公开(公告)号：US20120141759A1

公开(公告)日：2012-06-07

申请号：US12961562

申请日：2010-12-07

Applicant: Salah Boussaad ,  Gloria T. Worrell

Inventor： Salah Boussaad ,  Gloria T. Worrell

IPC: B32B27/08 ,  B32B27/38 ,  C08K3/04 ,  C08L1/14 ,  C08L1/10 ,  C08L1/26 ,  C08L1/12 ,  B32B27/00 ,  C08L1/00

CPC classification number: C09D101/12 ,  C08J5/18 ,  C08J2379/08 ,  C08J2401/02 ,  C08J2433/20 ,  C08K3/013 ,  C08K3/04 ,  C08L1/10 ,  C08L1/12 ,  C08L1/14 ,  C08L79/08 ,  C09J7/25 ,  C09J2201/61 ,  C09J2205/106 ,  C09J2479/08 ,  C09J2479/086 ,  Y10T428/24942 ,  Y10T428/249953 ,  Y10T428/249993 ,  Y10T428/28 ,  Y10T428/287 ,  Y10T428/2874 ,  Y10T428/2891

Abstract: The present disclosure relates generally to filled polyimides that can be used in films and articles comprising the films. The films are useful in coverlay applications and have advantageous optical properties. The present disclosure also relates to blends of polyimide precursor, polyacrylonitrile, and cellulosic polymer which can be used to obtain the filled polyimides.

Abstract translation: 本公开一般涉及可用于包含膜的膜和制品中的填充聚酰亚胺。 这些膜在覆盖物应用中是有用的并且具有有利的光学性质。 本公开还涉及可用于获得填充的聚酰亚胺的聚酰亚胺前体，聚丙烯腈和纤维素聚合物的共混物。

公开(公告)号：US08183306B2

公开(公告)日：2012-05-22

申请号：US12318099

申请日：2008-12-22

Applicant: Yoshiaki Kohro ,  Hisaki Tanaka ,  Keisuke Torii ,  Toshiyuki Nakatsuka ,  Mikito Deguchi

Inventor： Yoshiaki Kohro ,  Hisaki Tanaka ,  Keisuke Torii ,  Toshiyuki Nakatsuka ,  Mikito Deguchi

IPC: A61K6/08

CPC classification number: C09J143/02 ,  A61K6/083 ,  A61K6/087 ,  C09J2201/61 ,  C08L33/00 ,  C08L63/00

Abstract: The present invention provides a dental self-adhesive resin cement having clinically-acceptable adherability for various adherends without pre-treatment with primers. Specifically, there is provided the dental self-adhesive composite resin cement comprising: (a) a radical polymerizable monomer, (b) a polymerizable monomer having a phosphonic acid group and/or a phosphoric acid ester group, (c) a polymerizable monomer having a dibasic acid carboxyl group, (d) a filler, and (e) a polymerization catalyst.

Abstract translation: 本发明提供了一种具有临床上可接受的粘附性的牙科自粘性树脂粘合剂，而不用引物进行预处理。 具体地说，提供了一种牙科用自粘合复合树脂胶泥，其包含：（a）自由基聚合性单体，（b）具有膦酸基和/或磷酸酯基的聚合性单体，（c） 二元酸羧基，（d）填料和（e）聚合催化剂。

公开(公告)号：US20120121878A1

公开(公告)日：2012-05-17

申请号：US13297380

申请日：2011-11-16

Applicant: Eugen Bilcai ,  Emilie Barriau ,  Martin Renkel ,  Sven Wucherpfennig

Inventor： Eugen Bilcai ,  Emilie Barriau ,  Martin Renkel ,  Sven Wucherpfennig

IPC: B32B3/00

CPC classification number: C08L63/00 ,  C08L33/06 ,  C08L75/04 ,  C09J7/10 ,  C09J163/00 ,  C09J2201/61 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2475/00 ,  Y10T428/287 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Abstract translation: 一种带状或薄膜形式的可热固化的粘合剂，其厚度为0.1-5mm，含有：a）至少一种反应性环氧预聚物，b）至少一种用于环氧树脂的潜在硬化剂，和c）一种或多种弹性体 选自：c1）热塑性聚氨酯，c2）热塑性异氰酸酯，和c3）具有热塑性聚合物嵌段的嵌段共聚物。 还可以含有其它成分，例如发泡剂。 在22℃下未固化状态的粘合剂是可弯曲的或可封装的，并且可以在撕裂之前延伸至少100％。 它可以放在箔上。 它可以用于例如平面，管状或圆柱形部件的粘合，优选由金属，木材，陶瓷或铁氧体制成的部件。

公开(公告)号：US08178420B2

公开(公告)日：2012-05-15

申请号：US12636869

申请日：2009-12-14

Applicant: Takeshi Matsumura ,  Masaki Mizutani

Inventor： Takeshi Matsumura ,  Masaki Mizutani

IPC: H01L21/00

CPC classification number: H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/218 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

Abstract translation: 一种在支撑基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割/芯片接合膜，其中， 粘合剂层（2）与芯片粘合层（3）之间的界面在与芯片粘合层（3）中的工件附着区域（3a）相对应的界面（A）之间是不同的， 以及对应于另一区域（3b）的一部分或全部的界面（B），并且界面（A）的释放性高于界面（B）的剥离性。 切割/芯片接合膜在切割工件的保持性和脱模性之间的平衡优异，并且与芯片粘合层一起释放切割的切片工作。

公开(公告)号：US20120010122A1

公开(公告)日：2012-01-12

申请号：US13238473

申请日：2011-09-21

Applicant: Calum MACBEATH ,  Italo CORZANI ,  Lamia Delphine MIMASSI

Inventor： Calum MACBEATH ,  Italo CORZANI ,  Lamia Delphine MIMASSI

IPC: A61L9/01

CPC classification number: C09J131/04 ,  C08K5/0008 ,  C08K2201/007 ,  C08L23/02 ,  C08L23/0846 ,  C08L23/0853 ,  C08L93/02 ,  C08L2205/025 ,  C08L2666/26 ,  C09J2201/61 ,  C11B9/0061 ,  Y10S428/905 ,  C08L23/08 ,  C08L2666/06

Abstract: A polymeric composition comprising a copolymer of ethylene with at least another monomer comprising at least a heteroatom, a tackifier, less than 10% of a compatible plasticizer or blend of plasticizers and a volatile material. The compositions are able to deliver effectively the volatile material incorporated for a long time and also have good adhesion properties on most substrates.

Abstract translation: 一种聚合物组合物，其包含乙烯与至少另一种包含至少杂原子的单体的共聚物，增粘剂，小于10％的相容增塑剂或增塑剂和挥发性物质的共混物。 组合物能够有效地输送长时间掺入的挥发性物质，并且在大多数基材上也具有良好的粘合性能。

公开(公告)号：US08062458B2

公开(公告)日：2011-11-22

申请号：US12374805

申请日：2007-06-29

Applicant: Marc Husemann ,  Frank Hannemann

Inventor： Marc Husemann ,  Frank Hannemann

IPC: B29C65/52 ,  B32B37/14 ,  B32B38/04

CPC classification number: B32B7/12 ,  B26F1/40 ,  B32B27/08 ,  C09J7/35 ,  C09J7/401 ,  C09J7/403 ,  C09J7/405 ,  C09J2201/61 ,  C09J2423/005 ,  C09J2423/006 ,  C09J2433/006 ,  C09J2467/006 ,  C09J2475/006 ,  C09J2477/006 ,  C09J2479/086 ,  Y10T156/1057 ,  Y10T156/1064 ,  Y10T156/1075 ,  Y10T156/1082 ,  Y10T156/1084 ,  Y10T156/1085

Abstract: Method for producing diecuts from heat-activatable adhesive films which comprises applying a layer of heat-activatable adhesive material to a carrier material having a glass transition temperature at least 20° C. lower that that of the adhesive, laminating the heat-activatable layer onto a release liner at a temperature between the glass transition temperature of the release liner and heat activatable adhesive and then diecutting the heat-activatable adhesive layer on the release liner.

Abstract translation: 用于从可热激活的粘合剂膜制造模具的方法，其包括将一层可热激活的粘合剂材料施加到玻璃化转变温度至少为20℃的载体材料上，使粘合剂的粘合剂层压到 释放衬垫，其在脱模衬垫的玻璃化转变温度和可热活化的粘合剂之间的温度下，然后在剥离衬垫上切割可热激活的粘合剂层。

公开(公告)号：US07790258B2

公开(公告)日：2010-09-07

申请号：US10584226

申请日：2004-12-16

Applicant: Walter Blum ,  Dirk Wester ,  Volker Wiegmann

Inventor： Walter Blum ,  Dirk Wester ,  Volker Wiegmann

IPC: B32B9/00 ,  B32B7/12 ,  B32B15/04 ,  G11B11/105

CPC classification number: C09J5/08 ,  C09J7/10 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2409/00 ,  C09J2431/00 ,  C09J2433/00 ,  C09J2453/00 ,  Y10S428/906 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2848 ,  Y10T428/2883

Abstract: Self-adhesive, flexible sealing tapes, comprising at least one flexible, self-adhesive core or at least one flexible, self-abhesive carrier layer provided with an envelope or two-sided coating consisting of a second adhesive system.

Abstract translation: 自粘性柔性密封带，包括至少一个柔性的，自粘的芯或至少一个柔性的自粘性载体层，其具有由第二粘合剂体系组成的外壳或双面涂层。

公开(公告)号：US07629044B2

公开(公告)日：2009-12-08

申请号：US10537447

申请日：2003-12-15

Applicant: Yoshio Iwasaki

Inventor： Yoshio Iwasaki

IPC: B65D73/00

CPC classification number: B65D73/0028 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2421/00 ,  C09J2433/00 ,  Y10T428/28

Abstract: It is an object of the present invention to provide a display strip with which the step of attaching a product-enclosed bag is easily automated and a product-enclosed bag is easily bonded again after the bag is once detached. The present invention relates to a display strip for arranging and attaching a plurality of product-enclosed bags for the display, which comprises at least a substrate layer and a sealant layer, the sealant layer being bondable to a surface layer of the bag by thermocompression bonding and having no pressure sensitive adhesive property before the thermocompression bonding, but being bondable to the bag again owing to exposure of a pressure sensitive adhesive face in the case of peeling of the bag bonded by thermocompression bonding.

Abstract translation: 本发明的目的是提供一种显示条，通过该显示条可以容易地自动化附加产品封闭的袋子的步骤，并且在袋子一旦脱离之后再次容易地粘贴产品封闭的袋子。 本发明涉及一种显示条，用于布置和附接多个用于显示器的产品封闭的袋，其至少包括基底层和密封剂层，密封剂层可通过热压粘合与袋的表面层粘合 并且在热压接之前没有压敏粘合性，但是在通过热压接粘合的袋的剥离的情况下由于压敏粘合剂面的暴露而再次粘合到袋上。

公开(公告)号：US20090211705A1

公开(公告)日：2009-08-27

申请号：US12397584

申请日：2009-03-04

Applicant: Holger Tonniessen ,  Steve Hatfield ,  Annie Seiler ,  Rainer Rauberger ,  Ralf Grauel

Inventor： Holger Tonniessen ,  Steve Hatfield ,  Annie Seiler ,  Rainer Rauberger ,  Ralf Grauel

IPC: C09J167/03 ,  B32B37/12 ,  C09J133/08 ,  C09J175/04 ,  C09J127/06 ,  C09J125/06 ,  C09J123/16 ,  C09J169/00

CPC classification number: C09J153/025 ,  C08L2666/02 ,  C09J7/22 ,  C09J153/02 ,  C09J2201/20 ,  C09J2201/28 ,  C09J2201/61 ,  C09J2201/622 ,  C09J2203/334 ,  C09J2400/143 ,  C09J2401/006 ,  C09J2453/00 ,  C09J2493/00 ,  Y02P20/582 ,  Y10T156/10

Abstract: Method of bonding labels to hydrophobic substrates, a pressure-sensitive hotmelt adhesive being applied wholly or partly to the label or to the substrate at an area opposite the label, then bringing label and substrate together and bonding them, characterized in that the pressure-sensitive hotmelt adhesive is water-soluble in alkaline solution and the label is selected from i) water-permeable labels having a water absorbency (Cobb value) of greater than 0.3 g/m2 per 20 sec, ii) perforated labels which on the bonded surfaces have a perforation or cutouts of below 10%. Further described is a label which is coated with a water-soluble pressure-sensitive hotmelt adhesive and which exhibits a high water absorbency and/or, where appropriate, contains perforations or cutouts on the bonded surface.

Abstract translation: 将标签与疏水性基材结合的方法，将压敏热熔粘合剂全部或部分施用于标签或与标签相对的区域施加到基材上，然后将标签和基材粘合在一起并粘合，其特征在于压敏 热熔粘合剂在碱性溶液中是水溶性的，标签选自i）具有大于0.3g / m 2/20秒的吸水性（Cobb值）的透水性标签，ii）在粘合表面上具有的多孔标签 穿孔或切口低于10％。 进一步描述的是涂覆有水溶性压敏热熔粘合剂并且表现出高吸水性的标签和/或适当地在接合表面上包含穿孔或切口。

公开(公告)号：US20090149003A1

公开(公告)日：2009-06-11

申请号：US12370049

申请日：2009-02-12

Applicant: Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

Inventor： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

IPC: H01L21/00

CPC classification number: H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512

Abstract: The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a)

Abstract translation: 本发明涉及一种在基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割芯片接合膜，其中 在剥离角度为15°，剥离移动速度为2.5mm / sec的条件下测定粘合剂层（2）与芯片粘接层（3）的粘合性。 在相对于工件附着区域（3a）的区域（2a）和与其他区域（3b）的一部分或全部对应的区域（2b）在23℃下不同，在芯片接合粘合剂 层（3），并且满足以下关系：粘合剂层（2a）的粘合性<粘合剂层（2b）的粘合性和粘合剂层（2a）对粘合剂层 芯片粘合层（3）不高于2.3N / 25mm。