation material at the shear rate of 1×102 s−1 is 1.1-2.5.