公开(公告)号：US10021775B1

公开(公告)日：2018-07-10

申请号：US15627399

申请日：2017-06-19

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Meng Shen

IPC: H05K1/00 ,  H05K1/02 ,  H05K7/20 ,  G06F1/20

CPC classification number: H05K1/0203 ,  F04D25/0613 ,  G06F1/20 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/20 ,  G06F2200/201 ,  H05K3/0064 ,  H05K7/20 ,  H05K7/20009 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20545 ,  H05K7/20554 ,  H05K2203/063

Abstract: A circuit board and fan frame connection structure includes a fan frame, a circuit board and an adhesive member having multiple through holes. The fan frame includes a bottom board, a bearing cup disposed at the center of the bottom board and multiple perforations formed through the bottom board. The bottom board has an upper surface and a lower surface. The circuit board is adhered to the lower surface of the bottom board via the adhesive member. The electronic components arranged on the circuit board pass through the aligned through holes and perforations.

公开(公告)号：US10014239B2

公开(公告)日：2018-07-03

申请号：US15607851

申请日：2017-05-30

Applicant: FUJITSU LIMITED

Inventor： Keizou Takemura ,  Jie Wei ,  Mitsutaka Yamada ,  Michimasa Aoki ,  Masumi Suzuki

IPC: H01L23/473 ,  H05K7/20 ,  H05K1/02 ,  G06F1/20

CPC classification number: H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/42 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20509 ,  H05K7/20772

Abstract: An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.

公开(公告)号：US10007298B2

公开(公告)日：2018-06-26

申请号：US15244621

申请日：2016-08-23

Applicant: LENOVO (SINGAPORE) PTE. LTD.

Inventor： Yoshiyuki Shibayama ,  Yuta Tsuganezawa ,  Eiji Shinohara

IPC: G06F1/16 ,  G06F1/20 ,  G06F13/00 ,  H05K7/20

CPC classification number: G06F1/1632 ,  G06F1/1616 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20409 ,  H05K7/2049

Abstract: There is provided a docking station capable of docking and undocking a portable computing device. The docking station includes: an engaging lever engageable with an engaging hole located in a portable computing device; and a docking sensor which detects when the engaging lever is engaged with the engaging hole.

公开(公告)号：US09999157B2

公开(公告)日：2018-06-12

申请号：US15236070

申请日：2016-08-12

Applicant: QUALCOMM Incorporated

Inventor： Victor Chiriac ,  Jorge Rosales ,  Jon Anderson ,  Stephen Molloy

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/367 ,  H01L23/427 ,  H01L21/48

CPC classification number: H05K7/20309 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/0283 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/201 ,  H01L21/4882 ,  H01L23/3675 ,  H01L23/427 ,  H05K7/20318

Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

公开(公告)号：US20180139864A1

公开(公告)日：2018-05-17

申请号：US15869468

申请日：2018-01-12

Applicant: FUJITSU LIMITED

Inventor： Nobuyuki HAYASHI ,  Teru NAKANISHI ,  Takahiro KIMURA

IPC: H05K7/20 ,  F25D17/00

CPC classification number: H05K7/2039 ,  F25D17/00 ,  F28D15/02 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/473 ,  H05K7/20218 ,  H05K7/20772 ,  H05K7/20809

Abstract: A heat transport device includes: a heat receiving member that receives heat; a heat dissipation member that dissipates heat; a coolant circulation path that includes a main flow portion in which coolant flows and split flow portions where part of the main flow portion is split into plural flow paths, and that causes coolant to circulate between the heat receiving member and the heat dissipating member; pumps that are provided to the respective split flow portions; and a bypass flow path that forms a bypass between the respective split flow portions on an outlet side of the pumps and the main flow portion.

公开(公告)号：US20180120912A1

公开(公告)日：2018-05-03

申请号：US15336635

申请日：2016-10-27

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kurt Jenkins ,  Andrew Douglas Delano ,  Lincoln Ghioni ,  Jeffrey Taylor Stellman

IPC: G06F1/20 ,  B33Y80/00 ,  B33Y70/00 ,  B23K26/342 ,  B23P15/26

CPC classification number: G06F1/206 ,  B23K26/342 ,  B23K2101/14 ,  B23P15/26 ,  B23P2700/09 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/046 ,  F28D2020/0013 ,  F28F2255/18 ,  G06F1/203 ,  G06F2200/201 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/427 ,  H01L23/4275 ,  H01L2023/4037 ,  H05K7/20336

Abstract: Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.

公开(公告)号：US20180107256A1

公开(公告)日：2018-04-19

申请号：US15293841

申请日：2016-10-14

Applicant: Dell Products L.P.

Inventor： Kevin W. MUNDT ,  Robert B. CURTIS

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/206 ,  G06F2200/201 ,  H05K7/20809 ,  H05K7/20836

Abstract: In accordance with embodiments of the present disclosure, a system may include an information handling resource and an expansion cold plate thermally coupled to the information handling resource and configured to be fluidically coupled to a refrigeration system and configured to expand a refrigerant within the expansion cold plate in order to cool the information handling resource.

公开(公告)号：US09949411B2

公开(公告)日：2018-04-17

申请号：US15595207

申请日：2017-05-15

Applicant: Elwha LLC

Inventor： Christian L. Belady ,  Douglas M. Carmean ,  William Gates ,  Shaun L. Harris ,  Roderick A. Hyde ,  Muriel Y. Ishikawa ,  Sean M. James ,  Brian A. Janous ,  Jordin T. Kare ,  Jie Liu ,  Max N. Mankin ,  Gregory J. McKnight ,  Craig J. Mundie ,  Nathan P. Myhrvold ,  Tony S. Pan ,  Clarence T. Tegreene ,  Yaroslav A. Urzhumov ,  Charles Whitmer ,  Lowell L. Wood, Jr. ,  Victoria Y. H. Wood

IPC: H01M8/18 ,  H01M8/20 ,  H05K7/20

CPC classification number: H05K7/20763 ,  G06F1/20 ,  G06F1/26 ,  G06F2200/201 ,  H01M8/18 ,  H01M8/186 ,  H01M8/188 ,  H01M8/20 ,  H05K7/20836

Abstract: A power supply system for a data center includes a cooling circuit, an electrochemical power generator, a sensor, and a processor. The cooling circuit includes a fluid configured to receive heat energy generated by a server located in the data center. The electrochemical power generator is configured to receive and/or generate the fluid of the cooling circuit and to generate electrical energy for the server using the fluid. The sensor is configured to obtain data regarding the server. The processor is configured to control an amount of heat energy transferred from the server to the fluid based on the data.

公开(公告)号：US20180101202A1

公开(公告)日：2018-04-12

申请号：US15381131

申请日：2016-12-16

Applicant: EVGA CORPORATION

Inventor： Tai-Sheng Han

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/20154 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20409 ,  H05K7/20436

Abstract: The heat dissipation device is for a display card and includes an air cooling member on a power supply circuit of the display card, a water cooling member on a processing element of the display card, and an auxiliary member disposed to a side of the water cooling member adjacent to the display card. The auxiliary member has at least an opening corresponding to the processing element and an extension piece extended away from the opening corresponding to a memory of the display card. As such, the heat from power supply circuit, the processing element, and the memory is respectively dissipated by the air cooling member, the water cooling member, and the auxiliary member and its extension piece, thereby achieving significantly enhanced heat dissipation performance.

公开(公告)号：US09927181B2

公开(公告)日：2018-03-27

申请号：US13934184

申请日：2013-07-02

Applicant: Rouchon Industries, Inc.

Inventor： Stephen Mounioloux

IPC: F28D1/04 ,  F28D1/053 ,  G06F1/20 ,  H01L23/467 ,  F28D21/00

CPC classification number: F28D1/04 ,  F28D1/05375 ,  F28D2021/0031 ,  F28F2250/08 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated cooling apparatus for actively cooling one or more electronic components in an electronic device such as a computer is provided. The cooling apparatus includes a radiator and a pump integrally mounted on the radiator. The pump can include a pump housing having a first pump housing member attached to the radiator and a second pump housing member detachably securable to the first pump housing member. The apparatus includes a flow inlet and a flow outlet for attaching hoses or conduits to the radiator for actively moving a liquid coolant to and from an external or remote heat exchanger via tubing. An external heat exchanger can be fluidly connected to the integrated cooling apparatus via two or more tubes and thermally attached to the electronic component to be cooled, such as a computer graphics card, microprocessor or other circuit component.